 | | XMC4800F144K1536AAXQMA1 | Infineon Technologies | IC MCU 32BIT 1.5MB FLASH 144LQFP | Microcontrollers | PG-LQFP-144-24 | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-M4 Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, LINbus, MMC/SD, SPI, UART/USART, USB OTG, USIC Peripherals: DMA, I2S, LED, POR, Touch-Sense, WDT Program Memory Size: 1.5MB (1.5M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3.13V ~ 3.63V Data Converters: A/D 32x12b; D/A 2x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: PG-LQFP-144-24 Package / Case: 144-LQFP Exposed Pad | 1,271 | |
 | | XMC4800F144K2048AAXQMA1 | Infineon Technologies | IC MCU 32BIT 2MB FLASH 144LQFP | Microcontrollers | PG-LQFP-144-24 | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-M4 Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, LINbus, MMC/SD, SPI, UART/USART, USB OTG, USIC Peripherals: DMA, I2S, LED, POR, Touch-Sense, WDT Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3.13V ~ 3.63V Data Converters: A/D 32x12b; D/A 2x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: PG-LQFP-144-24 Package / Case: 144-LQFP Exposed Pad | 176 | |
 | | XMC6221SCQ024XABXUMA1 | Infineon Technologies | XMC1000 | Microcontrollers | N/A | N/A | N/A | N/A | 1,035 | |
 | | XMC7100-E272K4160AA | Infineon Technologies | INDUSTRIAL MCUS | Microcontrollers | 272-BGA (16x16) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M7 Core Size: 32-Bit Dual-Core Connectivity: CANbus, Ethernet, FIFO, I2C, IrDA, MMC/SD/SDIO, SPI, UART/USART Peripherals: Brown-out Detect/Reset, Crypto – AES, DMA, LVD, POR, PWM, SHA, Temp Sensor, TRNG, WDT Program Memory Size: 4.063MB (4.063M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 72x12b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 272-BGA (16×16) | 1,082 | |
 | | XMC7100-F100K1088AA | Infineon Technologies | INDUSTRIAL MCUS | Microcontrollers | 100-TEQFP (14x14) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M7 Core Size: 32-Bit Dual-Core Connectivity: CANbus, Ethernet, FIFO, I2C, IrDA, MMC/SD/SDIO, SPI, UART/USART Peripherals: Brown-out Detect/Reset, Crypto – AES, DMA, LVD, POR, PWM, SHA, Temp Sensor, TRNG, WDT Program Memory Size: 1.088M x 8 Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 37x12b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-TEQFP (14×14) Package / Case: 100-LQFP Exposed Pad | 305 | |
 | | XMC7100-F100K2112AA | Infineon Technologies | INDUSTRIAL MCUS | Microcontrollers | 100-TEQFP (14x14) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M7 Core Size: 32-Bit Dual-Core Connectivity: CANbus, Ethernet, FIFO, I2C, IrDA, MMC/SD/SDIO, SPI, UART/USART Peripherals: Brown-out Detect/Reset, Crypto – AES, DMA, LVD, POR, PWM, SHA, Temp Sensor, TRNG, WDT Program Memory Size: 2.112M x 8 Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 37x12b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-TEQFP (14×14) Package / Case: 100-LQFP Exposed Pad | 248 | |
 | | XMC7100-F100K4160AA | Infineon Technologies | IC MCU 32BT 4.063MB FLSH 100QFP | Microcontrollers | 100-TEQFP (14x14) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M7 Core Size: 32-Bit Single-Core Connectivity: CANbus, Ethernet, FIFO, I2C, IrDA, MMC/SD/SDIO, SPI, UART/USART Peripherals: Brown-out Detect/Reset, Crypto – AES, DMA, LVD, POR, PWM, SHA, Temp Sensor, TRNG, WDT Program Memory Size: 4.063MB (4.063M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 37x12b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-TEQFP (14×14) Package / Case: 100-LQFP Exposed Pad | 707 | |
 | | XMC7100-F144K2112AA | Infineon Technologies | INDUSTRIAL MCUS | Microcontrollers | 144-TEQFP (20x20) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M7 Core Size: 32-Bit Dual-Core Connectivity: CANbus, Ethernet, FIFO, I2C, IrDA, MMC/SD/SDIO, SPI, UART/USART Peripherals: Brown-out Detect/Reset, Crypto – AES, DMA, LVD, POR, PWM, SHA, Temp Sensor, TRNG, WDT Program Memory Size: 2.112M x 8 Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 52x12b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-TEQFP (20×20) Package / Case: 144-LQFP Exposed Pad | 152 | |
 | | XMC7100-F144K4160AA | Infineon Technologies | IC MCU 32BT 4.063MB FLSH 144QFP | Microcontrollers | 144-TEQFP (20x20) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M7 Core Size: 32-Bit Single-Core Connectivity: CANbus, Ethernet, FIFO, I2C, IrDA, MMC/SD/SDIO, SPI, UART/USART Peripherals: Brown-out Detect/Reset, Crypto – AES, DMA, LVD, POR, PWM, SHA, Temp Sensor, TRNG, WDT Program Memory Size: 4.063MB (4.063M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 52x12b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-TEQFP (20×20) Package / Case: 144-LQFP Exposed Pad | 906 | |
 | | XMC7100-F176K4160AA | Infineon Technologies | INDUSTRIAL MCUS | Microcontrollers | 176-TEQFP (24x24) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M7 Core Size: 32-Bit Dual-Core Connectivity: CANbus, Ethernet, FIFO, I2C, IrDA, MMC/SD/SDIO, SPI, UART/USART Peripherals: Brown-out Detect/Reset, Crypto – AES, DMA, LVD, POR, PWM, SHA, Temp Sensor, TRNG, WDT Program Memory Size: 4.063MB (4.063M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 64x12b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-TEQFP (24×24) Package / Case: 176-LQFP Exposed Pad | 168 | |
 | | XMC7100D-E272K4160AA | Infineon Technologies | INDUSTRIAL MCUS | Microcontrollers | 272-BGA (16x16) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M7 Core Size: 32-Bit Tri-Core Connectivity: CANbus, Ethernet, FIFO, I2C, IrDA, MMC/SD/SDIO, SPI, UART/USART Peripherals: Brown-out Detect/Reset, Crypto – AES, DMA, LVD, POR, PWM, SHA, Temp Sensor, TRNG, WDT Program Memory Size: 4.063MB (4.063M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 72x12b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 272-BGA (16×16) | 383 | |
 | | XMC7100D-F100K2112AA | Infineon Technologies | INDUSTRIAL MCUS | Microcontrollers | 100-TEQFP (14x14) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M7 Core Size: 32-Bit Tri-Core Connectivity: CANbus, Ethernet, FIFO, I2C, IrDA, MMC/SD/SDIO, SPI, UART/USART Peripherals: Brown-out Detect/Reset, Crypto – AES, DMA, LVD, POR, PWM, SHA, Temp Sensor, TRNG, WDT Program Memory Size: 2.112M x 8 Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 37x12b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-TEQFP (14×14) Package / Case: 100-LQFP Exposed Pad | 1,035 | |
 | | XMC7100D-F100K4160AA | Infineon Technologies | IC MCU 32BT 4.063MB FLSH 100QFP | Microcontrollers | 100-TEQFP (14x14) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M7 Core Size: 32-Bit Dual-Core Connectivity: CANbus, Ethernet, FIFO, I2C, IrDA, MMC/SD/SDIO, SPI, UART/USART Peripherals: Brown-out Detect/Reset, Crypto – AES, DMA, LVD, POR, PWM, SHA, Temp Sensor, TRNG, WDT Program Memory Size: 4.063MB (4.063M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 37x12b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-TEQFP (14×14) Package / Case: 100-LQFP Exposed Pad | 350 | |
| N/A | | XMC7100D-F144K2112AA | Infineon Technologies | INDUSTRIAL MCUS | Microcontrollers | 144-TEQFP (20x20) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M7 Core Size: 32-Bit Tri-Core Connectivity: CANbus, Ethernet, FIFO, I2C, IrDA, MMC/SD/SDIO, SPI, UART/USART Peripherals: Brown-out Detect/Reset, Crypto – AES, DMA, LVD, POR, PWM, SHA, Temp Sensor, TRNG, WDT Program Memory Size: 2.112M x 8 Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 52x12b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-TEQFP (20×20) Package / Case: 144-LQFP Exposed Pad | 378 | |
 | | XMC7100D-F144K4160AA | Infineon Technologies | IC MCU 32BT 4.063MB FLSH 144QFP | Microcontrollers | 144-TEQFP (20x20) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M7 Core Size: 32-Bit Dual-Core Connectivity: CANbus, Ethernet, FIFO, I2C, IrDA, MMC/SD/SDIO, SPI, UART/USART Peripherals: Brown-out Detect/Reset, Crypto – AES, DMA, LVD, POR, PWM, SHA, Temp Sensor, TRNG, WDT Program Memory Size: 4.063MB (4.063M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 52x12b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-TEQFP (20×20) Package / Case: 144-LQFP Exposed Pad | 535 | |
 | | XMC7100D-F176K4160AA | Infineon Technologies | IC MCU 32BT 4.063MB FLSH 176QFP | Microcontrollers | 176-TEQFP (24x24) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M7 Core Size: 32-Bit Dual-Core Connectivity: CANbus, Ethernet, FIFO, I2C, IrDA, MMC/SD/SDIO, SPI, UART/USART Peripherals: Brown-out Detect/Reset, Crypto – AES, DMA, LVD, POR, PWM, SHA, Temp Sensor, TRNG, WDT Program Memory Size: 4.063MB (4.063M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 64x12b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-TEQFP (24×24) Package / Case: 176-LQFP Exposed Pad | 28 | |
 | | XMC7200-E272K8384AA | Infineon Technologies | INDUSTRIAL MCUS | Microcontrollers | 272-BGA (16x16) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M7 Core Size: 32-Bit Dual-Core Connectivity: CANbus, Ethernet, FIFO, I2C, IrDA, MMC/SD/SDIO, SPI, UART/USART Peripherals: Brown-out Detect/Reset, Crypto – AES, DMA, LVD, POR, PWM, SHA, Temp Sensor, TRNG, WDT Program Memory Size: 8.188MB (8.188M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 96x12b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 272-BGA (16×16) | 1,449 | |
 | | XMC7200-F176K8384AA | Infineon Technologies | INDUSTRIAL MCUS | Microcontrollers | 176-TEQFP (24x24) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M7 Core Size: 32-Bit Dual-Core Connectivity: CANbus, Ethernet, FIFO, I2C, IrDA, MMC/SD/SDIO, SPI, UART/USART Peripherals: Brown-out Detect/Reset, Crypto – AES, DMA, LVD, POR, PWM, SHA, Temp Sensor, TRNG, WDT Program Memory Size: 8.188MB (8.188M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 81x12b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-TEQFP (24×24) Package / Case: 176-LQFP Exposed Pad | 241 | |
 | | XMC7200D-E272K8384AA | Infineon Technologies | IC MCU 32BIT 8.188MB FLSH 272BGA | Microcontrollers | 272-BGA (16x16) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M7 Core Size: 32-Bit Dual-Core Connectivity: CANbus, Ethernet, FIFO, I2C, IrDA, MMC/SD/SDIO, SPI, UART/USART Peripherals: Brown-out Detect/Reset, Crypto – AES, DMA, LVD, POR, PWM, SHA, Temp Sensor, TRNG, WDT Program Memory Size: 8.188MB (8.188M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 96x12b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 272-BGA (16×16) | 69 | |
 | | XMC7200D-F176K8384AA | Infineon Technologies | IC MCU 32BT 8.188MB FLSH 176QFP | Microcontrollers | 176-TEQFP (24x24) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M7 Core Size: 32-Bit Dual-Core Connectivity: CANbus, Ethernet, FIFO, I2C, IrDA, MMC/SD/SDIO, SPI, UART/USART Peripherals: Brown-out Detect/Reset, Crypto – AES, DMA, LVD, POR, PWM, SHA, Temp Sensor, TRNG, WDT Program Memory Size: 8.188MB (8.188M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 81x12b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-TEQFP (24×24) Package / Case: 176-LQFP Exposed Pad | 934 | |