 | | XOMAPL138ZWT | Texas Instruments | IC MPU OMAP-L1X 300MHZ 361NFBGA | Microprocessors | 361-NFBGA (16x16) | N/A | 0°C ~ 90°C (TJ) | Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Signal Processing; C674x, System Control; CP15 Display & Interface Controllers: LCD USB: USB 1.1 + PHY (1), USB 2.0 + PHY (1) Operating Temperature: 0°C ~ 90°C (TJ) Security Features: Boot Security, Cryptography Mounting Type: Surface Mount Supplier Device Package: 361-NFBGA (16×16) | 269 | |
 | | XPC823CZT66B2T | NXP Semiconductors | IC MPU MPC8XX 66MHZ 256BGA | Microprocessors | 256-PBGA (23x23) | N/A | -40°C ~ 95°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; RISC CPM Display & Interface Controllers: LCD, Video Operating Temperature: -40°C ~ 95°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-PBGA (23×23) | 234 | |
| N/A | N/A | XPC823ECZT66BA | NXP Semiconductors | IC MPU 66MHZ 256BGA | Microprocessors | 256-PBGA (23x23) | N/A | -40°C ~ 95°C (TJ) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; RISC CPM Display & Interface Controllers: LCD, Video Operating Temperature: -40°C ~ 95°C (TJ) Mounting Type: Surface Mount Supplier Device Package: 256-PBGA (23×23) | 1,104 | |
 | | XPC823EVR66B2 | NXP Semiconductors | IC MPU MPC8XX 66MHZ 256BGA | Microprocessors | 256-PBGA (23x23) | N/A | 0°C ~ 95°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; RISC CPM Display & Interface Controllers: LCD, Video Operating Temperature: 0°C ~ 95°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-PBGA (23×23) | 114 | |
 | | XPC823EVR75B2 | NXP Semiconductors | IC MPU MPC8XX 75MHZ 256BGA | Microprocessors | 256-PBGA (23x23) | N/A | 0°C ~ 95°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; RISC CPM Display & Interface Controllers: LCD, Video Operating Temperature: 0°C ~ 95°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-PBGA (23×23) | 811 | |
| N/A | N/A | XPC823EZT66BA | NXP Semiconductors | IC MPU 66MHZ 256BGA | Microprocessors | 256-PBGA (23x23) | N/A | 0°C ~ 95°C (TJ) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; RISC CPM Display & Interface Controllers: LCD, Video Operating Temperature: 0°C ~ 95°C (TJ) Mounting Type: Surface Mount Supplier Device Package: 256-PBGA (23×23) | 566 | |
| N/A | N/A | XPC823EZT75BA | NXP Semiconductors | IC MPU 75MHZ 256BGA | Microprocessors | 256-PBGA (23x23) | N/A | 0°C ~ 95°C (TJ) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; RISC CPM Display & Interface Controllers: LCD, Video Operating Temperature: 0°C ~ 95°C (TJ) Mounting Type: Surface Mount Supplier Device Package: 256-PBGA (23×23) | 328 | |
 | | XPC823ZT66B2T | NXP Semiconductors | IC MPU MPC8XX 66MHZ 256BGA | Microprocessors | 256-PBGA (23x23) | N/A | 0°C ~ 95°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; RISC CPM Display & Interface Controllers: LCD, Video Operating Temperature: 0°C ~ 95°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-PBGA (23×23) | 1,897 | |
 | | XPC823ZT75B2T | NXP Semiconductors | IC MPU MPC8XX 75MHZ 256BGA | Microprocessors | 256-PBGA (23x23) | N/A | 0°C ~ 95°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; RISC CPM Display & Interface Controllers: LCD, Video Operating Temperature: 0°C ~ 95°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-PBGA (23×23) | 1,277 | |
 | | XPC823ZT81B2T | NXP Semiconductors | IC MPU MPC8XX 81MHZ 256BGA | Microprocessors | 256-PBGA (23x23) | N/A | 0°C ~ 95°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; RISC CPM Display & Interface Controllers: LCD, Video Operating Temperature: 0°C ~ 95°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-PBGA (23×23) | 236 | |
 | | XPC8240LVV200E | NXP Semiconductors | IC MPU MPC82XX 200MHZ 352TBGA | Microprocessors | 352-TBGA (35x35) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC 603e Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DRAM, SDRAM Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 352-TBGA (35×35) | 172 | |
 | | XPC8240LZU200E | NXP Semiconductors | IC MPU MPC82XX 200MHZ 352TBGA | Microprocessors | 352-TBGA (35x35) | 3.3V | 0°C – 105°C | Core Processor: PowerPC 603e Number of Cores/Bus Width: 1 Core, 32-Bit Mounting Type: Surface Mount | 471 | |
 | | XPC8240RVV250E | NXP Semiconductors | IC MPU MPC82XX 250MHZ 352TBGA | Microprocessors | 352-TBGA (35x35) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC 603e Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DRAM, SDRAM Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 352-TBGA (35×35) | 37 | |
 | | XPC8240RZU250E | NXP Semiconductors | IC MPU MPC82XX 250MHZ 352TBGA | Microprocessors | 352-TBGA (35x35) | 3.3V | 0°C – 105°C | Core Processor: PowerPC 603e Number of Cores/Bus Width: 1 Core, 32-Bit Mounting Type: Surface Mount | 93 | |
 | | XPC8260CVVIFBC | NXP Semiconductors | IC MPU MPC82XX 200MHZ 480TBGA | Microprocessors | 480-TBGA (37.5x37.5) | N/A | -40°C ~ 105°C (TA) | Core Processor: PowerPC G2 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM, SDRAM Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 480-LBGA Exposed Pad Supplier Device Package: 480-TBGA (37.5×37.5) | 973 | |
 | | XPC8260CVVIHBC | NXP Semiconductors | IC MPU MPC82XX 200MHZ 480TBGA | Microprocessors | 480-TBGA (37.5x37.5) | N/A | -40°C ~ 105°C (TA) | Core Processor: PowerPC G2 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM, SDRAM Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 480-LBGA Exposed Pad Supplier Device Package: 480-TBGA (37.5×37.5) | 370 | |
 | | XPC8260CZUHFBC | NXP Semiconductors | IC MPU MPC82XX 166MHZ 480TBGA | Microprocessors | 480-TBGA (37.5x37.5) | N/A | -40°C ~ 105°C (TA) | Core Processor: PowerPC G2 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM, SDRAM Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 480-LBGA Exposed Pad Supplier Device Package: 480-TBGA (37.5×37.5) | 734 | |
 | | XPC8260CZUIHBC | NXP Semiconductors | IC MPU MPC82XX 200MHZ 480TBGA | Microprocessors | 480-TBGA (37.5x37.5) | N/A | -40°C ~ 105°C (TA) | Core Processor: PowerPC G2 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM, SDRAM Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 480-LBGA Exposed Pad Supplier Device Package: 480-TBGA (37.5×37.5) | 890 | |
 | | XPC8260VVHFBC | NXP Semiconductors | IC MPU MPC82XX 166MHZ 480TBGA | Microprocessors | 480-TBGA (37.5x37.5) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC G2 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM, SDRAM Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 480-LBGA Exposed Pad Supplier Device Package: 480-TBGA (37.5×37.5) | 804 | |
 | | XPC8260VVIFBC | NXP Semiconductors | IC MPU MPC82XX 200MHZ 480TBGA | Microprocessors | 480-TBGA (37.5x37.5) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC G2 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM, SDRAM Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 480-LBGA Exposed Pad Supplier Device Package: 480-TBGA (37.5×37.5) | 1,016 | |