XPC8260CZUIHBC
| Part Description |
PowerPC G2 Microprocessor IC MPC82xx 1 Core, 32-Bit 200MHz 480-TBGA (37.5x37.5) |
|---|---|
| Quantity | 1,179 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | XPC8260 |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Communications; RISC CPM | Core Processor | PowerPC G2 | Device Package | 480-TBGA (37.5x37.5) | ||
|---|---|---|---|---|---|---|---|
| ECCN | 5A991B4B | Ethernet | 10/100Mbps (3) | Graphics Acceleration | No | ||
| HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | ||
| Mounting Type | Surface Mount | Number of Cores/Bus Width | 1 Core, 32-Bit | Operating Temperature | -40°C ~ 105°C (TA) | ||
| Package / Case | 480-LBGA Exposed Pad | RAM Controllers | DRAM, SDRAM | REACH Compliance | REACH Unaffected | ||
| RoHS Compliance | RoHS non-compliant | Speed | 200MHz | Supplier Device Package | 480-TBGA (37.5×37.5) | ||
| Voltage – I/O | 3.3V |
Overview of XPC8260CZUIHBC – PowerPC G2 Microprocessor 200 MHz, 480-TBGA
The XPC8260CZUIHBC is a PowerPC G2-based microprocessor featuring a single 32-bit core running at 200 MHz. Designed for embedded and industrial applications, it integrates communications-focused co-processors and memory controllers to support networked and real-time embedded designs.
With integrated 10/100 Mbps Ethernet interfaces, DRAM/SDRAM controllers, 3.3 V I/O and industrial qualification, this device targets embedded systems that require robust connectivity, board-level integration and extended operating temperatures.
Key Features
- Core — PowerPC G2 single 32-bit core operating at 200 MHz for deterministic embedded processing.
- Memory Support — Integrated DRAM and SDRAM controllers to simplify external memory interfacing and system design.
- Communications Co-processors — On-chip communications and RISC CPM co-processors to offload protocol and communications tasks from the main core.
- Ethernet Connectivity — Three 10/100Mbps Ethernet interfaces for multi-port network connectivity and device networking.
- Interfaces — I2C and other standard system interfaces for peripheral management and control.
- Power and I/O — 3.3 V I/O compatibility for common embedded peripherals and interfaces.
- Package and Mounting — 480-TBGA supplier device package (37.5×37.5) with a 480-LBGA exposed pad option; surface-mount mounting type.
- Temperature and Qualification — Industrial qualification with an operating temperature range of −40 °C to 105 °C for deployment in extended-temperature environments.
- Compliance — RoHS-compliant construction to meet environmental regulatory requirements.
Typical Applications
- Embedded Systems — Central processing for embedded controllers and appliances where a single 32-bit PowerPC core and memory controllers are required.
- Industrial Networking — Multi-port 10/100 Mbps Ethernet connectivity and industrial temperature rating support networked industrial devices and gateways.
- Communications Equipment — On-chip communications and RISC CPM co-processors enable protocol handling and offloaded communications tasks in networking products.
- Control and Automation — I/O compatibility and rugged operating range make it suitable for automation controllers and embedded control nodes.
Unique Advantages
- Integrated Networking Interfaces: Three 10/100 Mbps Ethernet ports provide built-in network connectivity without requiring separate PHYs on each port.
- Communications Offload: Dedicated communications and RISC CPM co-processors reduce main-core overhead for protocol processing and I/O tasks.
- Memory Integration: On-chip DRAM and SDRAM controllers simplify board design and reduce external memory management complexity.
- Industrial-Grade Operation: Qualified for industrial use with an operating range from −40 °C to 105 °C for reliable performance in harsh environments.
- Standard 3.3 V I/O: Broad compatibility with common embedded peripherals and power domains simplifies integration into existing designs.
- Compact, Surface-Mount Package: 480-TBGA/480-LBGA exposed pad package supports high-density board layouts and thermal management options.
Why Choose XPC8260CZUIHBC?
The XPC8260CZUIHBC combines a PowerPC G2 200 MHz core with communications-focused co-processors, integrated memory controllers and multi-port Ethernet to deliver a compact, integrated solution for embedded and industrial designs. Its 3.3 V I/O, surface-mount 480-TBGA package, and industrial temperature qualification make it suitable for products that require reliable connectivity and robust operation.
This device is well suited for engineers building networked embedded systems, industrial controllers and communications equipment who need on-chip interfaces and memory support to reduce board complexity and accelerate time to market.
Request a quote or submit a sales inquiry to receive pricing and availability information for the XPC8260CZUIHBC. Our team can provide lead-time details and support for volume requirements.

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