XPC8260ZUHFBC
| Part Description |
PowerPC G2 Microprocessor IC MPC82xx 1 Core, 32-Bit 166MHz 480-TBGA (37.5x37.5) |
|---|---|
| Quantity | 347 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | XPC8260 |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Communications; RISC CPM | Core Processor | PowerPC G2 | Device Package | 480-TBGA (37.5x37.5) | ||
|---|---|---|---|---|---|---|---|
| ECCN | 5A991B4B | Ethernet | 10/100Mbps (3) | Graphics Acceleration | No | ||
| HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | ||
| Mounting Type | Surface Mount | Number of Cores/Bus Width | 1 Core, 32-Bit | Operating Temperature | 0°C ~ 105°C (TA) | ||
| Package / Case | 480-LBGA Exposed Pad | RAM Controllers | DRAM, SDRAM | REACH Compliance | REACH Unaffected | ||
| RoHS Compliance | RoHS non-compliant | Speed | 166MHz | Supplier Device Package | 480-TBGA (37.5×37.5) | ||
| Voltage – I/O | 3.3V |
Overview of XPC8260ZUHFBC – IC MPU MPC82XX 166MHZ 480TBGA
The XPC8260ZUHFBC is a PowerPC G2 microprocessor IC offering a single 32-bit core clocked at 166 MHz, designed for embedded system integration. It combines processing capability with on-chip communications support and memory controllers to address embedded networking and consumer-oriented applications.
Key on-chip features include a communications RISC CPM co-processor, DRAM/SDRAM controllers, multiple 10/100 Mbps Ethernet interfaces, I2C, and 3.3 V I/O support. The device is supplied in a 480-TBGA (37.5×37.5 mm) package and is RoHS compliant.
Key Features
- Core & Performance Single PowerPC G2 32-bit core running at 166 MHz for deterministic embedded processing.
- Communications Co-Processor Integrated RISC CPM for communications tasks, enabling offload of protocol handling from the main core.
- Ethernet Connectivity Three 10/100 Mbps Ethernet interfaces for embedded networking and data communications.
- Memory Controllers On-chip DRAM and SDRAM controllers to support system memory interfacing.
- Interfaces I2C and other peripheral interfaces for sensor, configuration, and control connectivity.
- Power & I/O 3.3 V I/O voltage compatibility for common embedded peripherals and board-level integration.
- Package & Thermal 480-LBGA exposed pad (480-TBGA, 37.5×37.5 mm) package with an operating temperature range of 0 °C to 105 °C.
- Qualification & Compliance Consumer qualification and RoHS compliance for regulated markets and assemblies.
Typical Applications
- Embedded Networking Use the triple 10/100 Mbps Ethernet interfaces and CPM co-processor to implement compact networked endpoints and gateways.
- Communications Equipment Deploy the integrated communications co-processor and Ethernet ports for protocol handling and data transport tasks.
- Consumer Electronics Target consumer-grade devices that require a single 32-bit processor core, external memory support, and common peripheral interfaces.
- Industrial Control (non-automotive) Leverage the device’s memory controllers, I/O voltage compatibility, and 0 °C to 105 °C operating range for embedded control applications within consumer/industrial environments.
Unique Advantages
- Integrated Communications Offload The RISC CPM co-processor reduces main-core overhead for protocol processing, simplifying software partitioning.
- Multiple Ethernet Ports Three 10/100 Mbps interfaces enable flexible network topologies and direct device connectivity without additional PHY components.
- On-Chip Memory Support DRAM and SDRAM controllers streamline system memory integration and reduce external controller requirements.
- Board-Level Compatibility 3.3 V I/O and a standardized 480-TBGA package aid in integrating the MPU into existing embedded hardware designs.
- RoHS Compliant Meets RoHS requirements for assemblies targeting regulated markets.
- Consumer-Focused Qualification Specified for consumer applications where the device’s feature set and operating range align with product requirements.
Why Choose XPC8260ZUHFBC?
The XPC8260ZUHFBC positions itself as a compact, integrated solution for embedded designs that require a PowerPC G2 core plus dedicated communications capability. Its combination of a 166 MHz single core, communications RISC CPM, memory controllers, and multiple Ethernet interfaces makes it suitable for embedded networking and consumer device implementations.
Manufactured by NXP Semiconductors and supplied in a 480-TBGA package with RoHS compliance and a 0 °C to 105 °C operating range, this MPU is appropriate for designers seeking a single-chip solution that balances processing, connectivity, and system integration.
Request a quote or contact sales to discuss volume pricing, availability, and integration support for the XPC8260ZUHFBC.

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