XPC8260ZUHFBC

IC MPU MPC82XX 166MHZ 480TBGA
Part Description

PowerPC G2 Microprocessor IC MPC82xx 1 Core, 32-Bit 166MHz 480-TBGA (37.5x37.5)

Quantity 347 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesXPC8260
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPCommunications; RISC CPMCore ProcessorPowerPC G2Device Package480-TBGA (37.5x37.5)
ECCN5A991B4BEthernet10/100Mbps (3)Graphics AccelerationNo
HTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-BitOperating Temperature0°C ~ 105°C (TA)
Package / Case480-LBGA Exposed PadRAM ControllersDRAM, SDRAMREACH ComplianceREACH Unaffected
RoHS ComplianceRoHS non-compliantSpeed166MHzSupplier Device Package480-TBGA (37.5×37.5)
Voltage – I/O3.3V

Overview of XPC8260ZUHFBC – IC MPU MPC82XX 166MHZ 480TBGA

The XPC8260ZUHFBC is a PowerPC G2 microprocessor IC offering a single 32-bit core clocked at 166 MHz, designed for embedded system integration. It combines processing capability with on-chip communications support and memory controllers to address embedded networking and consumer-oriented applications.

Key on-chip features include a communications RISC CPM co-processor, DRAM/SDRAM controllers, multiple 10/100 Mbps Ethernet interfaces, I2C, and 3.3 V I/O support. The device is supplied in a 480-TBGA (37.5×37.5 mm) package and is RoHS compliant.

Key Features

  • Core & Performance  Single PowerPC G2 32-bit core running at 166 MHz for deterministic embedded processing.
  • Communications Co-Processor  Integrated RISC CPM for communications tasks, enabling offload of protocol handling from the main core.
  • Ethernet Connectivity  Three 10/100 Mbps Ethernet interfaces for embedded networking and data communications.
  • Memory Controllers  On-chip DRAM and SDRAM controllers to support system memory interfacing.
  • Interfaces  I2C and other peripheral interfaces for sensor, configuration, and control connectivity.
  • Power & I/O  3.3 V I/O voltage compatibility for common embedded peripherals and board-level integration.
  • Package & Thermal  480-LBGA exposed pad (480-TBGA, 37.5×37.5 mm) package with an operating temperature range of 0 °C to 105 °C.
  • Qualification & Compliance  Consumer qualification and RoHS compliance for regulated markets and assemblies.

Typical Applications

  • Embedded Networking  Use the triple 10/100 Mbps Ethernet interfaces and CPM co-processor to implement compact networked endpoints and gateways.
  • Communications Equipment  Deploy the integrated communications co-processor and Ethernet ports for protocol handling and data transport tasks.
  • Consumer Electronics  Target consumer-grade devices that require a single 32-bit processor core, external memory support, and common peripheral interfaces.
  • Industrial Control (non-automotive)  Leverage the device’s memory controllers, I/O voltage compatibility, and 0 °C to 105 °C operating range for embedded control applications within consumer/industrial environments.

Unique Advantages

  • Integrated Communications Offload  The RISC CPM co-processor reduces main-core overhead for protocol processing, simplifying software partitioning.
  • Multiple Ethernet Ports  Three 10/100 Mbps interfaces enable flexible network topologies and direct device connectivity without additional PHY components.
  • On-Chip Memory Support  DRAM and SDRAM controllers streamline system memory integration and reduce external controller requirements.
  • Board-Level Compatibility  3.3 V I/O and a standardized 480-TBGA package aid in integrating the MPU into existing embedded hardware designs.
  • RoHS Compliant  Meets RoHS requirements for assemblies targeting regulated markets.
  • Consumer-Focused Qualification  Specified for consumer applications where the device’s feature set and operating range align with product requirements.

Why Choose XPC8260ZUHFBC?

The XPC8260ZUHFBC positions itself as a compact, integrated solution for embedded designs that require a PowerPC G2 core plus dedicated communications capability. Its combination of a 166 MHz single core, communications RISC CPM, memory controllers, and multiple Ethernet interfaces makes it suitable for embedded networking and consumer device implementations.

Manufactured by NXP Semiconductors and supplied in a 480-TBGA package with RoHS compliance and a 0 °C to 105 °C operating range, this MPU is appropriate for designers seeking a single-chip solution that balances processing, connectivity, and system integration.

Request a quote or contact sales to discuss volume pricing, availability, and integration support for the XPC8260ZUHFBC.

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