XPC8260VVHFBC

The XPC8260VVHFBC is an embedded microprocessor featuring a PowerPC G2 core running at 166 MHz in a single 32‑bit core configuration. It integrates communications-focused co-processors, memory controllers and multiple Ethernet interfaces, making it suitable for consumer embedded designs that require on‑chip system integration and network connectivity.

Packaged in a 480‑TBGA (37.5×37.5 mm) exposed‑pad surface mount package with 3.3 V I/O and an operating range of 0 °C to 105 °C, this device targets consumer applications that benefit from consolidated functions and streamlined board implementation.

Key Features

• Core  PowerPC G2 single 32‑bit core running at 166 MHz for deterministic embedded processing.
• Memory Controllers  On‑chip DRAM and SDRAM controllers simplify external memory interfacing and system design.
• Communications Co‑processors  Integrated communications DSP and RISC CPM co‑processors to offload protocol and communication tasks.
• Ethernet  Three 10/100 Mbps Ethernet interfaces provide built‑in network connectivity for device and system communication.
• System Interfaces  Additional interfaces include I²C for peripheral control and system management.
• Package & Mounting  480‑TBGA (37.5×37.5 mm) exposed pad, surface mount construction for high‑density board layouts.
• Power  3.3 V I/O support for common embedded voltage domains.
• Temperature & Qualification  Rated for 0 °C to 105 °C and qualified for consumer applications; RoHS compliant.

Typical Applications

• Consumer Embedded Systems  Central processing for consumer devices that require integrated memory controllers and communications support.
• Network‑Enabled Peripherals  Devices that need multiple 10/100 Mbps Ethernet interfaces for LAN connectivity and data transfer.
• Communications Modules  Use of on‑chip communications DSP and RISC CPM co‑processors to handle protocol and interface tasks within consumer communications equipment.

Unique Advantages

• Integrated Networking: Three 10/100 Mbps Ethernet interfaces reduce external PHY and switch requirements for networked designs.
• On‑Chip Memory Support: Built‑in DRAM and SDRAM controllers simplify memory layout and reduce component count.
• Offload Co‑processing: Communications DSP and RISC CPM co‑processors lower main core overhead for protocol and communications processing.
• Compact High‑Density Package: 480‑TBGA (37.5×37.5 mm) exposed‑pad package supports compact board implementations and thermal management.
• Standard I/O and Power: 3.3 V I/O and I²C support align with common embedded peripheral interfaces.
• Compliance and Temperature Range: RoHS compliance and 0 °C to 105 °C operating range meet consumer product environmental needs.

Why Choose XPC8260VVHFBC?

The XPC8260VVHFBC combines a PowerPC G2 core with targeted communications co‑processors, integrated memory controllers and multiple Ethernet ports to deliver a highly integrated solution for consumer embedded designs. Its 480‑TBGA exposed‑pad package and 3.3 V I/O simplify board design while supporting compact, networked products.

This device is well suited to designers seeking a consolidated embedded processor that reduces BOM complexity and supports significant on‑chip communications and memory functionality, backed by RoHS compliance for production readiness in consumer markets.

Request a quote or submit an inquiry to receive pricing and availability details for the XPC8260VVHFBC and to discuss how it fits your embedded design requirements.