XPC8260CZUHFBC

The XPC8260CZUHFBC is a PowerPC G2 microprocessor from NXP Semiconductors' XPC8260 series. It is a single‑core, 32‑bit MPU running at 166 MHz designed for embedded and industrial applications.

Engineered for systems that require integrated communications and memory interfaces, the device provides on‑chip DRAM/SDRAM controllers, multiple 10/100 Mbps Ethernet ports, and communications/RISC CPM coprocessors, all within a 480‑TBGA package and industrial operating range.

Key Features

• Core PowerPC G2 architecture, single 32‑bit core operating at 166 MHz for embedded processing tasks.
• Memory Controllers On‑chip DRAM and SDRAM controllers to support system memory integration.
• Communications Coprocessors Includes Communications and RISC CPM coprocessors to offload protocol and I/O processing.
• Ethernet 10/100 Mbps Ethernet support (10/100Mbps (3)) for networked embedded systems.
• Interfaces Additional I2C interface for peripheral control and system management.
• Power and I/O 3.3 V I/O voltage compatibility for common embedded system levels.
• Package and Mounting 480‑TBGA supplier device package (37.5x37.5) with 480‑LBGA exposed pad; designed for surface mount assembly.
• Qualification and Temperature Industrial qualification with an operating temperature range of −40°C to 105°C.
• RoHS Compliance RoHS compliant to meet environmental material requirements.

Typical Applications

• Industrial Control Used in embedded controllers and automation equipment where industrial qualification and a wide temperature range are required.
• Embedded Networking Suited for networked embedded devices leveraging the on‑chip 10/100 Mbps Ethernet interfaces and communications coprocessors.
• Communications Equipment Applicable to communications and protocol handling systems that benefit from the RISC CPM and dedicated communications coprocessors.
• Custom Embedded Systems Employed in bespoke embedded designs that require a 32‑bit PowerPC core, memory controller integration, and I2C peripheral connectivity.

Unique Advantages

• Integrated Communications Subsystems: On‑chip Communications and RISC CPM coprocessors reduce external component count and simplify protocol handling.
• Network‑Ready: Multiple 10/100 Mbps Ethernet interfaces provide built‑in LAN connectivity for networked applications.
• Industrial Reliability: Industrial qualification and a −40°C to 105°C operating range support deployment in demanding environments.
• Standard 3.3 V I/O: 3.3 V I/O compatibility eases integration with common embedded peripherals and logic levels.
• High‑density BGA Package: 480‑TBGA (37.5x37.5) with exposed pad supports high pin counts and thermal management in surface‑mount designs.
• Regulatory Compliance: RoHS compliance helps meet environmental material requirements for production devices.

Why Choose XPC8260CZUHFBC?

The XPC8260CZUHFBC balances embedded processing performance with integrated communications and memory interfaces, making it suitable for industrial and networked embedded designs. Its single PowerPC G2 core at 166 MHz, combined with on‑chip DRAM/SDRAM controllers and communications coprocessors, provides a compact platform for systems requiring both control and networking functions.

With industrial qualification, a broad operating temperature range, 3.3 V I/O, and a high‑density 480‑TBGA package, this device offers durability and integration for long‑life embedded deployments where robust operation and reduced BOM complexity matter.

Request a quote or submit an RFQ to receive pricing and availability for the XPC8260CZUHFBC.