XPC8260CVVIFBC

The XPC8260CVVIFBC is a PowerPC G2 microprocessor (MPC82xx series) featuring a single 32‑bit core running at 200 MHz, designed for embedded applications. It integrates communications-focused co‑processors and a range of system interfaces to address networking and industrial embedded designs.

With integrated DRAM/SDRAM controllers, 10/100Mbps Ethernet interfaces, I2C, 3.3 V I/O, and industrial qualification with an operating range of -40°C to 105°C, this device is suited for applications requiring deterministic embedded processing and robust thermal performance.

Key Features

• Core — PowerPC G2 single 32‑bit core running at 200 MHz for deterministic embedded processing.
• Co‑processors — Communications and RISC CPM co‑processor support to offload communication tasks and accelerate protocol handling.
• Memory Controllers — Integrated DRAM and SDRAM controllers to support external memory for system and application code.
• Networking Interfaces — Integrated 10/100Mbps Ethernet (3) interfaces for network connectivity in embedded systems.
• Peripheral Interfaces — I2C support and other standard embedded interfaces for board-level control and sensor connectivity.
• Power and I/O — 3.3 V I/O voltage for common embedded logic compatibility.
• Package and Mounting — 480‑TBGA package (37.5 × 37.5 mm) with 480‑LBGA exposed pad; surface mount for PCB assembly.
• Industrial Qualification and Temperature Range — Qualified for industrial applications with an operating temperature of -40°C to 105°C.
• RoHS Compliance — RoHS‑compliant construction for regulatory and environmental adherence.

Typical Applications

• Industrial Control — Embedded control systems that require industrial qualification and wide operating temperature ranges for reliable field operation.
• Networking & Communications — Networked embedded devices leveraging integrated 10/100Mbps Ethernet interfaces and communications co‑processors.
• Embedded Processing — General embedded systems that require a 32‑bit PowerPC G2 core with external DRAM/SDRAM support and I2C peripheral connectivity.

Unique Advantages

• Integrated Communications Processing: On‑chip communications and RISC CPM co‑processors reduce host core load for protocol handling and data movement.
• Built‑in Networking Interfaces: 10/100Mbps Ethernet (3) integration simplifies board design for networked devices.
• Memory Support: DRAM and SDRAM controllers enable flexible external memory configurations for varied application needs.
• Industrial‑Grade Operation: Industrial qualification and a -40°C to 105°C operating range support deployment in harsh environments.
• Standard I/O Voltage: 3.3 V I/O ensures compatibility with common embedded logic families and peripherals.
• High‑density Package: 480‑TBGA/480‑LBGA exposed pad packaging provides a compact surface‑mount solution for complex boards.

Why Choose XPC8260CVVIFBC?

The XPC8260CVVIFBC positions itself as a capable, integrated microprocessor option for embedded and industrial applications that need a 200 MHz PowerPC G2 core alongside on‑chip communications support and memory controllers. Its combination of Ethernet interfaces, I2C, and co‑processor resources addresses networking and communication tasks while leaving the core available for application logic.

Manufactured by NXP Semiconductors and provided in a 480‑TBGA surface‑mount package with industrial qualification and RoHS compliance, this device suits engineers designing robust, thermally demanding embedded systems that require long-term availability and a compact, integrated solution.

Request a quote or submit a pricing inquiry to receive availability and lead‑time information for the XPC8260CVVIFBC.