XPC8240LVV200E

The XPC8240LVV200E is a PowerPC 603e microprocessor in the MPC82xx family from NXP Semiconductors. It features a single 32‑bit core running at 200 MHz, designed for embedded applications that require a mid-range processor with integrated memory interfaces.

Key built-in capabilities include DRAM and SDRAM controllers and an I2C interface, combined with 3.3 V I/O and a compact 352‑TBGA (35×35) surface‑mount package. The device is RoHS compliant and qualified for consumer applications with an operating range of 0°C to 105°C.

Key Features

• Core PowerPC 603e single 32‑bit core operating at 200 MHz for deterministic embedded processing.
• Memory Integrated DRAM and SDRAM controllers to interface directly with external memory subsystems.
• Power and I/O 3.3 V I/O signaling suitable for common embedded peripheral interfaces.
• Interfaces Includes I2C for peripheral and sensor communications.
• Package and Mounting Supplier device package 352‑TBGA (35×35) with package case listed as 352‑LBGA; surface‑mount device for high‑density PCB designs.
• Temperature Range Rated for operation from 0°C to 105°C, matching consumer‑grade embedded environments.
• Compliance RoHS compliant and qualified for consumer applications.
• Graphics No graphics acceleration—focused on general embedded processing and memory interface tasks.

Typical Applications

• Embedded systems Single‑core PowerPC computing for control and processing tasks in embedded designs.
• Memory‑centric designs Systems that require direct DRAM or SDRAM interfacing via onboard memory controllers.
• Peripheral and sensor control Devices using I2C for peripheral communication and simple sensor management in consumer products.

Unique Advantages

• PowerPC 603e architecture: Provides a known single‑core 32‑bit processing architecture at 200 MHz for predictable embedded performance.
• Integrated memory controllers: Built‑in DRAM and SDRAM controllers enable straightforward connection to external memory without separate controller logic.
• Compact, high‑density package: 352‑TBGA (35×35) surface‑mount package supports space‑constrained PCB layouts.
• Standard I/O voltage: 3.3 V I/O compatibility with common embedded peripherals and interfaces.
• RoHS compliance: Environmentally compliant manufacturing suitable for consumer products.
• Consumer qualification: Device qualification aligned with consumer application requirements and operating range.

Why Choose XPC8240LVV200E?

The XPC8240LVV200E offers a balanced combination of a PowerPC 603e single 32‑bit core at 200 MHz, integrated DRAM/SDRAM controllers, and an I2C interface in a compact 352‑TBGA surface‑mount package. It is positioned for embedded and consumer applications where predictable processing, direct memory interfacing, and compact packaging are primary considerations.

Backed by NXP Semiconductors and delivered as a RoHS‑compliant, consumer‑qualified device, the XPC8240LVV200E is suitable for designs that need reliable mid‑range processing with standard 3.3 V I/O and a 0°C to 105°C operating range.

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