XPC823ZT66B2T

The XPC823ZT66B2T is a PowerPC-based microprocessor from the XPC823 series by NXP Semiconductors. It features a single 32-bit core running at 66 MHz and is targeted for embedded, consumer-focused applications.

Designed with a broad set of integrated controllers and interfaces, this device delivers a compact, 3.3 V, surface-mount MPU solution that combines communications and display support with DRAM control for space- and cost-conscious embedded designs.

Key Features

• Core Single 32-bit PowerPC core operating at 66 MHz for deterministic embedded processing.
• Memory and Controllers Integrated DRAM controller to manage external memory and support system-level memory needs.
• Communications and Co‑processors Includes communications-oriented co-processors (Communications; RISC CPM) to offload protocol handling and improve system throughput.
• Interfaces On-chip peripheral set includes 10 Mbps Ethernet, USB 1.x, I2C and display interface controllers for LCD and video, enabling networking, peripheral connectivity, and local display drive.
• Power and I/O 3.3 V I/O voltage suitable for common embedded peripherals and logic families.
• Package and Mounting Supplied in a 256-PBGA (23×23) package, surface mount, for compact board integration.
• Operating Range and Qualification Consumer-qualified device with an operating temperature range of 0 °C to 95 °C and RoHS compliance.

Typical Applications

• Consumer Embedded Devices Suited for consumer electronics that require a compact MPU with display support, peripheral connectivity, and DRAM interface.
• Networking and Communications Equipment Integrated 10 Mbps Ethernet, USB 1.x and communications co-processors make it applicable for entry-level networking and protocol handling tasks.
• Display-Driven Interfaces Built-in LCD and video controllers enable user interfaces and local display functionality in embedded products.

Unique Advantages

• Integrated peripheral set: Ethernet, USB, I2C and display controllers reduce external component count and simplify system design.
• Dedicated communications co-processors: Communications and RISC CPM co-processors offload protocol tasks to improve main-core determinism.
• Compact PBGA package: 256-PBGA (23×23) surface-mount package enables dense board layouts for space-constrained designs.
• Standard 3.3 V I/O: Compatible with common embedded peripherals and logic families, easing integration with existing designs.
• Consumer-grade temperature range and RoHS compliance: Suitable for consumer product environments with regulatory compliance for lead-free assembly.

Why Choose XPC823ZT66B2T?

The XPC823ZT66B2T positions itself as a balanced embedded MPU choice that combines a PowerPC 32-bit core at 66 MHz with a comprehensive set of on-chip interfaces and controllers. Its integration of communications co-processors, DRAM control and display connectivity streamlines BOM and board complexity for consumer-focused embedded designs.

This device is ideal for designers seeking a compact, surface-mount PowerPC solution with integrated networking and display capabilities, offering longevity and ecosystem alignment through NXP's XPC823 series support.

Request a quote or submit an inquiry to receive pricing and availability information for the XPC823ZT66B2T. Our team can provide lead-time and ordering assistance tailored to your project requirements.