XPC823ZT75B2T

The XPC823ZT75B2T is a PowerPC-based microprocessor IC in the XPC823 series, featuring a single 32-bit core running at 75 MHz. Designed for embedded consumer applications, it integrates communications co-processors and display interfaces to support systems that require modest processing performance with onboard peripheral support.

With a 3.3 V I/O voltage, DRAM controller, LCD/video display controllers, and a compact 256‑PBGA (23×23) surface-mount package, this device targets embedded designs that need integrated connectivity and display capabilities while meeting RoHS compliance.

Key Features

• Core  PowerPC architecture with a single 32‑bit core running at 75 MHz for deterministic embedded processing.
• Co-Processors & Communication  Includes communications and RISC CPM co-processors to offload communication tasks from the main CPU.
• Memory & Controllers  Integrated DRAM controller to interface with external memory for system-level data handling.
• Display Interfaces  Built-in LCD and video display interface controllers to support user interfaces and basic video output.
• Connectivity  On-chip 10 Mbps Ethernet (1), USB 1.x (1), and I2C interfaces provide common peripheral and network connectivity options.
• Power and Packaging  3.3 V I/O voltage and a 256‑PBGA (23×23) surface-mount package suitable for compact embedded boards.
• Operating Range & Qualification  Consumer-grade qualification with an operating temperature range of 0 °C to 95 °C and RoHS compliance.

Typical Applications

• Consumer Embedded Devices  Suited for consumer-oriented embedded products that require a compact PowerPC core with display and basic networking.
• Human-Machine Interfaces (HMIs)  LCD and video interface controllers enable use as a controller for displays and simple graphical interfaces.
• Basic Networked Appliances  On-chip 10 Mbps Ethernet and USB 1.x support devices that need low-speed networking and peripheral connectivity.
• Communications Modules  Communications and RISC CPM co-processors provide dedicated support for embedded communication tasks.

Unique Advantages

• Integrated Communication Co-Processors: Offloads communications workloads from the main core, reducing software overhead for networked applications.
• Display-Ready Integration: On-chip LCD and video controllers simplify implementation of user interfaces without large external logic.
• Compact Surface-Mount Package: 256‑PBGA (23×23) provides a small footprint for space-constrained embedded PCBs.
• Standard Embedded Connectivity: Built-in Ethernet, USB 1.x, and I2C reduce BOM complexity for common peripheral and network interfaces.
• RoHS Compliant: Meets environmental compliance requirements for consumer electronics manufacturing.
• Supplier Backing: Offered by NXP Semiconductors, providing a recognizable manufacturer source for procurement and support.

Why Choose XPC823ZT75B2T?

The XPC823ZT75B2T combines a PowerPC 32-bit core with dedicated communication co-processors, display controllers, and a DRAM interface in a compact 256‑PBGA package, making it a balanced choice for consumer embedded designs that require integrated connectivity and display support. Its 3.3 V I/O and RoHS compliance simplify integration into modern consumer products.

Ideal for developers and procurement teams building consumer-facing embedded systems, this device offers a focused set of peripherals and operating range suitable for applications that prioritize integration, compact packaging, and conformity to environmental regulations, all backed by NXP Semiconductors.

Request a quote or submit an inquiry to evaluate XPC823ZT75B2T for your next embedded consumer design.