EP2SGX60DF780C5N

IC FPGA 364 I/O 780FBGA
Part Description

Stratix® II GX Field Programmable Gate Array (FPGA) IC 364 2544192 60440 780-BBGA

Quantity 87 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package780-FBGA (29x29)GradeCommercialOperating Temperature0°C – 85°C
Package / Case780-BBGANumber of I/O364Voltage1.15 V - 1.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs3022Number of Logic Elements/Cells60440
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits2544192

Overview of EP2SGX60DF780C5N – Stratix® II GX Field Programmable Gate Array (FPGA) IC

The EP2SGX60DF780C5N is a Stratix® II GX family FPGA in a 780-ball BGA package, designed for high-performance, reprogrammable logic and I/O integration. It combines a large logic array and embedded memory with the Stratix II GX family’s high-speed serial transceiver architecture to address high-speed backplane, chip-to-chip, and communications bridging applications.

Built for commercial-grade systems, this device provides a balance of dense logic resources, significant on-chip RAM, wide I/O count, and low-voltage operation to support complex digital designs and protocol-centric implementations.

Key Features

  • Logic Capacity  Provides 60,440 logic elements across 3,022 LABs to implement complex digital functions and state machines.
  • Embedded Memory  Approximately 2.54 Mbits of on-chip RAM suitable for FIFOs, buffering, and on-chip data storage.
  • I/O Density  364 user I/O pins to support broad interface requirements and parallel I/O buses.
  • Stratix II GX Transceiver Architecture (family-level)  Stratix II GX devices include high-speed serial transceivers with clock and data recovery and SERDES capabilities supporting data rates up to 6.375 Gbps per channel (family feature).
  • Clocking and DSP Resources (family-level)  Family-level features include up to four enhanced PLLs and dedicated high-speed DSP blocks for multiplier and MAC implementations (as described in the Stratix II GX device documentation).
  • Power and Supply  Operates from a core supply range of 1.15 V to 1.25 V for the logic array.
  • Package  780-ball BGA (supplier package: 780-FBGA, 29 × 29 mm) for compact, high-density board implementations.
  • Grade and Temperature  Commercial grade with an operating temperature range of 0 °C to 85 °C.
  • Standards & Integration (family-level)  Stratix II GX family documentation describes support for multiple I/O standards, selectable on-chip termination, adaptive equalization, and dynamic transceiver configuration (family-level features).
  • RoHS Compliance  Device is RoHS compliant.

Typical Applications

  • Telecommunications & Networking  High-speed serial links and on-chip logic make this device suitable for protocol bridging, packet processing, and backplane interfaces.
  • High-speed I/O Systems  Large I/O count and family transceiver capabilities support multi-channel, source-synchronous, and serial interface designs.
  • Signal Processing & Compute Acceleration  Significant logic resources and embedded memory enable implementation of DSP pipelines, buffering, and custom compute blocks.
  • Board-level Integration  Dense BGA packaging and extensive I/O allow the FPGA to consolidate functions and reduce external component count on complex PCBs.

Unique Advantages

  • High logic density:  60,440 logic elements provide headroom for complex control, protocol handling, and custom accelerators.
  • Substantial on-chip memory:  Approximately 2.54 Mbits of embedded RAM for FIFOs, buffering, and low-latency data paths without external memory.
  • Versatile I/O resources:  364 I/O pins support diverse parallel and serial interfaces, simplifying board-level connectivity.
  • Family-level transceiver capability:  Stratix II GX family transceivers offer high-speed serial data rates and CDR/SERDES functionality for high-bandwidth links.
  • Compact, manufacturable package:  780-ball BGA (29 × 29) balances pin count and PCB real estate for production designs.
  • Commercial-grade qualification:  Rated for 0 °C to 85 °C operation to match standard commercial system environments.

Why Choose EP2SGX60DF780C5N?

EP2SGX60DF780C5N combines a large, scalable logic array and meaningful embedded memory with the Stratix II GX family’s high-speed transceiver architecture to address demanding digital and protocol-focused designs. Its mix of logic density, I/O capacity, and BGA packaging makes it appropriate for systems that require integration of complex logic, buffering, and high-speed links in a commercial-temperature environment.

For engineering teams building communications, backplane, or high-performance embedded systems, this device offers a platform that aligns performance-oriented architecture with the documented Stratix II GX family features and Intel’s device-level specifications.

Request a quote or submit an inquiry to receive pricing, availability, and additional technical support for EP2SGX60DF780C5N.

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