EP2SGX60DF780I4N

The EP2SGX60DF780I4N is a Stratix II GX family FPGA delivering a scalable, high-performance logic array optimized for high-speed serial connectivity and complex system integration. Built on the Stratix II GX architecture, the device targets communications, backplane, and protocol-bridging designs that require substantial logic capacity, embedded memory, and advanced transceiver capabilities described for the Stratix II GX series.

This device combines a large logic element count with on-chip RAM and industry-grade operating conditions to support demanding embedded and industrial applications where temperature range, power rails, and board-level packaging are key design considerations.

Key Features

• Logic Capacity  60,440 logic elements for implementing complex logic, state machines, and custom accelerators.
• Embedded Memory  Approximately 2.544 Mbits of on-chip RAM to support FIFOs, buffers, and dual-port memory architectures.
• I/O Count & Packaging  364 user I/O pins in a 780-BBGA package (supplier package: 780-FBGA, 29×29 mm) with surface-mount mounting for dense board designs.
• Stratix II GX Transceiver Technology  Stratix II GX family transceivers provide high-speed serial operation up to 6.375 Gbps with clock-data recovery (CDR) and SERDES capabilities (series-level feature set).
• Clocking & DSP  Series-level architecture includes enhanced PLLs and high-speed DSP blocks for multiplier and MAC functions (refer to Stratix II GX family documentation for detailed capabilities).
• Power & Supply  Specified core voltage operating range from 1.15 V to 1.25 V.
• Industrial Temperature Range  Rated for operation from −40°C to 100°C, suitable for industrial environments.
• Compliance  RoHS compliant.

Typical Applications

• High-Speed Backplanes  Leverages the Stratix II GX family’s high-speed transceiver capabilities and large logic fabric to implement protocol framing, switching, and lane aggregation for backplane links.
• Chip-to-Chip Interfaces  Supports SERDES-based, source-synchronous links and on-chip memory buffering to bridge high-speed interfaces between ASICs, processors, and memory subsystems.
• Communications Protocol Bridging  Implements protocol conversion, encapsulation, and timing recovery thanks to integrated transceiver features and abundant logic resources.
• Memory Interface Controllers  Provides the logic and embedded RAM needed to build controllers and buffering for high-speed external memories supported by the Stratix II GX family.

Unique Advantages

• High Logic Density: 60,440 logic elements enable large, complex designs without immediate need for multiple devices.
• Significant On-Chip Memory: Approximately 2.544 Mbits of embedded RAM simplifies implementation of FIFOs and buffering for high-throughput data paths.
• Advanced Serial Connectivity (Series-Level): Stratix II GX transceiver technology (up to 6.375 Gbps) supports a wide range of serial protocols and dynamic reconfiguration options described for the family.
• Industrial Robustness: Rated from −40°C to 100°C and RoHS compliant for reliable operation in industrial deployments.
• Compact, High-Pin Package: 780-BBGA (780-FBGA supplier package, 29×29 mm) offers a high I/O count in a compact surface-mount package for dense board integration.
• Deterministic Power Envelope: Defined core supply range (1.15 V to 1.25 V) provides clear power budgeting for system-level design.

Why Choose EP2SGX60DF780I4N?

The EP2SGX60DF780I4N positions designers to leverage the Stratix II GX family’s combination of high logic density, embedded memory, and series-level transceiver technology for demanding communications and industrial applications. Its industrial temperature rating, defined core supply range, and high I/O count make it a practical choice for systems requiring sustained performance under real-world operating conditions.

This device is well suited for engineering teams building high-speed interfaces, protocol bridges, and memory controllers who need predictable electrical and thermal characteristics, substantial on-chip resources, and a compact BGA package for board-level integration.

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