EP2SGX60DF780I4

The EP2SGX60DF780I4 is an Intel Stratix® II GX field-programmable gate array supplied in a 780-BBGA package and targeted at industrial-grade applications. The device combines a scalable, high-performance logic array with support for the Stratix II GX family architecture, offering a balance of logic density, embedded memory, and I/O capability for communications, protocol bridging, and high-speed interface designs.

With 60,440 logic elements and approximately 2.54 Mbits of embedded RAM, this surface-mount FPGA supports designs that require substantial on-chip logic and memory while operating from a 1.15 V to 1.25 V core supply and across an industrial temperature range of −40°C to 100°C.

Key Features

• Logic Capacity  60,440 logic elements suitable for complex digital designs and system integration.
• Embedded Memory  Approximately 2.54 Mbits of on-chip RAM to implement buffers, FIFOs, and local storage.
• I/O Density  364 I/O pins enable broad interfacing to external devices and high pin-count system requirements.
• Power and Mounting  Surface-mount package with a core supply range of 1.15 V to 1.25 V to match modern FPGA power delivery designs.
• Industrial Temperature Range  Rated for operation from −40°C to 100°C to meet industrial environment requirements.
• Package  780-ball BGA (supplier package: 780-FBGA, 29 × 29 mm) for high-density PCB layouts.
• RoHS Compliant  Manufactured to meet RoHS environmental requirements.
• Stratix II GX Family Capabilities  As part of the Stratix II GX family, devices in this family include high-speed serial transceivers (series-level feature) with clock and data recovery and SERDES capability up to 6.375 Gbps per channel, advanced TriMatrix memory architecture, dedicated DSP blocks, and multiple enhanced PLLs (family-level features included in the device data).

Typical Applications

• High-speed communications  Implement protocol bridging and data-path processing where on-chip memory and logic density are required; the Stratix II GX family supports high-speed serial transceivers for multi-gigabit links.
• Backplane interfaces  Use the device for backplane and board-to-board interfacing leveraging the family’s support for high-speed serial links and source-synchronous I/O.
• Memory controller and buffering  Deploy the FPGA for controllers and buffering of external memories, using the device’s embedded RAM and support for high-speed external memory interfaces (family-level support documented in the device data).
• Signal processing and DSP  Leverage the family’s high-speed DSP resources and multiplier blocks for filters, FIR implementations, and real-time processing tasks.

Unique Advantages

• Substantial logic density: 60,440 logic elements provide headroom for complex control, protocol, and processing functions without immediate need for external logic.
• Integrated embedded memory: Approximately 2.54 Mbits of on-chip RAM reduces external memory dependency for many buffering and FIFO applications.
• High I/O count: 364 I/Os simplify board-level routing and reduce the need for expansion glue logic when interfacing with multiple peripherals and high-pin-count connectors.
• Industrial-rated operation: −40°C to 100°C operational range supports deployment in demanding industrial environments.
• Compact, high-density package: 780-BBGA (29 × 29 mm supplier package) supports dense PCB designs while providing the connectivity required for complex systems.
• Family-level high-speed features: Access to Stratix II GX family capabilities—such as high-speed serial transceivers, TriMatrix memory architecture, DSP blocks, and enhanced PLLs—enables designs that require high-bandwidth serial links and advanced clocking options (as documented in the device family data).

Why Choose EP2SGX60DF780I4?

The EP2SGX60DF780I4 positions itself as a robust FPGA option for industrial systems that demand a combination of significant logic resources, on-chip memory, and broad I/O. Its Stratix II GX family heritage brings architecture-level features—high-speed serial capability, DSP resources, and flexible clocking—that help accelerate development of communications, protocol-bridging, and high-performance interfacing solutions.

For engineering teams building systems that require reliable operation across industrial temperature ranges and a high-density BGA footprint, this device offers a clear balance of integration and scalability while remaining RoHS compliant.

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