EP2SGX60DF780C4N

IC FPGA 364 I/O 780FBGA
Part Description

Stratix® II GX Field Programmable Gate Array (FPGA) IC 364 2544192 60440 780-BBGA

Quantity 888 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package780-FBGA (29x29)GradeCommercialOperating Temperature0°C – 85°C
Package / Case780-BBGANumber of I/O364Voltage1.15 V - 1.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs3022Number of Logic Elements/Cells60440
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits2544192

Overview of EP2SGX60DF780C4N – Stratix® II GX FPGA, 60,440 Logic Elements, 364 I/O, 780-BBGA

The EP2SGX60DF780C4N is a Stratix® II GX field programmable gate array (FPGA) offered in a 780-BBGA package for surface-mount assembly. It combines a high-capacity logic array with embedded memory and the Stratix II GX family’s high-speed serial transceiver technology to address demanding communications and interface applications.

Typical use cases include high-speed backplane interfaces, chip-to-chip bridging, and communications protocol handling where a mix of programmable logic density, on-chip memory, and advanced transceiver features are required. The device targets commercial-grade designs operating at standard commercial temperatures and RoHS-compliant manufacturing flows.

Key Features

  • Logic Capacity  60,440 logic elements to implement complex custom logic, state machines, and packet-processing pipelines.
  • Embedded Memory  Approximately 2.544 Mbits of on-chip RAM for FIFOs, buffers, and dual-port memory structures; TriMatrix memory architecture supported by the Stratix II GX family.
  • High-Speed Transceiver Architecture  Stratix II GX family transceiver technology supports full-duplex serial operation from 600 Mbps up to 6.375 Gbps with clock and data recovery (CDR) and SERDES capability for high-bandwidth serial links.
  • I/O  364 user I/O pins in a 780-BBGA footprint; family-level support for numerous single-ended and differential I/O standards and source-synchronous interfaces.
  • DSP and Clocking Resources  Family features include high-speed DSP blocks for multiplier and MAC implementations and up to four enhanced PLLs offering programmable bandwidth, spread spectrum support, and real-time reconfiguration.
  • Power and Packaging  Core voltage supply range of 1.15 V to 1.25 V. Supplied in a 780-FBGA (29 × 29 mm) package, surface-mount mounting type suitable for standard board assembly.
  • Commercial Temperature Grade  Rated for operation from 0 °C to 85 °C and manufactured to be RoHS-compliant.

Typical Applications

  • High‑Speed Backplane Interfaces  Use the device’s high-speed serial transceivers and large logic capacity to implement multi‑lane backplane protocols and protocol bridging.
  • Chip‑to‑Chip Connectivity  Implement SERDES-based links and source-synchronous interfaces for high-bandwidth board-level communication between ASICs, processors, and memory subsystems.
  • Communications Protocol Bridging  Deploy on systems that require flexible protocol conversion or aggregation using on-chip memory and DSP resources.
  • High‑Performance Embedded Systems  Leverage DSP blocks and abundant logic elements for real‑time signal processing, packet inspection, and custom accelerators within commercial-grade products.

Unique Advantages

  • High Logic Density: 60,440 logic elements enable implementation of sizable, integrated designs without immediate need for external logic devices.
  • Integrated High‑Speed SerDes: Family transceiver technology supporting up to 6.375 Gbps simplifies design of high-bandwidth serial links and reduces external SERDES components.
  • Substantial On‑Chip Memory: Approximately 2.544 Mbits of RAM supports FIFOs, buffering, and dual-port memory functions to streamline data-path designs.
  • Flexible Clocking and DSP Support: Enhanced PLLs and dedicated DSP resources support complex timing topologies and arithmetic-intensive functions with reduced external logic.
  • Production‑Ready Packaging: 780-BBGA (780-FBGA, 29×29 mm) surface-mount package and RoHS compliance facilitate integration into standardized commercial manufacturing flows.

Why Choose EP2SGX60DF780C4N?

The EP2SGX60DF780C4N combines substantial programmable logic, embedded memory, and the Stratix II GX family’s high-speed transceiver capabilities in a production-ready 780-BBGA package. It is well suited for commercial designs that require a balance of logic density, on-chip RAM, and serial link performance within a commercial temperature range.

Choose this device when you need a scalable FPGA platform that supports high-bandwidth serial interfaces and significant on-chip resources, backed by the Stratix II GX device family architecture and associated configuration and timing resources.

If you would like pricing, availability, or a formal quote for EP2SGX60DF780C4N, please submit a request or contact sales to obtain a quote and technical support information.

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