EP2SGX60DF780C4N
| Part Description |
Stratix® II GX Field Programmable Gate Array (FPGA) IC 364 2544192 60440 780-BBGA |
|---|---|
| Quantity | 888 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 780-FBGA (29x29) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 780-BBGA | Number of I/O | 364 | Voltage | 1.15 V - 1.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 3022 | Number of Logic Elements/Cells | 60440 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 2544192 |
Overview of EP2SGX60DF780C4N – Stratix® II GX FPGA, 60,440 Logic Elements, 364 I/O, 780-BBGA
The EP2SGX60DF780C4N is a Stratix® II GX field programmable gate array (FPGA) offered in a 780-BBGA package for surface-mount assembly. It combines a high-capacity logic array with embedded memory and the Stratix II GX family’s high-speed serial transceiver technology to address demanding communications and interface applications.
Typical use cases include high-speed backplane interfaces, chip-to-chip bridging, and communications protocol handling where a mix of programmable logic density, on-chip memory, and advanced transceiver features are required. The device targets commercial-grade designs operating at standard commercial temperatures and RoHS-compliant manufacturing flows.
Key Features
- Logic Capacity 60,440 logic elements to implement complex custom logic, state machines, and packet-processing pipelines.
- Embedded Memory Approximately 2.544 Mbits of on-chip RAM for FIFOs, buffers, and dual-port memory structures; TriMatrix memory architecture supported by the Stratix II GX family.
- High-Speed Transceiver Architecture Stratix II GX family transceiver technology supports full-duplex serial operation from 600 Mbps up to 6.375 Gbps with clock and data recovery (CDR) and SERDES capability for high-bandwidth serial links.
- I/O 364 user I/O pins in a 780-BBGA footprint; family-level support for numerous single-ended and differential I/O standards and source-synchronous interfaces.
- DSP and Clocking Resources Family features include high-speed DSP blocks for multiplier and MAC implementations and up to four enhanced PLLs offering programmable bandwidth, spread spectrum support, and real-time reconfiguration.
- Power and Packaging Core voltage supply range of 1.15 V to 1.25 V. Supplied in a 780-FBGA (29 × 29 mm) package, surface-mount mounting type suitable for standard board assembly.
- Commercial Temperature Grade Rated for operation from 0 °C to 85 °C and manufactured to be RoHS-compliant.
Typical Applications
- High‑Speed Backplane Interfaces Use the device’s high-speed serial transceivers and large logic capacity to implement multi‑lane backplane protocols and protocol bridging.
- Chip‑to‑Chip Connectivity Implement SERDES-based links and source-synchronous interfaces for high-bandwidth board-level communication between ASICs, processors, and memory subsystems.
- Communications Protocol Bridging Deploy on systems that require flexible protocol conversion or aggregation using on-chip memory and DSP resources.
- High‑Performance Embedded Systems Leverage DSP blocks and abundant logic elements for real‑time signal processing, packet inspection, and custom accelerators within commercial-grade products.
Unique Advantages
- High Logic Density: 60,440 logic elements enable implementation of sizable, integrated designs without immediate need for external logic devices.
- Integrated High‑Speed SerDes: Family transceiver technology supporting up to 6.375 Gbps simplifies design of high-bandwidth serial links and reduces external SERDES components.
- Substantial On‑Chip Memory: Approximately 2.544 Mbits of RAM supports FIFOs, buffering, and dual-port memory functions to streamline data-path designs.
- Flexible Clocking and DSP Support: Enhanced PLLs and dedicated DSP resources support complex timing topologies and arithmetic-intensive functions with reduced external logic.
- Production‑Ready Packaging: 780-BBGA (780-FBGA, 29×29 mm) surface-mount package and RoHS compliance facilitate integration into standardized commercial manufacturing flows.
Why Choose EP2SGX60DF780C4N?
The EP2SGX60DF780C4N combines substantial programmable logic, embedded memory, and the Stratix II GX family’s high-speed transceiver capabilities in a production-ready 780-BBGA package. It is well suited for commercial designs that require a balance of logic density, on-chip RAM, and serial link performance within a commercial temperature range.
Choose this device when you need a scalable FPGA platform that supports high-bandwidth serial interfaces and significant on-chip resources, backed by the Stratix II GX device family architecture and associated configuration and timing resources.
If you would like pricing, availability, or a formal quote for EP2SGX60DF780C4N, please submit a request or contact sales to obtain a quote and technical support information.

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