EP2SGX60DF780C3

The EP2SGX60DF780C3 is an Intel Stratix® II GX field-programmable gate array supplied in a 780-BBGA package (supplier package: 780-FBGA, 29×29). It combines a scalable, high-performance logic array with the Stratix II GX family’s high-speed transceiver architecture and on-chip memory resources.

With approximately 60,440 logic elements and roughly 2.544 Mbits of embedded RAM, 364 user I/Os, and a supply range of 1.15 V to 1.25 V, this commercial-grade FPGA is positioned for high-speed communication, protocol bridging and backplane or chip-to-chip interface designs while meeting RoHS requirements.

Key Features

• Core density  Approximately 60,440 logic elements and 3,022 logic array blocks to implement complex digital functions and control logic.
• Embedded memory  Approximately 2.544 Mbits of on-chip RAM for FIFOs, buffers and packet/stream storage.
• I/O capability  364 user I/Os supporting a variety of single-ended and differential standards as provided by the Stratix II GX family.
• Transceiver-enabled architecture  Built on the Stratix II GX family architecture which integrates high-speed serial transceiver technology for advanced serial links and protocol support.
• Clocking and DSP support  Family features include multiple global and regional clock networks and dedicated DSP resources for multiply-accumulate and FIR functions.
• Power and supply  Device operates from a core supply in the 1.15 V to 1.25 V range, enabling use with standard 1.2 V FPGA power domains.
• Package and mounting  780-BBGA package (supplier device package: 780-FBGA, 29×29) for surface-mount PCB assembly and compact board-level integration.
• Commercial grade and environmental  Rated for 0 °C to 85 °C operating temperature and RoHS compliant for lead-free assembly requirements.

Typical Applications

• High‑speed backplane interfaces  Use the device’s Stratix II GX transceiver architecture and dense logic to implement protocol bridging and high-throughput switching fabric endpoints.
• Chip-to-chip and board-to-board links  Implement serialized link endpoints and protocol adaptors where integrated transceiver technology and programmable logic are required.
• Communications equipment  Deploy the FPGA for packet buffering, protocol handling and interface bridging in telecommunications and networking systems.
• Memory interface controllers  Leverage abundant embedded RAM and logic resources to implement controllers and interface logic for external DRAM or SRAM subsystems.

Unique Advantages

• High logic capacity: Around 60,440 logic elements provide room for complex state machines, protocol stacks and custom processing pipelines.
• Substantial on-chip memory: Approximately 2.544 Mbits of embedded RAM reduces external memory dependence for packet buffering and FIFOs.
• Rich I/O count: 364 I/Os enable broad connectivity options for parallel interfaces, memory buses and mixed-signal front-ends.
• Family-level transceiver capability: Stratix II GX architecture delivers integrated serial link technology suitable for high-speed communications and protocol conversion tasks.
• Standard industrial packaging and RoHS compliance: 780-BBGA surface-mount package and RoHS status simplify PCB integration and meet lead-free assembly requirements.
• Commercial operating range: 0 °C to 85 °C rating aligns with a wide range of commercial electronics and communications equipment use cases.

Why Choose EP2SGX60DF780C3?

The EP2SGX60DF780C3 brings a balanced combination of logic density, embedded memory and Stratix II GX transceiver-capable architecture in a compact 780-BBGA package. It suits designs that require programmable, high-throughput interfaces, protocol bridging, and significant on-chip buffering without relying solely on external resources.

Its commercial-grade temperature rating, surface-mount package, and RoHS compliance make it appropriate for production systems in communications, networking and high-speed data applications where vendor-supported FPGA technology and a rich feature set are required.

Request a quote or submit an inquiry for pricing and availability of EP2SGX60DF780C3 to evaluate it for your next high-speed FPGA design.