EP2SGX60CF780C4N

The EP2SGX60CF780C4N is a Stratix® II GX Field Programmable Gate Array (FPGA) in a 780‑BBGA package designed for high‑performance, high‑integration digital designs. Built on the Stratix II GX family architecture, this device pairs a large logic array with substantial embedded memory and a high I/O count to address communications, interface, and protocol‑bridging applications.

Its combination of approximately 60,440 logic elements, roughly 2.54 Mbits of embedded RAM, and 364 I/O pins provides the resources needed for complex FPGA implementations while operating from a 1.15 V to 1.25 V core supply in commercial temperature environments.

Key Features

• Logic Capacity — Approximately 60,440 logic elements for implementing complex digital logic and control functions.
• Embedded Memory — Approximately 2.54 Mbits of on‑chip RAM to support FIFOs, buffers, and on‑chip data storage.
• I/O Resources — 364 I/O pins to support wide parallel interfaces and multiple high‑speed signals.
• Power and Operating Range — Core voltage supply range of 1.15 V to 1.25 V; commercial grade with an operating temperature range of 0 °C to 85 °C.
• Package — 780‑BBGA package (supplier device package: 780‑FBGA, 29×29), surface‑mount mounting type for board‑level integration.
• Stratix II GX Family Transceiver Technology — Family documentation describes high‑speed serial transceivers with clock and data recovery (CDR), supporting full‑duplex operation from 600 Mbps up to 6.375 Gbps (family feature).
• Advanced Fabric Features (Family) — Stratix II GX devices include TriMatrix memory for multiple RAM block sizes, high‑speed DSP blocks, enhanced PLLs, and flexible clocking resources (family features described in the device handbook).
• Standards and Protocol Support (Family) — Family documentation lists support for a range of serial protocols and high‑speed external memories as applicable to Stratix II GX devices.
• RoHS Compliant — Meets RoHS environmental compliance requirements.

Typical Applications

• Communications Infrastructure — Implements protocol bridging and high‑speed interface logic where large logic capacity and embedded memory are required.
• High‑Speed Backplane and Board‑Level Interfaces — Supports designs that need substantial I/O and the Stratix II GX family’s transceiver technology for high‑bandwidth links.
• Chip‑to‑Chip and System Integration — Provides a scalable logic array and on‑chip memory for glue logic, data buffering, and interface control between subsystems.

Unique Advantages

• High Logic Density: Approximately 60,440 logic elements enable implementation of complex datapaths and control logic in a single device, reducing board count.
• Substantial On‑Chip Memory: Approximately 2.54 Mbits of embedded RAM supports FIFOs, packet buffering, and other memory‑intensive functions without external memory.
• Large I/O Count: 364 I/O pins provide flexibility for wide parallel buses and multiple interface connections, simplifying system routing.
• Family‑Level High‑Speed Transceivers: Stratix II GX family transceiver features (including CDR and up to 6.375 Gbps operation) enable high‑bandwidth serial links where applicable to the device family.
• Commercial Temperature and RoHS Compliance: Commercial grade operation from 0 °C to 85 °C and RoHS compliance for standard electronic product environments.
• Compact Surface‑Mount Package: 780‑BBGA (780‑FBGA 29×29) provides a high‑pin‑count solution in a compact form factor for dense PCB layouts.

Why Choose EP2SGX60CF780C4N?

The EP2SGX60CF780C4N positions itself as a high‑capacity Stratix II GX FPGA option for designers who require a large logic fabric, significant embedded memory, and extensive I/O in a compact BGA package. Its specification set supports complex interface, buffering, and protocol control tasks commonly found in communications and system integration projects.

Choosing this device provides a pathway to leverage the Stratix II GX family architecture and its family‑documented transceiver and fabric features, making it well suited for teams aiming to balance performance, integration density, and board‑level design compactness.

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