EP2SGX60CF780C3N

The EP2SGX60CF780C3N is a Stratix® II GX family field-programmable gate array (FPGA) manufactured by Intel, offered in a 780‑ball BGA package. It pairs a high-density logic array with the Stratix II GX architecture to address demanding digital design requirements.

Designed for communications and high-performance system designs, this device targets applications such as high-speed backplane interfaces, chip-to-chip links, and protocol bridging where significant logic capacity, on-chip memory and extensive I/O are required. Its combination of high logic element count, embedded RAM and commercial-grade operating range delivers a balance of integration and performance for mainstream systems.

Key Features

• High-density logic — 60,440 logic elements to implement complex digital functions and large-scale custom logic.
• Embedded memory — approximately 2.54 Mbits of on-chip RAM for FIFOs, buffers and scratch storage.
• I/O capacity — 364 user I/O pins suitable for wide parallel interfaces and multiple external connections.
• Stratix II GX family transceiver architecture — family-level features include high-speed serial transceivers with clock and data recovery and embedded SERDES for high-bandwidth serial links (family characteristics described in the Stratix II GX device handbook).
• Power and supply — core voltage operating range from 1.15 V to 1.25 V to match system power domains.
• Package and assembly — supplied in a 780‑BBGA (780‑FBGA, 29 × 29 mm supplier package) surface-mount package for high-density PCB designs.
• Commercial temperature grade — rated for 0 °C to 85 °C operation for standard commercial applications.
• Standards and IP support — Stratix II GX family supports Altera MegaCore® functions and AMPP megafunctions for accelerated subsystem integration (family-level capability).
• RoHS compliant — complies with RoHS environmental requirements.

Typical Applications

• High-speed backplane interfaces — implement wide parallel or serialized backplane protocols using the device’s logic density and family transceiver capabilities.
• Chip-to-chip communication — enable protocol bridging and custom link logic between ASICs, processors and memory subsystems.
• Communications protocol bridging — integrate protocol conversion, framing and buffering functions leveraging large on-chip RAM and logic resources.
• High-performance system prototyping — use the device’s capacity for validating complex system-level designs and IP integration.

Unique Advantages

• Substantial logic capacity: 60,440 logic elements let you implement large, consolidated digital designs that reduce the need for multiple devices.
• Significant embedded memory: approximately 2.54 Mbits of on-chip RAM supports FIFOs, packet buffering and temporary data storage without extensive external memory.
• Large I/O complement: 364 I/Os provide flexibility for wide buses, parallel interfaces and multiple peripheral connections.
• Low-voltage core operation: 1.15–1.25 V supply range enables compatibility with modern low-voltage system domains.
• High-density BGA packaging: 780‑BBGA (29 × 29 mm) supports compact board layouts while delivering robust signal routing for complex systems.
• Family-level transceiver capabilities: part of the Stratix II GX family that includes high-speed serial transceiver technology for scalable serial bandwidth (family-level capability described in the device handbook).

Why Choose EP2SGX60CF780C3N?

The EP2SGX60CF780C3N provides a balanced combination of high logic density, substantial embedded RAM and a large I/O count in a commercial-grade, surface-mount BGA package. As a member of the Stratix II GX family from Intel, it aligns with the family’s architecture and transceiver capabilities, making it suitable for high-performance communications and interface applications.

Engineers designing protocol bridges, backplane interfaces or systems requiring consolidated logic and on-chip memory will find this device suited to reduce board-level complexity while maintaining design flexibility. Its commercial temperature rating and RoHS compliance make it appropriate for mainstream production deployments where verified Intel FPGA technology is required.

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