EP2SGX60CF780C5N

The EP2SGX60CF780C5N is a Stratix® II GX-series FPGA in a 780-ball BGA package, designed for high-performance, programmable logic implementations. It integrates a dense logic array and embedded RAM to address communications, protocol bridging, and high-speed system functions where configurable logic and on-chip memory are required.

Built for applications that require substantial logic capacity and I/O count, this commercial-grade, surface-mount device offers 60,440 logic elements, approximately 2.54 Mbits of embedded memory, and 364 I/O pins, operating from a 1.15 V to 1.25 V supply across a 0 °C to 85 °C range.

Key Features

• Logic Capacity  Provides 60,440 logic elements for complex custom logic, protocol handling, and glue-logic implementations.
• Embedded Memory  Approximately 2.54 Mbits of on-chip RAM suitable for FIFOs, buffers, and local data storage.
• I/O and Packaging  364 I/O pins in a 780-ball BGA package; surface-mount mounting for high-density board designs. Supplier device package listed as 780-FBGA (29×29).
• Voltage and Temperature  Operates from 1.15 V to 1.25 V with a commercial operating temperature range of 0 °C to 85 °C.
• High-speed Serial Capability (Series-level)  Stratix II GX family devices include high-speed serial transceivers with clock-and-data recovery supporting data rates up to 6.375 Gbps (series-level feature as documented in the device family datasheet).
• TriMatrix Memory and DSP Support (Series-level)  Family architecture includes TriMatrix memory blocks and high-speed DSP blocks for multipliers and MAC functions (series-level feature described in the datasheet).
• Clocking and PLLs (Series-level)  Stratix II GX devices support multiple global/regional clock networks and up to four enhanced PLLs for flexible clocking and spread-spectrum options (series-level feature).
• Configuration and Security (Series-level)  Device family supports configuration bitstream encryption and remote configuration update mechanisms (series-level feature).
• Regulatory  RoHS compliant.

Typical Applications

• High-speed communications  Use in backplane interfaces and protocol bridging where the Stratix II GX family’s high-speed transceiver capability and large logic fabric support multi-gigabit links and protocol conversion.
• Chip-to-chip interconnect  Deploy as a programmable interface between ASICs, processors, and high-speed peripherals, leveraging dense logic and embedded RAM for buffering and alignment.
• Networking and switching  Suitable for implementing packet handling, buffering, and custom forwarding logic using on-chip memory and DSP resources (as provided by the Stratix II GX architecture).

Unique Advantages

• High logic density: 60,440 logic elements enable substantial on-chip implementation of complex state machines, protocol stacks, and data-path logic, reducing external glue components.
• Significant embedded RAM: Approximately 2.54 Mbits of on-chip memory supports FIFOs, packet buffering, and local scratch storage to simplify board-level memory architectures.
• Extensive I/O: 364 I/O pins in a compact 780-BBGA footprint ease high-pin-count interfacing without sacrificing board density.
• Series-level transceiver performance: The Stratix II GX family’s high-speed transceivers and CDR technology (up to 6.375 Gbps) enable multi-gigabit serial links and flexible protocol support where required by the design.
• Configurable clocking and DSP support: Family features such as multiple clock networks, enhanced PLLs, and dedicated DSP blocks allow designers to implement high-performance data-paths and precise timing strategies.
• Commercial-grade and compliant: Surface-mount 780-BBGA packaging, commercial temperature rating, and RoHS compliance make the device appropriate for a wide range of commercial systems.

Why Choose EP2SGX60CF780C5N?

The EP2SGX60CF780C5N combines substantial logic capacity, embedded memory, and extensive I/O in a single Stratix II GX-series FPGA package, making it well suited for communications, protocol bridging, and other high-performance programmable logic tasks. Series-level architecture features—such as high-speed transceivers, TriMatrix memory, DSP blocks, and flexible PLL-based clocking—provide a capable platform for designs that require both speed and integration.

This device is aimed at system designers and engineers who need a commercially graded FPGA with verified family capabilities and a compact BGA footprint, offering a balance of density, on-chip memory, and I/O for medium- to high-complexity designs.

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