EP2SGX60DF780C4

The EP2SGX60DF780C4 is a Stratix® II GX family field-programmable gate array (FPGA) offered in a 780‑BBGA package. It pairs a high-density logic array with on-chip memory and the Stratix II GX family’s high-speed serial transceiver architecture to address demanding communications and interface applications.

This device is aimed at designs requiring significant logic capacity, embedded RAM, and flexible I/O in a surface-mount 780‑FBGA (29×29) package. Typical markets include high-speed communications, protocol bridging, and backplane or chip-to-chip interface applications that benefit from scalable FPGA resources and advanced transceiver features.

Key Features

• Logic Capacity — Approximately 60,440 logic elements provide substantial programmable logic for complex digital designs.
• Embedded Memory — Approximately 2.54 Mbits of on-chip RAM for FIFOs, buffers, and data storage close to logic to reduce external memory dependence.
• Transceiver Family Features — Stratix II GX family includes high-speed serial transceivers with clock and data recovery and support for data rates up to 6.375 Gbps, providing robust serial bandwidth and protocol flexibility.
• DSP and Clock Resources — Family features include dedicated DSP blocks for multiply-accumulate implementations and enhanced PLLs for advanced clocking, clock switching, and real-time reconfiguration.
• I/O Density & Standards — 364 user I/Os in a variety of single-ended and differential standards to support wide-ranging interface needs and external memory buses.
• Package & Mounting — Supplied in a 780‑BBGA (supplier package 780‑FBGA, 29×29) form factor and intended for surface-mount assembly.
• Power — Core supply voltage range of 1.15 V to 1.25 V to match system power domains and optimize performance.
• Commercial Grade — Rated for operation from 0 °C to 85 °C for commercial applications.
• Compliance — RoHS compliant for environmental and assembly compatibility.

Typical Applications

• High‑Speed Backplane Interfaces — Use the device’s Stratix II GX transceiver family capabilities and high I/O count for multi-gigabit backplane links and protocol bridging.
• Communications Protocol Bridging — Implement protocol translation and gateway functions leveraging the logic density and embedded RAM for buffering and packet handling.
• Chip‑to‑Chip High‑Speed Links — Support for high-speed serial links and flexible I/O makes this FPGA suitable for chip-to-chip serial and parallel interfaces.
• External Memory Interfaces — On-chip memory combined with abundant I/O supports designs interfacing to DDR/QDR/SDR memories where local buffering and timing control are required.

Unique Advantages

• High Integration: Large logic element count and on-chip memory reduce reliance on external components and simplify BOM for complex systems.
• High-Speed Serial Capability: Stratix II GX family transceiver features enable multi-gigabit serial links and flexible protocol support for communications designs.
• Flexible Clock and DSP Resources: Enhanced PLLs and DSP blocks (family features) provide the clocking and signal-processing building blocks needed for demanding real-time tasks.
• Compact, Surface‑Mount Package: 780‑BBGA / 780‑FBGA (29×29) packaging balances high I/O density with a board-friendly surface-mount form factor.
• Commercial Temperature Range & RoHS Compliance: Designed for commercial deployments with a 0 °C to 85 °C operating window and RoHS compliance for modern manufacturing flows.
• Design Ecosystem Support: Stratix II GX family documentation and megafunction support facilitate integration of IP, configuration security, and remote update capabilities.

Why Choose EP2SGX60DF780C4?

The EP2SGX60DF780C4 delivers a balanced combination of logic capacity, embedded memory, and the Stratix II GX family’s high-speed serial architecture in a compact 780‑BBGA package. It is well suited to commercial communications and interface applications that need substantial programmable resources, flexible I/O, and advanced transceiver capabilities.

For engineering teams building protocol bridges, backplane interfaces, and high-speed links, this device offers scalable resources and family-level features—such as DSP blocks and advanced PLLs—that help shorten development time and consolidate system functionality.

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