EP2SGX60CF780C5

The EP2SGX60CF780C5 is a Stratix® II GX field programmable gate array (FPGA) in a 780-BBGA package, offering 60,440 logic elements and approximately 2.54 Mbits of embedded memory. Built on the Stratix II GX architecture, this commercial-grade, surface-mount device combines high logic density, a large I/O count, and the series’ high-speed serial transceiver capabilities for demanding communications and interface applications.

Typical use cases include high-speed backplane interfaces, chip-to-chip bridging, and communications protocol implementation where a combination of logic capacity, on-chip memory, and multi-Gbps serial links is required.

Key Features

• Logic Capacity — 60,440 logic elements to implement complex logic, state machines, and custom datapaths.
• Embedded Memory — Approximately 2.54 Mbits of on-chip RAM for FIFOs, buffers, and packet/data buffering.
• High-Speed Transceivers (series capability) — Stratix II GX devices include high-speed serial transceivers with clock and data recovery supporting 600 Mbps to 6.375 Gbps full-duplex operation per channel; devices in the family are available with 4 to 20 transceiver channels.
• I/O Density — 364 user I/O pins to support wide parallel interfaces and multiple high-speed links.
• DSP and Clock Resources (series capability) — High-speed DSP blocks for multipliers and MAC functions and up to 16 global clock networks (series features described in the Stratix II GX documentation).
• Configuration & Security (series capability) — Supports configuration bitstream encryption and remote configuration updates as part of the Stratix II GX feature set.
• Package & Mounting — 780-BBGA (supplier device package: 780-FBGA, 29×29) for surface-mount PCB assembly.
• Power and Temperature — Core supply range 1.15 V to 1.25 V; commercial operating range 0 °C to 85 °C.
• RoHS Compliance — Device is RoHS compliant.

Typical Applications

• High-Speed Networking — Implements protocol bridging and serial link endpoints using the Stratix II GX transceiver capabilities for multi-Gbps links.
• Backplane and Board-Level Interfaces — Provides the logic density and I/O count needed for complex backplane protocol handling and wide parallel interfaces.
• Chip-to-Chip Communication — Supports high-throughput, low-latency links and on-chip buffering for chip-to-chip data transport and protocol translation.
• Custom DSP and Signal Processing — Uses the series’ DSP resources and embedded RAM to accelerate multiply-accumulate and FIR workloads within system constraints.

Unique Advantages

• High Logic Density: 60,440 logic elements enable large, integrated designs without partitioning across multiple devices.
• Substantial On-Chip Memory: Approximately 2.54 Mbits of embedded RAM reduces external memory dependence for buffering and FIFO implementations.
• Extensive I/O: 364 I/O pins provide flexibility for parallel interfaces, control signals, and multi-channel connectivity.
• Series-Level High-Speed Serial Support: Access to Stratix II GX transceiver technology (600 Mbps–6.375 Gbps per channel) enables integration of high-bandwidth serial protocols.
• Commercial Temperature Range: Rated 0 °C to 85 °C for applications targeting commercial environments.
• RoHS Compliant: Meets environmental requirements for lead-free assembly and compliance-driven designs.

Why Choose EP2SGX60CF780C5?

The EP2SGX60CF780C5 positions itself as a high-capacity Stratix II GX FPGA option combining 60,440 logic elements, substantial on-chip memory, and a large I/O complement in a 780-BBGA surface-mount package. Its core voltage range and commercial operating temperature make it suitable for a wide range of board-level designs that need integrated logic, buffering, and connectivity.

Designed for engineers implementing high-speed interfaces, protocol bridging, and DSP-accelerated functions, this device leverages the Stratix II GX feature set—high-speed transceivers, flexible clocking, and configuration security—to deliver a robust platform for complex FPGA-based systems.

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