EP2SGX60CF780C5

IC FPGA 364 I/O 780FBGA
Part Description

Stratix® II GX Field Programmable Gate Array (FPGA) IC 364 2544192 60440 780-BBGA

Quantity 149 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package780-FBGA (29x29)GradeCommercialOperating Temperature0°C – 85°C
Package / Case780-BBGANumber of I/O364Voltage1.15 V - 1.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs3022Number of Logic Elements/Cells60440
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits2544192

Overview of EP2SGX60CF780C5 – Stratix® II GX FPGA, 60,440 Logic Elements, 780-BBGA

The EP2SGX60CF780C5 is a Stratix® II GX field programmable gate array (FPGA) in a 780-BBGA package, offering 60,440 logic elements and approximately 2.54 Mbits of embedded memory. Built on the Stratix II GX architecture, this commercial-grade, surface-mount device combines high logic density, a large I/O count, and the series’ high-speed serial transceiver capabilities for demanding communications and interface applications.

Typical use cases include high-speed backplane interfaces, chip-to-chip bridging, and communications protocol implementation where a combination of logic capacity, on-chip memory, and multi-Gbps serial links is required.

Key Features

  • Logic Capacity — 60,440 logic elements to implement complex logic, state machines, and custom datapaths.
  • Embedded Memory — Approximately 2.54 Mbits of on-chip RAM for FIFOs, buffers, and packet/data buffering.
  • High-Speed Transceivers (series capability) — Stratix II GX devices include high-speed serial transceivers with clock and data recovery supporting 600 Mbps to 6.375 Gbps full-duplex operation per channel; devices in the family are available with 4 to 20 transceiver channels.
  • I/O Density — 364 user I/O pins to support wide parallel interfaces and multiple high-speed links.
  • DSP and Clock Resources (series capability) — High-speed DSP blocks for multipliers and MAC functions and up to 16 global clock networks (series features described in the Stratix II GX documentation).
  • Configuration & Security (series capability) — Supports configuration bitstream encryption and remote configuration updates as part of the Stratix II GX feature set.
  • Package & Mounting — 780-BBGA (supplier device package: 780-FBGA, 29×29) for surface-mount PCB assembly.
  • Power and Temperature — Core supply range 1.15 V to 1.25 V; commercial operating range 0 °C to 85 °C.
  • RoHS Compliance — Device is RoHS compliant.

Typical Applications

  • High-Speed Networking — Implements protocol bridging and serial link endpoints using the Stratix II GX transceiver capabilities for multi-Gbps links.
  • Backplane and Board-Level Interfaces — Provides the logic density and I/O count needed for complex backplane protocol handling and wide parallel interfaces.
  • Chip-to-Chip Communication — Supports high-throughput, low-latency links and on-chip buffering for chip-to-chip data transport and protocol translation.
  • Custom DSP and Signal Processing — Uses the series’ DSP resources and embedded RAM to accelerate multiply-accumulate and FIR workloads within system constraints.

Unique Advantages

  • High Logic Density: 60,440 logic elements enable large, integrated designs without partitioning across multiple devices.
  • Substantial On-Chip Memory: Approximately 2.54 Mbits of embedded RAM reduces external memory dependence for buffering and FIFO implementations.
  • Extensive I/O: 364 I/O pins provide flexibility for parallel interfaces, control signals, and multi-channel connectivity.
  • Series-Level High-Speed Serial Support: Access to Stratix II GX transceiver technology (600 Mbps–6.375 Gbps per channel) enables integration of high-bandwidth serial protocols.
  • Commercial Temperature Range: Rated 0 °C to 85 °C for applications targeting commercial environments.
  • RoHS Compliant: Meets environmental requirements for lead-free assembly and compliance-driven designs.

Why Choose EP2SGX60CF780C5?

The EP2SGX60CF780C5 positions itself as a high-capacity Stratix II GX FPGA option combining 60,440 logic elements, substantial on-chip memory, and a large I/O complement in a 780-BBGA surface-mount package. Its core voltage range and commercial operating temperature make it suitable for a wide range of board-level designs that need integrated logic, buffering, and connectivity.

Designed for engineers implementing high-speed interfaces, protocol bridging, and DSP-accelerated functions, this device leverages the Stratix II GX feature set—high-speed transceivers, flexible clocking, and configuration security—to deliver a robust platform for complex FPGA-based systems.

Request a quote or submit an inquiry to get pricing and availability for the EP2SGX60CF780C5.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1968


    Headquarters: Santa Clara, California, USA


    Employees: 130,000+


    Revenue: $54.23 Billion


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018


    Featured Products
    Latest News
    keyboard_arrow_up