EP2SGX60CF780C4
| Part Description |
Stratix® II GX Field Programmable Gate Array (FPGA) IC 364 2544192 60440 780-BBGA |
|---|---|
| Quantity | 1,545 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 780-FBGA (29x29) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 780-BBGA | Number of I/O | 364 | Voltage | 1.15 V - 1.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 3022 | Number of Logic Elements/Cells | 60440 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 2544192 |
Overview of EP2SGX60CF780C4 – Stratix® II GX Field Programmable Gate Array (FPGA) IC 364 2544192 60440 780-BBGA
The EP2SGX60CF780C4 is a commercial-grade Stratix® II GX FPGA manufactured by Intel. It implements a scalable, high-performance logic array with the Stratix II GX architecture and series-level high-speed serial transceiver technology.
Designed for communications and high-throughput digital systems, this device targets high-speed backplane interfaces, chip-to-chip links, and protocol-bridging applications where integrated transceivers, on-chip memory, and large logic capacity are required.
Key Features
- Logic Capacity — 60,440 logic elements, with 3,022 LABs supporting complex combinational and sequential logic implementations.
- Embedded Memory — Approximately 2.54 Mbits of on-chip RAM for buffering, FIFOs and packet/data storage.
- I/O — 364 I/O pins supporting a variety of single-ended and differential interfaces as enabled by the Stratix II GX architecture.
- High-speed Transceiver Architecture — Stratix II GX series transceivers providing clock-and-data recovery and support for serial data rates up to 6.375 Gbps (series capability described in the device handbook).
- DSP and Clocking Resources — Series-level features include dedicated high-speed DSP blocks for multiplies and MACs and up to four enhanced PLLs for advanced clock management and reconfiguration (as described in the Stratix II GX device documentation).
- Power and Supply — Core voltage supply range 1.15 V to 1.25 V for integration into modern low-voltage systems.
- Package — 780-ball FBGA package (29 × 29 mm supplier package) in a 780-BBGA case, optimized for high-density board-level integration.
- Operating Conditions — Commercial temperature grade with operating range 0 °C to 85 °C.
- Compliance — RoHS compliant.
Typical Applications
- High-speed Backplane Systems — Use the device's high logic capacity and Stratix II GX transceivers to implement protocol bridging and packet switching on system backplanes.
- Chip-to-Chip Interconnect — Leverage integrated transceivers and clock-data recovery for robust, high-bandwidth serial links between devices.
- Network and Telecom Interfaces — Implement protocol IP cores and SERDES-based interfaces such as PCI Express, Gigabit Ethernet, and other serial protocols supported by the Stratix II GX family.
- High-performance DSP and Filtering — Use on-chip DSP blocks and embedded memory to implement multiply-accumulate operations and FIR filtering in communications and signal processing designs.
Unique Advantages
- Substantial Logic Resources: 60,440 logic elements enable large, integrated digital designs without partitioning across multiple devices.
- Integrated High-speed Serial Capability: Stratix II GX transceiver technology supports multi-gigabit serial protocols and dynamic reconfiguration for flexible link management.
- On-chip Memory for Throughput: Approximately 2.54 Mbits of embedded RAM provides local buffering and FIFO capability to support high-bandwidth data paths.
- Flexible Clocking and DSP Support: Enhanced PLLs and dedicated DSP resources (series-level features) simplify clocking strategies and accelerate arithmetic-heavy functions.
- Compact, High-density Package: 780-ball FBGA (29×29) offers a dense footprint and 364 I/Os for complex board-level connectivity.
- Commercial Temperature and Low-voltage Core: 0 °C to 85 °C operating range and 1.15–1.25 V core supply make the device suitable for a wide range of commercial systems.
Why Choose EP2SGX60CF780C4?
The EP2SGX60CF780C4 brings Stratix II GX series capabilities into a single commercial-grade FPGA package, combining large logic capacity, multi-megabit embedded memory, and Stratix II GX transceiver architecture. It's suited for designers who need integrated high-speed serial links, significant on-chip resources for buffering and DSP, and a compact high-density package for complex systems.
Backed by Intel's Stratix II GX device documentation, this FPGA is appropriate for communications, networking, and high-throughput embedded designs where series-level transceiver and memory features accelerate development and system integration.
Request a quote or submit an inquiry to receive pricing, availability, and technical assistance for the EP2SGX60CF780C4. Our team can provide further configuration and procurement support to move your design forward.

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