EP2SGX60CF780C4

IC FPGA 364 I/O 780FBGA
Part Description

Stratix® II GX Field Programmable Gate Array (FPGA) IC 364 2544192 60440 780-BBGA

Quantity 1,545 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package780-FBGA (29x29)GradeCommercialOperating Temperature0°C – 85°C
Package / Case780-BBGANumber of I/O364Voltage1.15 V - 1.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs3022Number of Logic Elements/Cells60440
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits2544192

Overview of EP2SGX60CF780C4 – Stratix® II GX Field Programmable Gate Array (FPGA) IC 364 2544192 60440 780-BBGA

The EP2SGX60CF780C4 is a commercial-grade Stratix® II GX FPGA manufactured by Intel. It implements a scalable, high-performance logic array with the Stratix II GX architecture and series-level high-speed serial transceiver technology.

Designed for communications and high-throughput digital systems, this device targets high-speed backplane interfaces, chip-to-chip links, and protocol-bridging applications where integrated transceivers, on-chip memory, and large logic capacity are required.

Key Features

  • Logic Capacity — 60,440 logic elements, with 3,022 LABs supporting complex combinational and sequential logic implementations.
  • Embedded Memory — Approximately 2.54 Mbits of on-chip RAM for buffering, FIFOs and packet/data storage.
  • I/O — 364 I/O pins supporting a variety of single-ended and differential interfaces as enabled by the Stratix II GX architecture.
  • High-speed Transceiver Architecture — Stratix II GX series transceivers providing clock-and-data recovery and support for serial data rates up to 6.375 Gbps (series capability described in the device handbook).
  • DSP and Clocking Resources — Series-level features include dedicated high-speed DSP blocks for multiplies and MACs and up to four enhanced PLLs for advanced clock management and reconfiguration (as described in the Stratix II GX device documentation).
  • Power and Supply — Core voltage supply range 1.15 V to 1.25 V for integration into modern low-voltage systems.
  • Package — 780-ball FBGA package (29 × 29 mm supplier package) in a 780-BBGA case, optimized for high-density board-level integration.
  • Operating Conditions — Commercial temperature grade with operating range 0 °C to 85 °C.
  • Compliance — RoHS compliant.

Typical Applications

  • High-speed Backplane Systems — Use the device's high logic capacity and Stratix II GX transceivers to implement protocol bridging and packet switching on system backplanes.
  • Chip-to-Chip Interconnect — Leverage integrated transceivers and clock-data recovery for robust, high-bandwidth serial links between devices.
  • Network and Telecom Interfaces — Implement protocol IP cores and SERDES-based interfaces such as PCI Express, Gigabit Ethernet, and other serial protocols supported by the Stratix II GX family.
  • High-performance DSP and Filtering — Use on-chip DSP blocks and embedded memory to implement multiply-accumulate operations and FIR filtering in communications and signal processing designs.

Unique Advantages

  • Substantial Logic Resources: 60,440 logic elements enable large, integrated digital designs without partitioning across multiple devices.
  • Integrated High-speed Serial Capability: Stratix II GX transceiver technology supports multi-gigabit serial protocols and dynamic reconfiguration for flexible link management.
  • On-chip Memory for Throughput: Approximately 2.54 Mbits of embedded RAM provides local buffering and FIFO capability to support high-bandwidth data paths.
  • Flexible Clocking and DSP Support: Enhanced PLLs and dedicated DSP resources (series-level features) simplify clocking strategies and accelerate arithmetic-heavy functions.
  • Compact, High-density Package: 780-ball FBGA (29×29) offers a dense footprint and 364 I/Os for complex board-level connectivity.
  • Commercial Temperature and Low-voltage Core: 0 °C to 85 °C operating range and 1.15–1.25 V core supply make the device suitable for a wide range of commercial systems.

Why Choose EP2SGX60CF780C4?

The EP2SGX60CF780C4 brings Stratix II GX series capabilities into a single commercial-grade FPGA package, combining large logic capacity, multi-megabit embedded memory, and Stratix II GX transceiver architecture. It's suited for designers who need integrated high-speed serial links, significant on-chip resources for buffering and DSP, and a compact high-density package for complex systems.

Backed by Intel's Stratix II GX device documentation, this FPGA is appropriate for communications, networking, and high-throughput embedded designs where series-level transceiver and memory features accelerate development and system integration.

Request a quote or submit an inquiry to receive pricing, availability, and technical assistance for the EP2SGX60CF780C4. Our team can provide further configuration and procurement support to move your design forward.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1968


    Headquarters: Santa Clara, California, USA


    Employees: 130,000+


    Revenue: $54.23 Billion


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018


    Featured Products
    Latest News
    keyboard_arrow_up