EP2SGX60DF780C3N

The EP2SGX60DF780C3N is a Stratix® II GX field-programmable gate array in a 780-ball BGA package designed for high-performance, system-level integration. It features a 1.2‑V Stratix II logic architecture with abundant logic resources and embedded memory, and it is targeted at applications requiring high-speed serial links, complex digital processing, and flexible I/O integration.

This commercial‑grade device is suitable for communications, networking, and high-speed interface bridging where a combination of logic density, on‑chip memory, and advanced transceiver technology is required.

Key Features

• Core Logic — 60,440 logic elements provide substantial capacity for complex gateware and custom digital logic implementations.
• Embedded Memory — Approximately 2.54 Mbits of on‑chip RAM (2,544,192 total RAM bits) for FIFOs, buffers, and user memory structures.
• High-Speed Transceiver Family Features — Stratix II GX family transceivers deliver 600 Mbps to 6.375 Gbps per channel and are available in devices with 4–20 channels; the family supports CDR-based serial protocols and dynamic transceiver reconfiguration.
• DSP and Math Acceleration — Family-level high-speed DSP blocks support multipliers and MAC functions for signal processing and filtering (family feature noted in datasheet).
• Clocking — Family provides multiple PLLs and extensive clock network resources, including up to 16 global clock networks and regional clock routing (Stratix II GX family specification).
• I/O — 364 user I/O pins for broad external connectivity; support for numerous single‑ended and differential I/O standards is provided at the family level.
• Package & Mounting — 780‑BBGA package (supplier package 780‑FBGA, 29×29) designed for surface‑mount assembly.
• Power & Operating Range — Core supply range of 1.15 V to 1.25 V; commercial operating temperature range from 0 °C to 85 °C.
• Regulatory — RoHS‑compliant.

Typical Applications

• High‑Speed Communications — Implement protocol bridging and backplane interfaces using the Stratix II GX family’s high‑speed serial transceivers and on‑chip memory for packet buffering.
• Network Infrastructure — Use logic density and DSP resources for packet processing, traffic management, and custom network acceleration functions.
• Chip‑to‑Chip and Board‑Level Interfaces — Leverage family transceivers and flexible I/O standards to implement low-latency, high-bandwidth links between devices and modules.
• Signal Processing — Deploy embedded RAM and DSP blocks for FIR filters, MAC operations, and real‑time streaming data manipulation.

Unique Advantages

• High Logic Density: 60,440 logic elements let you implement complex control and data‑path functions without immediate need for external logic.
• Substantial On‑Chip Memory: Approximately 2.54 Mbits of embedded RAM supports FIFOs, packet buffering, and memory‑intensive workflows while reducing external memory dependence.
• Family-Level High‑Speed Serial Capability: Stratix II GX transceiver technology (600 Mbps–6.375 Gbps) enables flexible deployment across a wide range of serial protocols and link speeds.
• Rich I/O Count: 364 user I/O pins provide broad connectivity options for interfaces, peripherals, and parallel buses.
• Commercial Temperature Range and RoHS Compliance: Commercial operating range (0 °C to 85 °C) and RoHS‑compliant status support standard electronics manufacturing and environmental requirements.

Why Choose EP2SGX60DF780C3N?

The EP2SGX60DF780C3N pairs the Stratix II GX family’s high‑speed transceiver capabilities and advanced logic architecture with a large complement of embedded memory and I/O. It is positioned for system designers needing substantial logic capacity, on‑chip RAM for buffering, and the option to use family transceivers for high‑bandwidth serial links.

This device is well suited to teams building communications equipment, network infrastructure, or board‑level interface controllers that require scalability, configurable resources, and the Stratix II GX family’s established feature set and ecosystem support.

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