EP2SGX30DF780I4

The EP2SGX30DF780I4 is a Stratix® II GX family Field Programmable Gate Array (FPGA) in a 780-ball BGA package. It pairs a scalable, high-performance logic array with the Stratix II GX family’s high-speed serial transceiver architecture for demanding digital, communications, and protocol-bridging designs.

Targeted at industrial applications, this device offers 33,880 logic elements, approximately 1.37 Mbits of embedded memory, and up to 361 I/O pins, delivering the integration and I/O density needed for backplane interfaces, chip-to-chip links, and high-speed communications tasks.

Key Features

• Logic Capacity — 33,880 logic elements for complex digital designs and system integration.
• Embedded Memory — Approximately 1.37 Mbits of on-chip RAM to implement FIFOs, dual-port memories, and buffering.
• I/O Density — 361 I/Os to support broad interfacing and high pin-count connectivity.
• Stratix II GX Transceiver Architecture — Family-level support for high-speed serial transceivers with clock and data recovery and embedded SERDES; transceivers in the family support data rates up to 6.375 Gbps and device variants with 4–20 channels (family-level capability).
• Programmable Supply Range — Core voltage supply range from 1.15 V to 1.25 V for predictable power budgeting.
• Package & Mounting — 780-ball FBGA (29 × 29 mm) package, surface-mount mounting for compact board integration.
• Industrial Temperature Range — Rated for operation from −40 °C to 100 °C to meet industrial-environment requirements.
• Standards & Interfaces — Family documentation shows support for multiple serial protocols and high-speed external memory interfaces (family-level features include support for PCI Express, Gigabit Ethernet, QDR, DDR, DDR2 and others as described in the Stratix II GX handbook).
• Compliance — RoHS compliant.

Typical Applications

• High-Speed Backplane Interfaces — Use the device’s high I/O density and family-level transceiver performance to implement backplane bridging and switching functions.
• Chip-to-Chip Communication — Leverage the Stratix II GX serial transceiver architecture to handle high-bandwidth, low-latency links between chips or modules.
• Communications Protocol Bridging — Implement protocol conversion and multi-protocol interfaces using the device’s programmable logic, embedded memory, and transceiver capabilities (family-level supported protocols documented in the datasheet).
• High-Speed Memory Interfaces — Pair on-chip RAM and the FPGA fabric to manage external memory interfaces supported at the family level, including QDR and DDR variants.

Unique Advantages

• Substantial Logic & Memory Integration: 33,880 logic elements and ~1.37 Mbits of embedded memory reduce external components and simplify system design.
• High I/O Count: 361 I/Os enable dense connectivity for complex boards and multiple parallel interfaces.
• Family-Level High-Speed Serial Support: Stratix II GX transceiver features (up to 6.375 Gbps, multi-channel capability) enable high-bandwidth serial links where needed.
• Industrial Temperature Rating: −40 °C to 100 °C operation supports deployments in a wide range of industrial environments.
• Compact, Surface-Mount Package: 780-ball FBGA (29 × 29 mm) balances high I/O with a compact footprint for space-constrained designs.
• Standards-Focused Architecture: Family documentation includes support for common high-speed protocols and external memory interfaces to accelerate system integration.

Why Choose EP2SGX30DF780I4?

EP2SGX30DF780I4 places substantial programmable logic, embedded memory, and high I/O density into a single 780-BBGA package, aligning with industrial applications that require robust operation across −40 °C to 100 °C. As part of the Stratix II GX family, it brings a transceiver-capable architecture and family-level support for high-speed serial protocols and external memory interfaces to system designs that demand bandwidth and flexibility.

This device suits customers building high-speed communications, protocol-bridging, and complex interfacing solutions where integration, reliable thermal range, and a scalable FPGA architecture are key to reducing board-level complexity and accelerating time-to-deployment.

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