EP2SGX30DF780C5N

The EP2SGX30DF780C5N is a Stratix II GX Field Programmable Gate Array (FPGA) offered in a 780-ball BGA package. As a member of the Stratix II GX family, it pairs a scalable, high-performance logic array with the family’s high-speed serial transceiver architecture to support demanding communications and interface applications.

With 33,880 logic elements, approximately 1.37 Mbits of embedded memory, and 361 user I/Os, this commercial-grade, surface-mount FPGA is suited for applications that require significant on-chip logic, memory, and high I/O density while operating within a 0 °C to 85 °C temperature range and a 1.15 V–1.25 V core supply window.

Key Features

• Core Logic  33,880 logic elements and 1,694 logic array blocks provide a large, flexible programmable fabric for complex digital functions and custom processing pipelines.
• Embedded Memory  Approximately 1.37 Mbits of on-chip RAM suitable for FIFOs, buffers, and on-chip data storage.
• I/O Density  361 user I/Os delivered in a high-density package to support broad interfacing needs and parallel bus connectivity.
• Stratix II GX Family Transceiver Technology  Family-level features include high-speed serial transceivers with clock and data recovery (CDR) and SERDES capability (family supports up to 6.375 Gbps per channel), enabling robust serial link implementations and protocol bridging.
• DSP and Timing Resources  Family architecture includes high-speed DSP blocks for multipliers and MAC functions and up to four enhanced PLLs per device for flexible clocking, spread spectrum, and dynamic clock control (family-level capabilities).
• Memory Architecture  TriMatrix memory architecture (family feature) with three RAM block sizes supports true dual-port RAM and high-performance FIFOs.
• Package & Mounting  780-ball BBGA package (supplier device package: 780-FBGA, 29×29) in a surface-mount form factor for compact board-level integration.
• Power & Temperature  Core supply voltage: 1.15 V to 1.25 V. Operating temperature range: 0 °C to 85 °C (commercial grade).
• Regulatory  RoHS compliant.

Typical Applications

• High-Speed Communications  Implement serial link endpoints and protocol bridging where family transceiver capabilities and CDR/SERDES support are required.
• Backplane and Chip-to-Chip Interfaces  Use the device’s high I/O count and Stratix II GX family transceiver technology to implement backplane interfaces and high-bandwidth chip-to-chip links.
• Custom Data Processing  Leverage the large logic element count and on-chip memory for packet processing, buffering, and application-specific acceleration using DSP resources.
• Memory Interface Systems  Integrate with external high-speed memory standards supported by the family architecture for data buffering and throughput-intensive designs.

Unique Advantages

• High Logic Capacity: 33,880 logic elements provide substantial programmable resources for complex state machines, custom processors, and parallel datapaths.
• Significant On-Chip Memory: Approximately 1.37 Mbits of embedded RAM reduces external memory dependence for FIFOs and temporary storage.
• Broad I/O Count: 361 user I/Os enable dense interfacing to peripherals, buses, and daughter-card connectors without excessive PCB routing complexity.
• Stratix II GX Transceiver Ecosystem: Family transceiver features (CDR, SERDES, high data-rate support) allow designs targeting modern serial protocols and flexible link reconfiguration.
• Compact, Surface-Mount Package: 780-BBGA (780-FBGA, 29×29) balances high pin count with a compact footprint for space-constrained boards.
• Commercial Temperature and RoHS Compliance: Rated 0 °C to 85 °C and RoHS-compliant for standard commercial deployments and regulatory conformity.

Why Choose EP2SGX30DF780C5N?

The EP2SGX30DF780C5N combines a large logic fabric, substantial embedded memory, and a high pin-count I/O interface in a compact BGA package, delivering a balanced solution for communications, interface bridging, and custom data-processing designs. As part of the Stratix II GX family, it benefits from family-level transceiver, DSP, and memory architecture features that accelerate development of high-bandwidth applications.

This device is well-suited for design teams that require scalable logic capacity, flexible on-chip memory, and the ability to implement serial and parallel interfaces within commercial temperature bounds while maintaining RoHS compliance.

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