EP2SGX30DF780C3

The EP2SGX30DF780C3 is a Stratix® II GX field programmable gate array (FPGA) in a 780-BBGA package designed for high-performance, high-density digital designs. Built on the Stratix II GX family architecture, the device pairs a scalable logic array with high-speed serial transceivers and flexible I/O to address communications, backplane, and protocol-bridging applications.

This device provides a balance of logic capacity, embedded memory, and I/O density for commercial-grade designs that require deterministic supply and temperature operating ranges and RoHS compliance.

Key Features

• Logic Capacity — 33,880 logic elements to implement complex digital functions and control logic efficiently.
• Embedded Memory — Approximately 1.37 Mbits of on-chip RAM for FIFOs, buffers, and local storage.
• I/O and Package — 361 I/O pins in a surface-mount 780-BBGA package (supplier package: 780-FBGA, 29×29) to support dense board-level connectivity.
• Power and Temperature — Core voltage supply range 1.15 V to 1.25 V; commercial operating temperature 0 °C to 85 °C.
• High‑Speed Serial Capability (series feature) — Stratix II GX family transceivers support full‑duplex operation up to 6.375 Gbps per channel for high-bandwidth serial links.
• TriMatrix Memory Architecture (series feature) — Three RAM block sizes enable dual-port memory and high-performance FIFO implementations.
• DSP and Clocking (series feature) — Integrated high-speed DSP blocks and up to four enhanced PLLs provide dedicated multiplier/accumulate resources and flexible clock management.
• Protocol and Memory Support (series feature) — Series-level support for external memory interfaces (QDR, DDR, DDR2, SDR) and common serial protocols for system-level integration.
• Signal Integrity Features (series feature) — Transceiver options include programmable VOD, pre-emphasis, adaptive equalization, and selectable on‑chip termination resistors for robust link performance.
• Compliance — RoHS compliant for environmental and manufacturing compatibility.

Typical Applications

• High-Speed Communications — Implement multi‑Gbps serial links and protocol bridging where series transceiver features and SERDES capability are required.
• Backplane and Networking Equipment — Use the device’s dense I/O and transceiver performance for backplane interfaces and packet/transport processing.
• Memory Interface and Buffering — Leverage embedded RAM and TriMatrix memory organization for high‑performance FIFOs and external memory controllers.
• Signal Processing and DSP Tasks — Employ integrated DSP blocks for multiply-accumulate and FIR filter implementations in communications and processing pipelines.

Unique Advantages

• Balanced Logic and Memory — 33,880 logic elements combined with ~1.37 Mbits of embedded memory supports complex, on‑chip buffering and control tasks.
• High I/O Density in a Compact Package — 361 I/Os in a 780-BBGA (29×29) footprint enables dense board integration without sacrificing connectivity.
• Series-Level High-Speed Serial Support — Stratix II GX transceivers provide up to 6.375 Gbps per channel and signal‑integrity features to simplify high‑bandwidth link design.
• Flexible Clocking and DSP Resources — Enhanced PLLs and dedicated DSP blocks allow precise timing control and efficient implementation of arithmetic-intensive functions.
• Commercial-Grade Reliability — Specified operating range of 0 °C to 85 °C and controlled supply voltage ensure predictable behavior in commercial applications.
• Regulatory Compatibility — RoHS compliance supports environmentally conscious manufacturing processes.

Why Choose EP2SGX30DF780C3?

The EP2SGX30DF780C3 delivers a practical combination of logic density, embedded memory, and I/O connectivity in a commercial-grade Stratix II GX FPGA package. Its architecture—backed by family-level transceiver, memory, and DSP features—makes it suitable for designs requiring high-bandwidth serial links, substantial on-chip buffering, and flexible clocking resources.

This device is well suited to system designers who need scalable performance with verified series-level capabilities and straightforward integration into surface-mount, high-density board layouts. Its RoHS compliance and defined operating specifications make it a dependable choice for commercial electronic products and communications equipment.

Request a quote or submit a pricing and availability request to evaluate EP2SGX30DF780C3 for your next design project.