EP2SGX30CF780C4N

The EP2SGX30CF780C4N is a Stratix II GX field programmable gate array (FPGA) in a 780-ball BGA package optimized for high-performance logic and serial connectivity. Built on the Stratix II GX device family architecture, it pairs a scalable logic array with high-speed transceiver capabilities and on-chip embedded memory for communications, protocol bridging, and high-speed interface designs.

This commercial-grade, surface-mount device delivers a combination of dense logic, substantial embedded RAM, and a large I/O count while operating from a 1.15 V to 1.25 V core supply and across a 0 °C to 85 °C temperature range. It is RoHS compliant for environmentally responsible design integration.

Key Features

• Core Logic — 33,880 logic elements provide a flexible fabric for implementing complex digital functions, custom datapaths, and control logic.
• Embedded Memory — Approximately 1.37 Mbits of on-chip RAM suitable for FIFOs, buffers, and packet storage in communication and interface applications.
• I/O Capacity — 361 user I/O pins available for parallel interfaces, peripheral connections, and board-level routing.
• High-Speed Transceiver Architecture (Series) — Stratix II GX family transceiver technology supports serial data rates from 600 Mbps up to 6.375 Gbps and includes features such as clock and data recovery, adaptive equalization, and programmable pre-emphasis (as described in the Stratix II GX device family documentation).
• DSP and Clocking (Series) — Family-level features include high-speed DSP blocks for multiply-accumulate operations and up to four enhanced PLLs per device for flexible clocking, spread spectrum, and real-time reconfiguration (as described in the Stratix II GX device family documentation).
• Package & Mounting — 780-FBGA (29 × 29 mm) footprint in a 780-BBGA package; surface-mount assembly suitable for standard PCB manufacturing processes.
• Power and Thermal — Core supply operating range from 1.15 V to 1.25 V with a commercial operating temperature range of 0 °C to 85 °C.
• Regulatory — RoHS compliant for lead-free manufacturing and regulatory alignment.

Typical Applications

• High-Speed Communications — Used in protocol-bridging and backplane interfaces where serial transceiver support and embedded memory facilitate packet buffering and link adaptation.
• Network and Telecom Line Cards — Implements packet processing, framing, and custom logic for line-rate data handling enabled by the combination of dense logic and on-chip RAM.
• Chip-to-Chip Interfaces — Supports high-throughput serial links and parallel I/O for board-level and board-to-board data transfer in complex systems.

Unique Advantages

• Substantial Logic Density: 33,880 logic elements allow consolidation of multiple functions into a single FPGA, reducing system BOM and board complexity.
• Significant On-Chip Memory: Approximately 1.37 Mbits of embedded RAM supports large FIFOs and buffering without external memory, improving latency and simplifying PCB design.
• High I/O Count: 361 I/Os give designers flexibility for parallel interfaces, wide buses, and extensive peripheral connectivity.
• Family-Level High-Speed Serial Support: Stratix II GX transceiver technology (600 Mbps–6.375 Gbps) provides the serial bandwidth and link features needed for modern communication protocols.
• Commercial Temperature Range: Designed for standard commercial environments (0 °C to 85 °C), suitable for many enterprise and communications applications.
• RoHS Compliant: Ensures compatibility with lead-free manufacturing and environmental requirements.

Why Choose EP2SGX30CF780C4N?

The EP2SGX30CF780C4N positions itself as a high-performance, commercially graded FPGA option within the Stratix II GX family, offering a balance of dense logic, meaningful embedded memory, and a large I/O count in a compact 780-BBGA package. Its family heritage provides access to proven transceiver and DSP/clocking features useful for communications and high-speed interface designs.

This device is well suited to designers building communication line cards, protocol bridges, and high-throughput interface modules who need on-chip buffering, extensive I/O, and a flexible logic fabric with commercial-temperature operation and RoHS compliance.

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