EP2SGX30CF780C5

The EP2SGX30CF780C5 is a Stratix II GX field-programmable gate array (FPGA) in a 780‑ball BGA package. It provides a scalable, high-performance logic array with a low-voltage core and a rich set of I/O for demanding connectivity and protocol-bridging applications.

Built on the Stratix II GX family architecture, the device is targeted at high-speed backplane interfaces, chip-to-chip links and communication protocol bridging where integrated transceiver capability, on-chip memory and DSP resources speed development and deployment.

Key Features

• Logic Capacity — 33,880 logic elements (cells) to implement complex state machines, control logic and custom datapaths.
• Embedded Memory — Approximately 1.37 Mbits of on-chip RAM for FIFOs, buffering and fast local storage.
• I/O Density — 361 user I/O pins to support wide parallel interfaces and mixed single-ended/differential signaling.
• Family Transceiver Capabilities — Stratix II GX family devices include high-speed serial transceivers with full-duplex operation up to 6.375 Gbps and support for common serial protocols and dynamic reconfiguration (family-level capability described in the device datasheet).
• Clocking and DSP (Family) — Family architecture includes up to 16 global clock networks, regional clock resources, high-speed DSP blocks for multiply-accumulate functions and enhanced PLLs for flexible clock management (family-level features).
• Package & Mounting — 780‑BBGA (supplier package listed as 780‑FBGA, 29×29) in a surface-mount format for compact board integration.
• Power — Core supply range 1.15 V to 1.25 V to interface with modern low‑voltage systems.
• Commercial Temperature Grade — Rated for 0 °C to 85 °C operation; device grade: Commercial.
• RoHS Compliant — Meets lead‑free and hazardous‑substance requirements for environmental compliance.

Typical Applications

• High‑speed Backplane Interfaces — Implements complex bridging and packet handling for backplane fabrics using the family’s high-speed serial capabilities and large logic capacity.
• Chip‑to‑Chip Connectivity — Provides SERDES-based links and flexible I/O pin count to connect multiple devices across PCBs or within chassis.
• Communications Protocol Bridging — Ideal for translating or aggregating protocols where family transceiver features and on-chip memory simplify protocol handling and buffering.
• Signal Processing and DSP Tasks — On-chip RAM and family DSP resources support FIR filters, MAC operations and other real‑time data processing functions.

Unique Advantages

• Substantial Logic Density: 33,880 logic elements allow integration of large custom logic blocks and state machines, reducing external component count.
• Significant Embedded Memory: Approximately 1.37 Mbits of RAM enables deep buffering and efficient FIFO implementations close to the logic.
• High I/O Count in a Compact Package: 361 I/Os in a 780‑ball BGA (29×29) package support wide parallel buses and varied signaling options while maintaining a small PCB footprint.
• Low‑Voltage Core: 1.15–1.25 V core supply aligns with contemporary system power rails for efficient integration.
• Family Transceiver and IP Support: Stratix II GX family transceiver features and support for MegaCore/AMPP megafunctions (as described in the datasheet) streamline high-speed protocol implementation and accelerate development.
• Commercial Temperature Rating & RoHS Compliance: Clear operational range (0 °C to 85 °C) and environmental compliance simplify qualification for commercial products.

Why Choose EP2SGX30CF780C5?

The EP2SGX30CF780C5 combines a high-density logic fabric, substantial on-chip RAM and the Stratix II GX family’s advanced transceiver and clocking architecture to address demanding connectivity and processing tasks. Its package density and 361 I/Os make it suitable for systems that require compact, high‑function integration while operating within commercial temperature ranges.

This device is a practical choice for engineering teams designing high‑speed communications, protocol bridging and signal processing applications that benefit from integrated memory, DSP resources and family-level transceiver capabilities described in the Stratix II GX datasheet.

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