EP2SGX30CF780C5N

The EP2SGX30CF780C5N is a Stratix® II GX field programmable gate array (FPGA) from Intel designed for applications that require a combination of high-density logic, embedded memory, and advanced serial connectivity. It pairs a scalable logic array with Stratix II GX family transceiver technology to address high-speed backplane, chip-to-chip, and communications protocol-bridging use cases.

With 33,880 logic elements, approximately 1.37 Mbits of embedded RAM, and 361 user I/O pins in a 780-ball BGA package, this device targets designers who need integrated logic and serial I/O bandwidth while operating within commercial temperature and voltage ranges.

Key Features

• Core logic  33,880 logic elements provide dense programmable logic capacity for complex FPGA designs.
• Embedded memory  Approximately 1.37 Mbits of on-chip RAM (1,369,728 total RAM bits) for FIFOs, buffers, and local data storage.
• High-speed transceiver architecture  Stratix II GX family transceivers include clock-and-data-recovery (CDR) and SERDES capability with per-channel data rates outlined in the Stratix II GX device documentation up to 6.375 Gbps, supporting dynamic reconfiguration and protocol flexibility.
• I/O density and standards  361 user I/O pins in the device; the Stratix II GX family supports numerous single-ended and differential I/O standards and high-speed source-synchronous differential I/O implementations.
• DSP and clocking resources  Family-level features include high-speed DSP blocks for multipliers and FIR filters and up to four enhanced PLLs for flexible clocking (see Stratix II GX documentation for details).
• Power and supply  Device nominal supply range of 1.15 V to 1.25 V, enabling targeted system power budgeting and compatibility with 1.2 V logic domains.
• Package and mounting  780-BBGA package; supplier device package listed as 780-FBGA (29 × 29 mm). Surface-mount package for standard PCB assembly.
• Operating range and compliance  Commercial-grade operation from 0 °C to 85 °C and RoHS compliant.

Typical Applications

• High-speed backplane interfaces  Use the Stratix II GX transceiver capabilities and dense logic to implement protocol bridging and packet switching on high-speed backplanes.
• Chip-to-chip connectivity  Combine embedded SERDES transceivers with on-chip memory and DSP resources for low-latency, high-bandwidth chip-to-chip links.
• Communications protocol bridging  Implement protocol adapters and multi-rate serializer/deserializer functions leveraging the device family’s transceiver reconfiguration and CDR features.
• Memory interface buffering  Use on-chip RAM and logic resources to manage interfaces with external high-speed memories and to implement FIFO buffering and command/control logic.

Unique Advantages

• High-density programmable logic: 33,880 logic elements enable implementation of complex control, datapath, and protocol logic within a single device, reducing BOM count.
• Integrated embedded memory: Approximately 1.37 Mbits of on-chip RAM simplifies FIFO and buffer implementations without relying solely on external memory.
• Advanced serial I/O capability: Stratix II GX transceiver architecture (with CDR and SERDES) supports multi-gigabit channels and dynamic reconfiguration for flexible link designs.
• Rich clocking and DSP resources: Enhanced PLLs and dedicated DSP blocks provide design flexibility for high-performance signal processing and timing architectures.
• Commercial temperature and RoHS compliant: Rated for 0 °C to 85 °C operation and compliant with RoHS directives for broad commercial deployment.
• Standard BGA packaging: 780-ball BGA (29 × 29 mm) surface-mount package enables compact, high-density board layouts.

Why Choose EP2SGX30CF780C5N?

The EP2SGX30CF780C5N places Stratix II GX family capabilities—dense logic, embedded memory, and advanced transceiver features—into a 780-BBGA commercial-grade FPGA suitable for demanding communications and high-speed interface designs. Its combination of logic capacity, on-chip RAM, and multi-gigabit transceiver architecture supports designs that require integrated data-path processing, protocol bridging, and high I/O density.

Designed and supported within the Stratix II GX device documentation and developer ecosystem, this device is appropriate for engineering teams looking to consolidate functions into a single programmable device while maintaining clear electrical and thermal parameters for commercial applications.

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