EP2SGX30DF780C5

The EP2SGX30DF780C5 is a Stratix® II GX field-programmable gate array (FPGA) in a 780-BBGA surface-mount package. It combines a high-performance logic array with the Stratix II GX family architecture that integrates advanced memory, DSP, and high-speed serial transceiver technologies.

Targeted for communication and high-speed interface designs, this commercial-grade device provides a balance of logic capacity, embedded memory, and I/O density for applications such as backplane interfaces, chip-to-chip links, and protocol bridging.

Key Features

• Logic Capacity — 33,880 logic elements to implement complex digital functions and custom logic blocks.
• Embedded Memory — Approximately 1.37 Mbits of on-chip RAM for FIFOs, buffers, and packet or frame storage.
• I/O Density — 361 user I/O pins, supporting a wide range of system interfacing and parallel bus implementations.
• Stratix II GX Family Transceiver Architecture — Family-level transceiver and SERDES features, including clock and data recovery and support for high-speed serial protocols, provide a foundation for multi-Gbps serial links (see family datasheet for details).
• DSP & Clock Resources — Family architecture includes high-speed DSP blocks and multiple global/regional clock networks to support high-throughput signal processing and synchronized system timing (refer to series documentation for block counts and capabilities).
• Package & Mounting — 780-BBGA (supplier device package: 780-FBGA, 29 × 29 mm) surface-mount package for compact, board-level integration.
• Power & Operating Range — Core voltage supply range of 1.15 V to 1.25 V with an operating temperature range of 0 °C to 85 °C (commercial grade).
• Regulatory — RoHS compliant.

Typical Applications

• High-Speed Backplane Interfaces — Use the Stratix II GX family’s serial and parallel resources to implement multi-lane backplane links and protocol bridging.
• Chip-to-Chip Connectivity — Leverage abundant I/O and family transceiver features for high-throughput board-to-board or chip-to-chip data paths.
• Communications Protocol Bridging — Implement protocol conversion and aggregation where on-chip memory and DSP blocks handle buffering and data manipulation.
• High-Performance Logic and DSP — Deploy the device’s logic elements and embedded memory for packet processing, signal conditioning, or custom hardware acceleration.

Unique Advantages

• Substantial Logic Density: 33,880 logic elements enable implementation of large custom logic designs without external ASICs.
• On-Chip Memory for Real-Time buffering: Approximately 1.37 Mbits of embedded RAM reduces external memory dependence for many FIFO and buffering tasks.
• High I/O Count: 361 I/O pins provide flexibility for wide parallel buses, multiple interfaces, and mixed-signal front-ends.
• Family-Level Serial Capability: Stratix II GX architecture includes high-speed transceiver features suitable for multi-gigabit serial protocols (see series documentation for supported rates and protocols).
• Compact BGA Package: 780-FBGA (29 × 29 mm) package balances board-space efficiency with thermal and routing considerations for dense designs.
• Commercial-Grade Reliability: 0 °C to 85 °C operating range and RoHS compliance make the device suitable for mainstream commercial and communications equipment.

Why Choose EP2SGX30DF780C5?

The EP2SGX30DF780C5 positions itself as a versatile Stratix II GX family member for designers who need a significant logic footprint, substantial embedded memory, and a high I/O count in a compact BGA package. Its architecture and family-level transceiver capabilities make it well suited for communications, protocol bridging, and high-throughput data-path applications.

For teams focused on scalable, field-programmable solutions, this device offers long-term design flexibility supported by the Stratix II GX documentation and Intel manufacturing pedigree—helpful when evolving product requirements call for higher integration or reconfiguration without a full hardware redesign.

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