EP2SGX30DF780C3N

The EP2SGX30DF780C3N is a Stratix® II GX field-programmable gate array provided by Intel. Built on the Stratix II GX device family architecture, it combines a high-density logic array with the series’ high-speed serial transceiver and DSP capabilities for demanding communications and protocol-bridging applications.

Designed for surface-mount applications, this commercial-grade device offers substantial on-chip memory and I/O capacity, making it suitable for high-speed backplane interfaces, chip-to-chip bridging, and other data-path centric designs that require configurable logic and advanced transceiver features available across the Stratix II GX series.

Key Features

• Logic Density  33,880 logic elements and 1,694 logic array blocks provide substantial programmable logic for complex implementations.
• Embedded Memory  Approximately 1.37 Mbits of on-chip RAM to implement dual-port memory and FIFO buffers using the TriMatrix memory architecture described for Stratix II GX devices.
• High-speed Transceiver Architecture (series feature)  Stratix II GX devices include high-speed serial transceivers with clock and data recovery (CDR) and SERDES capability supporting data rates specified for the series.
• Advanced DSP and Clocking (series feature)  High-speed DSP blocks and up to four enhanced PLLs per device are supported in the Stratix II GX family for multiply-accumulate functions and advanced clock management.
• I/O Capacity  361 user I/O pins support numerous single-ended and differential I/O standards as described for the series, including source-synchronous differential I/O on multiple channels.
• Power and Supply  Core voltage supply range of 1.15 V to 1.25 V aligns with Stratix II logic requirements.
• Package and Mounting  780-BBGA package (supplier device package: 780-FBGA (29x29)); surface-mount mounting type for board-level integration.
• Operating Conditions  Commercial-grade device with operating temperature range from 0 °C to 85 °C.
• Configuration and IP Support (series feature)  Stratix II GX devices support configuration bitstream encryption, remote configuration updates, and Altera Megacore/AMPP megafunctions as part of the series capabilities.
• Environmental  RoHS compliant.

Typical Applications

• High-speed Backplane Interfaces  Use the device’s high logic density and Stratix II GX transceiver capabilities (series-level) to implement backplane protocol bridging and data aggregation.
• Chip-to-Chip Communication  Leverage dense logic, on-chip RAM, and series transceiver features to implement high-throughput chip-to-chip links and protocol conversion.
• Networking and Telecommunications  Implement protocol offload, packet processing, and serialization/deserialization functions using the device’s DSP blocks and memory resources.
• High-speed Memory Interfaces  Support for external memory interfaces is provided by the series architecture, enabling designs that pair on-chip logic with DDR/QDR-type memories.

Unique Advantages

• High logic capacity: 33,880 logic elements enable complex control, signal-processing, and protocol logic on a single device, reducing BOM complexity.
• Substantial on-chip RAM: Approximately 1.37 Mbits of embedded memory supports FIFOs and buffering without immediate external memory dependence.
• Series transceiver capabilities: Stratix II GX series transceiver features provide the foundation for multi-gigabit serial links and protocol flexibility where required by system designers.
• Flexible clocking and DSP support: Enhanced PLLs and high-speed DSP blocks (series features) help implement low-latency signal processing and sophisticated timing architectures.
• Robust I/O and packaging: 361 I/O pins in a 780-BBGA package give designers dense connectivity for complex board-level integration while supporting surface-mount assembly.
• Regulatory and assembly readiness: RoHS compliance and a commercial temperature grade simplify compliance and manufacturing for mainstream electronics applications.

Why Choose EP2SGX30DF780C3N?

The EP2SGX30DF780C3N positions designers to leverage the Stratix II GX family’s combination of high-density programmable logic, embedded memory, and the series’ high-speed transceiver and DSP capabilities. Its count of 33,880 logic elements, approximately 1.37 Mbits of on-chip RAM, and 361 I/O pins provide a balanced platform for data-path intensive designs that require integration of logic, buffering, and high-speed interfaces.

This commercial-grade, surface-mount FPGA in a 780-BBGA package is suitable for teams implementing communications, backplane, and protocol-bridging solutions that rely on the Stratix II GX device family features and available megafunction IP resources for scalable, maintainable designs.

Request a quote or submit an inquiry to get pricing and availability for EP2SGX30DF780C3N and to discuss how this Stratix II GX FPGA can fit your next design.