EP2SGX30DF780C4N

The EP2SGX30DF780C4N is an Intel Stratix® II GX field programmable gate array (FPGA) in a 780-ball BGA package. It is built on the Stratix II GX architecture and is intended for designs that require a high-density logic array, substantial embedded memory, and the family’s high-speed transceiver technology.

Typical use cases include high-speed backplane interfaces, chip-to-chip bridging, and communications protocol applications where scalable logic, abundant I/O, and family-level transceiver capabilities can accelerate time to market.

Key Features

• High-density logic – 33,880 logic elements provide significant programmable logic resources for complex digital designs.
• Embedded memory – Approximately 1.37 Mbits of on-chip RAM for buffers, FIFOs, and local storage.
• I/O resources – 361 user I/O pins support diverse interface requirements across the device.
• Stratix II GX transceiver architecture (family-level) – Leverages Stratix II GX family transceiver technology; the family supports serial data rates from 600 Mbps up to 6.375 Gbps per channel and is designed for high-speed serial protocols (family-level capability).
• Clocking and DSP support (family-level) – Stratix II GX family devices include multiple global and regional clock networks, enhanced PLLs, and dedicated DSP blocks for multiply and FIR implementations (family-level features described in the device family documentation).
• Supply voltage – Operates with a core supply in the 1.15 V to 1.25 V range, enabling designs targeting the Stratix II GX power domain.
• Package and mounting – 780-BBGA package (supplier device package listed as 780-FBGA, 29 × 29 mm) for surface-mount PCB integration.
• Commercial grade & environmental – Commercial temperature grade (0 °C to 85 °C) and RoHS compliant.

Typical Applications

• High-speed backplane interfaces – Use the Stratix II GX family’s transceiver technology and abundant logic to implement backplane protocols and PHY bridging.
• Chip-to-chip bridging – High I/O count and programmable logic enable protocol conversion and high-throughput chip-to-chip links.
• Communications protocol processing – On-chip memory and DSP/clocking features (family-level) support packet buffering, framing, and protocol handling.
• High-performance embedded systems – Dense logic and embedded RAM allow complex control, signal processing, and interface aggregation in compact board-level designs.

Unique Advantages

• Substantial programmable capacity: 33,880 logic elements provide headroom for complex state machines, datapaths, and custom accelerators.
• Significant embedded memory: Approximately 1.37 Mbits of on-chip RAM reduces reliance on external memory for mid-sized buffers and FIFOs.
• Large I/O availability: 361 I/O pins offer flexible routing for multiple parallel interfaces and mixed-signal front ends.
• Stratix II GX family capabilities: Access to high-speed serial transceiver architecture and family-level clocking/DSP features helps address demanding communications and interface designs.
• Compact BGA package: 780-ball FBGA (29 × 29 mm) balances a high pin count with a PCB footprint suitable for dense system designs.
• Regulatory-friendly: RoHS compliance supports environmentally conscious manufacturing and supply chain requirements.

Why Choose EP2SGX30DF780C4N?

The EP2SGX30DF780C4N positions designers to take advantage of the Stratix II GX family architecture while providing a high logic capacity, substantial on-chip RAM, and a large complement of I/O. Its commercial temperature rating and RoHS compliance make it suitable for a broad set of embedded and communications applications.

This device is appropriate for engineers building high-throughput interfaces, protocol bridges, or mid-range signal-processing functions who need programmable density, integrated memory, and the option to leverage family-level high-speed transceiver and clocking features described in the Stratix II GX documentation.

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