EP2SGX30CF780C4

The EP2SGX30CF780C4 is a Stratix® II GX Field Programmable Gate Array (FPGA) offered in a 780-BBGA package designed for high-performance digital designs. Built on the Stratix II GX architecture, the device combines a dense logic array, substantial embedded memory, and the series' high-speed transceiver capabilities to address demanding communications and protocol-bridging applications.

Typical use cases include high-speed backplane interfaces, chip-to-chip bridging, and designs that require dense logic, on-chip memory, and a broad set of I/O options within a commercial-grade, RoHS-compliant package.

Key Features

• Logic Capacity  33,880 logic elements provide the programmable fabric for complex digital logic and control functions.
• On‑chip Memory  Approximately 1.37 Mbits of embedded RAM to implement FIFOs, buffers, and data storage close to logic.
• I/O Density  361 I/O pins support a wide range of board-level interfaces and parallel/synchronous connections.
• High‑Speed Transceiver Architecture (Series)  Stratix II GX devices include high-speed serial transceivers supporting up to 6.375 Gbps per channel and dynamic configuration for multiple serial protocols.
• Clocking and DSP (Series)  Series features include up to 16 global clock networks, up to four enhanced PLLs per device, and dedicated high-speed DSP blocks for multiplier and MAC implementations.
• Memory and External Interfaces (Series)  Series supports TriMatrix memory architecture, multiple external memory standards, and source-synchronous differential I/O on numerous channels.
• Power and Supply  Nominal core voltage range of 1.15 V to 1.25 V for device core supply.
• Package & Mounting  780-BBGA package; supplier device package listed as 780-FBGA (29x29). Surface-mount device.
• Operating Range & Compliance  Commercial-grade device with an operating temperature range of 0 °C to 85 °C and RoHS compliance.

Typical Applications

• High‑Speed Backplane Interfaces  Use the device’s high-speed serial transceiver architecture and dense logic to implement protocol bridging and multi-gigabit backplane links.
• Chip‑to‑Chip Connectivity  Leverage the device’s abundant I/O and embedded memory for low-latency, high-throughput chip-to-chip data paths.
• Communications Protocol Bridging  Implement protocol translation and data path processing using on-chip logic, RAM, and DSP resources.
• External Memory Controllers  Use the series’ memory support and on-chip RAM to build controllers for DDR, DDR2, QDR, or SDR external memory interfaces.

Unique Advantages

• Dense Logic Fabric:  33,880 logic elements enable integration of complex control, packet processing, and custom logic functions on a single device.
• Substantial Embedded Memory:  Approximately 1.37 Mbits of on-chip RAM reduces external memory dependence for buffering and FIFO implementations.
• High‑Speed Serial Capability:  Series-level transceivers supporting up to 6.375 Gbps simplify implementation of multi-gigabit serial links and protocol conversion.
• Flexible Clocking and DSP Resources:  Enhanced PLLs and dedicated DSP blocks (series) support high-performance signal processing and real-time arithmetic acceleration.
• Compact, Surface‑Mount Package:  780-BBGA (supplier: 780-FBGA (29x29)) balances I/O density with board-area efficiency for space-constrained designs.
• Commercial‑Grade and RoHS‑Compliant:  Designed for commercial-temperature operation (0 °C to 85 °C) and RoHS compliance for regulatory and manufacturing consistency.

Why Choose EP2SGX30CF780C4?

The EP2SGX30CF780C4 positions itself as a high-capacity, commercially graded Stratix II GX FPGA suited for applications requiring a combination of dense logic, embedded memory, and the series’ high-speed serial capabilities. Its voltage range, package density, and extensive I/O make it appropriate for system-level roles such as protocol bridging, backplane interfaces, and high-throughput chip-to-chip connectivity.

Designers benefit from the Stratix II GX architecture’s balance of logic, memory, clocking, and transceiver features—enabling scalable implementations and design reuse within communications and high-performance digital systems.

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