EP2SGX130GF1508I4N

The EP2SGX130GF1508I4N is an Intel Stratix® II GX field programmable gate array (FPGA) offered in a 1508-BBGA FCBGA package for industrial applications. It provides high logic capacity, abundant I/O, and family-level high-speed serial transceiver capabilities suited for demanding communications, backplane, and protocol-bridging designs.

Built around the Stratix II GX architecture, the device combines a large logic array with TriMatrix embedded memory, high-speed DSP resources and configurable transceivers to deliver integration and performance for systems that require flexible, high-bandwidth FPGA solutions.

Key Features

• Logic Capacity — 132,540 logic elements to implement complex digital logic and system functions.
• Embedded Memory — Approximately 6.75 Mbits of on-chip RAM for FIFOs, buffering and dual-port memory structures.
• I/O Density — 734 user I/O pins to support wide parallel interfaces and dense system connectivity.
• High-Speed Transceivers (family-level) — Stratix II GX family devices include high-speed serial transceivers supporting 600 Mbps to 6.375 Gbps per channel and protocols such as PCI Express and Gigabit Ethernet; features include CDR, dynamic reconfiguration, adaptive equalization and selectable on‑chip terminations.
• DSP and Memory Architecture (family-level) — Dedicated high-speed DSP blocks for multipliers and MAC functions (up to 450 MHz) and TriMatrix memory with block sizes designed for high-performance FIFOs (up to 550 MHz).
• Clocking — Support for multiple global and regional clock networks plus up to four enhanced PLLs per device (family-level features) for flexible clock management and spread‑spectrum operation.
• Package & Mounting — 1508-BBGA (FCBGA) supplier package, surface-mount mounting type; supplier listing shows 1508-FBGA, FC (40×40).
• Power & Thermal — Core supply range 1.15 V to 1.25 V; industrial operating temperature range −40 °C to 100 °C.
• Compliance — RoHS‑compliant.

Typical Applications

• High-speed backplane interfaces — Leverage high logic capacity and family-level transceiver bandwidth for protocol bridging and packet routing across backplanes.
• Chip-to-chip and board-to-board links — Use integrated transceivers and adaptive equalization for robust serial connectivity between components.
• Communications protocol bridging — Implement flexible protocol conversion and aggregation using abundant logic, DSP resources, and on-chip memory for buffering.
• High-performance DSP and packet processing — Combine DSP blocks with large logic fabric and embedded RAM for signal processing and packet-handling pipelines.

Unique Advantages

• High integration density: 132,540 logic elements and abundant I/O reduce the need for multi-chip solutions, simplifying board design.
• On-chip memory for buffering: Approximately 6.75 Mbits of embedded RAM supports FIFOs and temporary storage for high-throughput data paths.
• Family-proven transceiver technology: Transceiver features such as CDR, dynamic reconfiguration and adaptive equalization address diverse serial protocol needs.
• Industrial operating range: −40 °C to 100 °C and RoHS compliance make the device suitable for industrial deployments requiring extended temperature tolerance.
• Flexible clocking and DSP support (family-level): Multiple clock networks, enhanced PLLs, and high-speed DSP blocks enable complex timing and signal-processing architectures.
• Standard surface-mount BGA package: 1508-BBGA FCBGA package supports compact, high-density board layouts.

Why Choose EP2SGX130GF1508I4N?

The EP2SGX130GF1508I4N positions the Stratix II GX architecture into a high-capacity, industrial-grade FPGA offering that pairs extensive logic resources and on-chip memory with family-level high-speed serial capabilities. It is well suited for engineers designing high-bandwidth communications, backplane, and protocol-bridging systems that require programmable flexibility and robust performance across an extended temperature range.

With its combination of large logic capacity, significant embedded RAM, dense I/O and a standard 1508-BBGA surface-mount package, this device provides a scalable platform for complex system designs while maintaining compatibility with the Stratix II GX feature set.

Request a quote or submit a sales inquiry to evaluate EP2SGX130GF1508I4N for your next high-performance FPGA design.