EP2SGX130GF1508C4N

The EP2SGX130GF1508C4N is a Stratix® II GX field programmable gate array (FPGA) from Intel, designed for high-density logic and embedded memory integration in commercial-grade systems. It combines a large logic array with on-chip RAM and a family-level architecture that includes high-speed serial transceiver capabilities.

Typical use cases include high-speed backplane interfaces, chip-to-chip bridging, and communications protocol applications where substantial logic resources, embedded memory, and robust I/O counts are required. The device is supplied in a 1508-ball FCBGA surface-mount package and operates within a 1.15 V–1.25 V supply range and a 0 °C to 85 °C commercial temperature window.

Key Features

• High Logic Density  Provides 132,540 logic elements for complex digital designs and large-scale integration.
• Embedded Memory  Includes approximately 6.75 Mbits of on-chip RAM to implement arrays, FIFOs, and dual-port memory structures.
• I/O Capacity  Up to 734 I/O pins support extensive external interfacing for parallel buses, memory interfaces, and peripheral connectivity.
• Stratix II GX Family Transceiver Support  The Stratix II GX family supports high-speed serial transceivers with channel data rates from 600 Mbps to 6.375 Gbps and family features for dynamic reconfiguration, adaptive equalization, and protocol support.
• Clocking and DSP Resources  Family-level architecture provides multiple global and regional clock networks and high-speed DSP blocks (for multiply and MAC operations) suitable for signal processing tasks.
• Power and Supply  Device operates from a core supply range of 1.15 V to 1.25 V, enabling predictable core power budgeting.
• Package and Mounting  Delivered in a 1508-BBGA (FCBGA) surface-mount package (40 mm × 40 mm supplier outline) for high-density board layouts.
• Commercial Grade  Specified for 0 °C to 85 °C operation and RoHS compliant for standard commercial applications.

Typical Applications

• High-Speed Backplane Interfaces  Leverages the Stratix II GX family transceiver capabilities and high logic density to implement packet switching, protocol bridging, and backplane SERDES interfaces.
• Chip-to-Chip and Protocol Bridging  Large logic and embedded memory support complex protocol translation and data buffering between chips or subsystems.
• Communications Systems  Suitable for network and telecom equipment designs that require substantial logic resources and family-level support for standards such as PCI Express and Ethernet.
• Memory and Buffering Controllers  On-chip RAM and I/O count support memory controller implementations and high-bandwidth buffering for external DDR/QDR interfaces.

Unique Advantages

• High-density programmable fabric: 132,540 logic elements enable integration of large, complex designs onto a single device, reducing board-level component count.
• Embedded on-chip memory: Approximately 6.75 Mbits of RAM provides local storage for FIFOs, buffers, and dual-port memory without external components.
• Rich I/O footprint: 734 I/O connections give designers flexibility for wide parallel interfaces, multi-channel connections, and extensive peripheral support.
• Family-level high-speed serial support: Stratix II GX transceiver features (600 Mbps–6.375 Gbps) enable high-throughput serial links and protocol adaptability for communications designs.
• Commercial temperature and RoHS compliant: Rated for 0 °C to 85 °C operation and RoHS compliance for standard commercial deployments.
• Surface-mount, high-density package: 1508-BBGA (FCBGA) package supports compact PCB layouts and high I/O routing density.

Why Choose EP2SGX130GF1508C4N?

The EP2SGX130GF1508C4N positions itself as a high-density Stratix II GX solution for commercial designs that require large programmable logic capacity, embedded memory, and extensive I/O. Its family-level transceiver capabilities and DSP/clocking architecture make it well suited to demanding communications, interface, and protocol-bridging applications.

Designed for engineers and system designers needing scalable performance with Intel’s Stratix II GX architecture, this device offers integration that can reduce BOM complexity while providing the on-chip resources to handle memory buffering, high-throughput I/O, and complex logic functions.

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