EP2S90H484C5
| Part Description |
Stratix® II Field Programmable Gate Array (FPGA) IC 308 4520488 90960 484-BBGA, FCBGA |
|---|---|
| Quantity | 158 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 484-HBGA (27x27) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA, FCBGA | Number of I/O | 308 | Voltage | 1.15 V - 1.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 4548 | Number of Logic Elements/Cells | 90960 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 4520488 |
Overview of EP2S90H484C5 – Stratix® II Field Programmable Gate Array (FPGA), 90,960 Logic Elements, 308 I/O
The EP2S90H484C5 is a Stratix® II family Field Programmable Gate Array (FPGA) from Intel, delivering high-density programmable logic in a 484-ball BGA package. It combines a large logic fabric with multi-megabit on-chip memory and a broad I/O count to address complex digital designs.
Designed for surface-mount assembly, this commercial-grade device offers a defined operating range and documented package/thermal information suitable for designers who require verifiable package and thermal characteristics.
Key Features
- Core Logic 90,960 logic elements provide a substantial resource pool for implementing complex custom logic, state machines, and data-paths.
- Embedded Memory Approximately 4.52 Mbits of on-chip RAM to support buffering, lookup tables, and intermediate data storage without external memory.
- I/O Capacity 308 general-purpose I/O pins to interface with peripherals, memory, and system buses.
- Power Operates from a core supply range of 1.15 V to 1.25 V, enabling defined power-domain design and supply planning.
- Package 484-ball BGA (484-BBGA, FCBGA) supplier package 484-HBGA (27 × 27 mm) for compact, high-density board integration and surface-mount assembly.
- Thermal & Mechanical Documentation Package and thermal resistance information is documented in the device family package datasheet to support thermal management and mechanical design.
- Operating Conditions Commercial operating temperature range of 0 °C to 85 °C and commercial grade classification.
- Compliance RoHS-compliant for compatibility with lead-free manufacturing and environmental requirements.
Typical Applications
- High-density logic integration — Use the 90,960 logic elements to consolidate complex logic and custom processing blocks onto a single FPGA device.
- On-chip buffering and state storage — Approximately 4.52 Mbits of embedded RAM supports local data buffering and lookup tables, reducing dependence on external memory.
- Multi-interface system designs — 308 I/O pins allow broad connectivity for peripheral interfaces, memory buses, and board-level integration.
Unique Advantages
- High logic capacity: 90,960 logic elements enable implementation of large-scale programmable functions within one device, reducing system complexity.
- Significant embedded memory: Approximately 4.52 Mbits of on-chip RAM supports data-intensive functions without immediate external memory requirements.
- Robust I/O count: 308 I/O pins facilitate flexible system interfacing and help minimize the need for external I/O expanders.
- Compact BGA packaging: 484-ball HBGA (27 × 27 mm) provides a dense footprint suitable for space-constrained PCBs while supporting surface-mount manufacturing.
- Documented package and thermal data: Package outlines and thermal resistance details are available for informed thermal and mechanical design decisions.
- RoHS compliant: Supports lead-free assembly and environmental compliance requirements.
Why Choose EP2S90H484C5?
The EP2S90H484C5 positions itself as a high-capacity Stratix II FPGA option for designs that require substantial programmable logic, on-chip memory, and flexible I/O in a single surface-mount package. Its defined core voltage range, commercial temperature rating, and documented package/thermal information make it suitable for engineering teams focused on verifiable electrical and mechanical integration.
As a member of the Stratix II family, the device is supported by mature package documentation that helps streamline thermal planning and board-level implementation, offering designers a predictable platform for medium- to high-density programmable logic projects.
Request a quote or submit an inquiry to receive pricing, availability, and lead-time information for the EP2S90H484C5.

Date Founded: 1968
Headquarters: Santa Clara, California, USA
Employees: 130,000+
Revenue: $54.23 Billion
Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018