EP2S90H484C5

IC FPGA 308 I/O 484HBGA
Part Description

Stratix® II Field Programmable Gate Array (FPGA) IC 308 4520488 90960 484-BBGA, FCBGA

Quantity 158 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package484-HBGA (27x27)GradeCommercialOperating Temperature0°C – 85°C
Package / Case484-BBGA, FCBGANumber of I/O308Voltage1.15 V - 1.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs4548Number of Logic Elements/Cells90960
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits4520488

Overview of EP2S90H484C5 – Stratix® II Field Programmable Gate Array (FPGA), 90,960 Logic Elements, 308 I/O

The EP2S90H484C5 is a Stratix® II family Field Programmable Gate Array (FPGA) from Intel, delivering high-density programmable logic in a 484-ball BGA package. It combines a large logic fabric with multi-megabit on-chip memory and a broad I/O count to address complex digital designs.

Designed for surface-mount assembly, this commercial-grade device offers a defined operating range and documented package/thermal information suitable for designers who require verifiable package and thermal characteristics.

Key Features

  • Core Logic 90,960 logic elements provide a substantial resource pool for implementing complex custom logic, state machines, and data-paths.
  • Embedded Memory Approximately 4.52 Mbits of on-chip RAM to support buffering, lookup tables, and intermediate data storage without external memory.
  • I/O Capacity 308 general-purpose I/O pins to interface with peripherals, memory, and system buses.
  • Power Operates from a core supply range of 1.15 V to 1.25 V, enabling defined power-domain design and supply planning.
  • Package 484-ball BGA (484-BBGA, FCBGA) supplier package 484-HBGA (27 × 27 mm) for compact, high-density board integration and surface-mount assembly.
  • Thermal & Mechanical Documentation Package and thermal resistance information is documented in the device family package datasheet to support thermal management and mechanical design.
  • Operating Conditions Commercial operating temperature range of 0 °C to 85 °C and commercial grade classification.
  • Compliance RoHS-compliant for compatibility with lead-free manufacturing and environmental requirements.

Typical Applications

  • High-density logic integration — Use the 90,960 logic elements to consolidate complex logic and custom processing blocks onto a single FPGA device.
  • On-chip buffering and state storage — Approximately 4.52 Mbits of embedded RAM supports local data buffering and lookup tables, reducing dependence on external memory.
  • Multi-interface system designs — 308 I/O pins allow broad connectivity for peripheral interfaces, memory buses, and board-level integration.

Unique Advantages

  • High logic capacity: 90,960 logic elements enable implementation of large-scale programmable functions within one device, reducing system complexity.
  • Significant embedded memory: Approximately 4.52 Mbits of on-chip RAM supports data-intensive functions without immediate external memory requirements.
  • Robust I/O count: 308 I/O pins facilitate flexible system interfacing and help minimize the need for external I/O expanders.
  • Compact BGA packaging: 484-ball HBGA (27 × 27 mm) provides a dense footprint suitable for space-constrained PCBs while supporting surface-mount manufacturing.
  • Documented package and thermal data: Package outlines and thermal resistance details are available for informed thermal and mechanical design decisions.
  • RoHS compliant: Supports lead-free assembly and environmental compliance requirements.

Why Choose EP2S90H484C5?

The EP2S90H484C5 positions itself as a high-capacity Stratix II FPGA option for designs that require substantial programmable logic, on-chip memory, and flexible I/O in a single surface-mount package. Its defined core voltage range, commercial temperature rating, and documented package/thermal information make it suitable for engineering teams focused on verifiable electrical and mechanical integration.

As a member of the Stratix II family, the device is supported by mature package documentation that helps streamline thermal planning and board-level implementation, offering designers a predictable platform for medium- to high-density programmable logic projects.

Request a quote or submit an inquiry to receive pricing, availability, and lead-time information for the EP2S90H484C5.

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