EP2S90F780I4

IC FPGA 534 I/O 780FBGA
Part Description

Stratix® II Field Programmable Gate Array (FPGA) IC 534 4520488 90960 780-BBGA

Quantity 702 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package780-FBGA (29x29)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case780-BBGANumber of I/O534Voltage1.15 V - 1.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs4548Number of Logic Elements/Cells90960
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits4520488

Overview of EP2S90F780I4 – Stratix® II FPGA, 780-BBGA

The EP2S90F780I4 is a Stratix® II Field Programmable Gate Array (FPGA) in a 780-ball BGA package designed for industrial-temperature applications. The device combines a large logic fabric with substantial embedded memory and rich I/O to support complex digital designs that require high integration and flexible interfacing.

Architected as part of the Stratix II family, the device provides on-chip resources documented in the Stratix II Device Handbook—including clocking, DSP, memory and configuration features—making it suitable for systems needing extensive programmable logic, dense I/O, and industrial operating range.

Key Features

  • Logic Capacity — 90,960 logic elements to implement large combinational and sequential logic designs.
  • Embedded Memory — Approximately 4.52 Mbits of on-chip RAM (total 4,520,488 bits) for data buffering, FIFOs, and local storage.
  • I/O Density & Flexibility — 534 user I/O pins to support wide external interfaces and parallel connections.
  • Programmable Clocking — Stratix II clocking architecture with PLLs and hierarchical/global clock networks documented in the device handbook for scalable timing and clock management.
  • DSP & High-Speed Data Support — Dedicated digital signal processing resources and high-speed I/O sections referenced in the handbook for signal processing and memory interface tasks.
  • Configuration & Debug — JTAG boundary-scan support and SignalTap II embedded logic analyzer features described in the handbook for configuration and in-system debug.
  • Power & Voltage — Core voltage supply range of 1.15 V to 1.25 V for the device core power domain.
  • Package & Mounting — 780-BBGA package case; supplier device package noted as 780‑FBGA (29×29). Surface-mount design for standard PCB assembly.
  • Industrial Temperature Range — Rated for −40 °C to 100 °C operation for industrial-environment deployments.
  • RoHS Compliant — Meets RoHS requirements for lead-free manufacturing.

Typical Applications

  • High-speed data acquisition & signal processing — Use the device’s DSP resources, substantial logic capacity, and high-speed I/O to implement real-time processing pipelines and data capture front ends.
  • Memory interface controllers — Leverage on-chip memory, dedicated I/O, and the documented external RAM interfacing features for custom memory controller implementations.
  • Industrial control & automation — The industrial temperature rating and high I/O count enable complex control logic, sensor aggregation, and real-time system management in industrial equipment.
  • Prototyping & custom system integration — Large logic density and the Stratix II configuration/debug capabilities (JTAG, SignalTap II) support development and in-system debugging for complex designs.

Unique Advantages

  • Large programmable fabric: 90,960 logic elements allow substantial system integration and consolidation of multiple functions into a single device.
  • Significant on-chip memory: Approximately 4.52 Mbits of embedded RAM reduces external memory dependency for many buffering and state storage needs.
  • High I/O count: 534 I/O pins provide extensive connectivity options for parallel interfaces, external memories, and peripheral devices.
  • Industrial-ready temperature range: Rated from −40 °C to 100 °C to support deployment in demanding environmental conditions.
  • Comprehensive architecture documentation: The Stratix II Device Handbook details clocking, DSP blocks, memory structures, and configuration/debug features to support design and verification.
  • Footprint suitable for dense boards: 780-ball BGA (supplier package 780-FBGA, 29×29) enables high-pin-count integration in compact PCB layouts.

Why Choose EP2S90F780I4?

The EP2S90F780I4 positions itself as a high-capacity Stratix II FPGA option for designs that require extensive programmable logic, substantial embedded memory, dense I/O, and industrial temperature operation. Its documented architecture—covering clock networks, DSP resources, memory organization, and configuration/debug options—helps engineering teams map complex system functions into a single programmable device.

This device is well suited to customers building industrial systems, high-speed data interfaces, and custom controllers who need a balance of logic density, memory, and I/O in a surface-mount, RoHS-compliant BGA package with established vendor documentation for development and verification.

Request a quote or submit a request for pricing and availability to evaluate the EP2S90F780I4 for your next design.

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