EP2S90F780C4
| Part Description |
Stratix® II Field Programmable Gate Array (FPGA) IC 534 4520488 90960 780-BBGA |
|---|---|
| Quantity | 730 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 780-FBGA (29x29) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 780-BBGA | Number of I/O | 534 | Voltage | 1.15 V - 1.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 4548 | Number of Logic Elements/Cells | 90960 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 4520488 |
Overview of EP2S90F780C4 – Stratix® II FPGA, 780-BBGA, 90,960 logic elements
The EP2S90F780C4 is a Stratix® II Field Programmable Gate Array (FPGA) IC from Intel, delivered in a 780-ball BGA package for surface-mount assembly. As a commercial-grade Stratix II device, it provides a high-density programmable logic fabric along with on-chip memory and DSP-oriented resources suitable for demanding digital designs.
Designed for applications that require extensive logic capacity and high I/O count, this device combines substantial embedded memory and dedicated architecture features such as TriMatrix memory organization, DSP circuitry, and advanced clocking/PLL capabilities to enable complex system integration within a single FPGA.
Key Features
- Core Capacity 90,960 logic elements organized across 4,548 LABs, providing a large logic fabric for complex digital designs.
- Embedded Memory Approximately 4.52 Mbits of on-chip RAM using the Stratix II TriMatrix memory architecture for buffering, FIFOs, and local storage.
- DSP & Signal Processing Dedicated Digital Signal Processing blocks and DSP-oriented resources for implementing arithmetic and filtering functions.
- I/O Density & High-Speed Interfaces 534 I/O pins with architecture support for high-speed differential I/O and advanced I/O standards, enabling wide external connectivity and memory interfacing.
- Clocking & PLLs Comprehensive PLL and clock network features for flexible clock distribution and reconfiguration to support multi-clock designs.
- Configuration & Debug Support for IEEE 1149.1 JTAG boundary-scan, SignalTap II embedded logic analyzer, and multiple configuration schemes for in-system programming and debug.
- Packaging & Mounting 780-BBGA package case; supplier device package listed as 780-FBGA (29×29) for surface-mount PCB assembly.
- Power & Operating Range Core supply range of 1.15 V to 1.25 V and commercial operating temperature range of 0 °C to 85 °C.
- Compliance RoHS compliant.
Typical Applications
- High-speed data interfaces Leverage the 534 I/Os and high-speed differential I/O support to implement protocol bridges, packet processing front ends, and wide parallel interfaces.
- Signal processing and DSP Use the dedicated DSP blocks and on-chip memory to implement filters, transforms, and real-time numeric pipelines.
- Memory-intensive subsystems On-chip TriMatrix memory and external RAM interfacing capabilities suit designs that require local buffering and complex memory management.
- Custom system integration and prototyping Large logic capacity and comprehensive configuration/debug support make the device suitable for complex SOC prototypes and custom digital accelerators.
Unique Advantages
- Large programmable fabric: 90,960 logic elements provide headroom for complex state machines, datapaths, and custom logic implementations.
- Substantial embedded memory: Approximately 4.52 Mbits of on-chip RAM reduces dependence on external memory for many buffering and storage tasks.
- High I/O count: 534 I/Os enable broad external connectivity and support for parallel interfaces or multiple high-speed lanes.
- Integrated DSP resources: Dedicated DSP blocks simplify implementation of arithmetic-intensive functions and improve design throughput.
- Flexible clocking and reconfiguration: Enhanced PLLs and clock networks support multi-domain clocking and runtime PLL reconfiguration for adaptable timing architectures.
- Commercial-grade compliance and assembly: Surface-mount 780-BBGA package with RoHS compliance for standard commercial product deployments.
Why Choose EP2S90F780C4?
The EP2S90F780C4 positions itself as a high-density Stratix II FPGA offering significant logic capacity, abundant I/O, embedded memory, and DSP resources in a compact 780-ball BGA package. Its combination of on-chip TriMatrix memory, dedicated DSP blocks, and advanced clocking options makes it well suited to complex commercial designs that need integrated logic, memory, and signal-processing capabilities.
Backed by the Stratix II device handbook and Intel (Altera) documentation, the EP2S90F780C4 provides designers with the resources required for prototyping and deploying feature-rich digital systems where substantial programmable logic and I/O bandwidth are essential.
Request a quote or submit an inquiry to obtain pricing, availability, and lead-time information for EP2S90F780C4. Our team can provide technical details and support to evaluate this Stratix II FPGA for your design requirements.

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