EP2S90F780C4

IC FPGA 534 I/O 780FBGA
Part Description

Stratix® II Field Programmable Gate Array (FPGA) IC 534 4520488 90960 780-BBGA

Quantity 730 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package780-FBGA (29x29)GradeCommercialOperating Temperature0°C – 85°C
Package / Case780-BBGANumber of I/O534Voltage1.15 V - 1.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs4548Number of Logic Elements/Cells90960
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits4520488

Overview of EP2S90F780C4 – Stratix® II FPGA, 780-BBGA, 90,960 logic elements

The EP2S90F780C4 is a Stratix® II Field Programmable Gate Array (FPGA) IC from Intel, delivered in a 780-ball BGA package for surface-mount assembly. As a commercial-grade Stratix II device, it provides a high-density programmable logic fabric along with on-chip memory and DSP-oriented resources suitable for demanding digital designs.

Designed for applications that require extensive logic capacity and high I/O count, this device combines substantial embedded memory and dedicated architecture features such as TriMatrix memory organization, DSP circuitry, and advanced clocking/PLL capabilities to enable complex system integration within a single FPGA.

Key Features

  • Core Capacity  90,960 logic elements organized across 4,548 LABs, providing a large logic fabric for complex digital designs.
  • Embedded Memory  Approximately 4.52 Mbits of on-chip RAM using the Stratix II TriMatrix memory architecture for buffering, FIFOs, and local storage.
  • DSP & Signal Processing  Dedicated Digital Signal Processing blocks and DSP-oriented resources for implementing arithmetic and filtering functions.
  • I/O Density & High-Speed Interfaces  534 I/O pins with architecture support for high-speed differential I/O and advanced I/O standards, enabling wide external connectivity and memory interfacing.
  • Clocking & PLLs  Comprehensive PLL and clock network features for flexible clock distribution and reconfiguration to support multi-clock designs.
  • Configuration & Debug  Support for IEEE 1149.1 JTAG boundary-scan, SignalTap II embedded logic analyzer, and multiple configuration schemes for in-system programming and debug.
  • Packaging & Mounting  780-BBGA package case; supplier device package listed as 780-FBGA (29×29) for surface-mount PCB assembly.
  • Power & Operating Range  Core supply range of 1.15 V to 1.25 V and commercial operating temperature range of 0 °C to 85 °C.
  • Compliance  RoHS compliant.

Typical Applications

  • High-speed data interfaces  Leverage the 534 I/Os and high-speed differential I/O support to implement protocol bridges, packet processing front ends, and wide parallel interfaces.
  • Signal processing and DSP  Use the dedicated DSP blocks and on-chip memory to implement filters, transforms, and real-time numeric pipelines.
  • Memory-intensive subsystems  On-chip TriMatrix memory and external RAM interfacing capabilities suit designs that require local buffering and complex memory management.
  • Custom system integration and prototyping  Large logic capacity and comprehensive configuration/debug support make the device suitable for complex SOC prototypes and custom digital accelerators.

Unique Advantages

  • Large programmable fabric: 90,960 logic elements provide headroom for complex state machines, datapaths, and custom logic implementations.
  • Substantial embedded memory: Approximately 4.52 Mbits of on-chip RAM reduces dependence on external memory for many buffering and storage tasks.
  • High I/O count: 534 I/Os enable broad external connectivity and support for parallel interfaces or multiple high-speed lanes.
  • Integrated DSP resources: Dedicated DSP blocks simplify implementation of arithmetic-intensive functions and improve design throughput.
  • Flexible clocking and reconfiguration: Enhanced PLLs and clock networks support multi-domain clocking and runtime PLL reconfiguration for adaptable timing architectures.
  • Commercial-grade compliance and assembly: Surface-mount 780-BBGA package with RoHS compliance for standard commercial product deployments.

Why Choose EP2S90F780C4?

The EP2S90F780C4 positions itself as a high-density Stratix II FPGA offering significant logic capacity, abundant I/O, embedded memory, and DSP resources in a compact 780-ball BGA package. Its combination of on-chip TriMatrix memory, dedicated DSP blocks, and advanced clocking options makes it well suited to complex commercial designs that need integrated logic, memory, and signal-processing capabilities.

Backed by the Stratix II device handbook and Intel (Altera) documentation, the EP2S90F780C4 provides designers with the resources required for prototyping and deploying feature-rich digital systems where substantial programmable logic and I/O bandwidth are essential.

Request a quote or submit an inquiry to obtain pricing, availability, and lead-time information for EP2S90F780C4. Our team can provide technical details and support to evaluate this Stratix II FPGA for your design requirements.

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