EP2S90F780I4N

IC FPGA 534 I/O 780FBGA
Part Description

Stratix® II Field Programmable Gate Array (FPGA) IC 534 4520488 90960 780-BBGA

Quantity 876 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package780-FBGA (29x29)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case780-BBGANumber of I/O534Voltage1.15 V - 1.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs4548Number of Logic Elements/Cells90960
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits4520488

Overview of EP2S90F780I4N – Stratix® II FPGA, 90,960 Logic Elements, 780‑BBGA

The EP2S90F780I4N is an Intel Stratix® II field programmable gate array (FPGA) supplied in a 780‑ball BGA package. It combines high logic capacity with substantial on‑chip memory and dense I/O to address demanding industrial and high‑performance embedded applications.

With 90,960 logic elements, approximately 4.52 Mbits of embedded memory, and 534 I/O pins, this device is built for designs that require large programmable logic fabrics, extensive on‑chip storage, and broad external connectivity while operating across an industrial temperature range.

Key Features

  • Core Logic Capacity — 90,960 logic elements provide a large programmable fabric for complex digital designs and system integration.
  • Embedded Memory — Approximately 4.52 Mbits of on‑chip RAM to support buffers, FIFOs, and embedded data storage.
  • I/O Density — 534 I/O pins enable extensive external device interfacing and system-level connectivity.
  • Advanced Clocking & DSP — Stratix II architecture includes PLLs, hierarchical clocking and dedicated digital signal processing resources as documented in the Stratix II Device Handbook, supporting complex timing and signal processing tasks.
  • Configuration & Test Support — Device family supports standard configuration schemes and debugging features such as JTAG boundary‑scan and an embedded logic analyzer, as described in the device handbook.
  • Power — Core voltage supply range of 1.15 V to 1.25 V for FPGA core operation.
  • Package & Mounting — Supplied in a 780‑BBGA package (supplier device package listed as 780‑FBGA, 29×29) with surface‑mount mounting for dense board-level integration.
  • Operating Range & Compliance — Industrial grade device with an operating temperature range of −40°C to 100°C and RoHS compliance.

Typical Applications

  • Industrial Control — Platform for motor control, PLCs, and factory automation where large logic capacity and industrial temperature tolerance are required.
  • High‑Performance Signal Processing — Suitable for data buffering and on‑device processing using the device’s embedded memory and DSP architecture.
  • External Memory Interfaces — Designed for applications requiring robust external RAM interfacing and complex memory controllers, leveraging the device family’s memory interface capabilities.
  • Test & Measurement Systems — High logic density and extensive I/O allow implementation of instrument control, data capture, and custom signal handling functions.

Unique Advantages

  • High integration density: 90,960 logic elements and ~4.52 Mbits of on‑chip RAM reduce the need for external logic and memory, simplifying bill of materials and board complexity.
  • Extensive I/O resources: 534 I/Os enable direct connection to sensors, peripherals, and high‑pin‑count interfaces without additional multiplexing hardware.
  • Industrial robustness: −40°C to 100°C operating range and surface‑mount 780‑ball BGA package support deployment in demanding industrial environments.
  • Flexible timing and DSP support: On‑device PLLs, hierarchical clocking, and DSP blocks provide the timing control and compute resources needed for complex signal chains.
  • Comprehensive configuration and debug: Built‑in support for JTAG boundary‑scan and embedded logic analysis facilitates bring‑up, validation, and in‑system debugging.
  • Standards and compliance: RoHS compliance supports regulatory and environmental requirements for modern electronics production.

Why Choose EP2S90F780I4N?

The EP2S90F780I4N positions itself as a high‑capacity, industrial‑grade Stratix II FPGA that balances large programmable logic resources with substantial on‑chip memory and broad I/O. It is suited for engineering teams designing complex embedded systems, industrial controllers, and signal processing platforms that demand integration and reliable operation across wide temperature ranges.

As part of the Stratix II device family, the EP2S90F780I4N benefits from comprehensive device documentation and configuration/test features, making it a practical choice for projects that require scalability, robust debugging, and extensive programmable resources.

Request a quote or submit a sales inquiry to receive pricing, availability, and technical procurement assistance for the EP2S90F780I4N.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1968


    Headquarters: Santa Clara, California, USA


    Employees: 130,000+


    Revenue: $54.23 Billion


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018


    Featured Products
    Latest News
    keyboard_arrow_up