EP2S90F780C5

The EP2S90F780C5 is a Stratix® II field programmable gate array (FPGA) from Altera, offered in a 780-ball BGA/FCBGA package. It provides a high-density programmable logic foundation for designs that require large logic capacity, substantial embedded memory, and a high I/O count within a surface-mount package.

Key electrical and environmental parameters include a 1.15 V to 1.25 V supply range, commercial operating temperature from 0 °C to 85 °C, and RoHS compliance—making the device suitable for a broad range of commercial embedded applications.

Key Features

• High Logic Capacity — Contains 90,960 logic elements to implement complex digital functions and wide datapath architectures.
• Embedded Memory — Approximately 4.52 Mbits of on-chip RAM to support buffering, FIFOs, and temporary data storage without external memory.
• Extensive I/O — 534 user I/Os for interfacing to multiple peripherals, buses, and board-level signals.
• Package and Mounting — 780-BBGA (FCBGA) package, supplier device package 780-FBGA (29×29), designed for surface-mount assembly.
• Power — Supported core supply voltage range from 1.15 V to 1.25 V to match system power rails.
• Commercial Grade Temperature — Rated for 0 °C to 85 °C operation for standard commercial deployments.
• Regulatory Compliance — RoHS compliant.

Typical Applications

• High-density digital processing — Implement wide datapaths and large custom logic blocks using the 90,960 logic elements and significant embedded memory.
• Interface aggregation — Consolidate multiple I/O interfaces and peripherals leveraging the 534 available I/Os.
• Prototyping and system validation — Use the programmable fabric and on-chip RAM to validate complex system functions before ASIC migration or final integration.
• Embedded control and data handling — Combine logic capacity and on-chip memory for control tasks, packet buffering, and real-time data manipulation in commercial products.

Unique Advantages

• High logic density: 90,960 logic elements enable consolidation of large logic functions into a single FPGA, reducing board-level complexity.
• Significant on-chip memory: Approximately 4.52 Mbits of embedded RAM minimizes the need for external memory in many buffering and temporary storage use cases.
• Large I/O capacity: 534 I/Os support diverse peripheral connectivity and multi-channel interfaces without extensive external multiplexing.
• Compact FCBGA package: 780-ball FCBGA (29×29) delivers high pin count in a compact, surface-mount form factor suitable for dense board designs.
• Commercial temperature rating and RoHS compliance: Ready for standard commercial deployments with environmental compliance already met.
• Tightly specified core supply: The 1.15 V to 1.25 V supply range supports predictable power integration within system power architecture.

Why Choose EP2S90F780C5?

The EP2S90F780C5 combines very large logic capacity, substantial embedded RAM, and a high I/O count in a compact 780-ball FCBGA surface-mount package, making it a solid choice for commercial designs that need substantial programmable resources on a single device. Its defined supply range, commercial temperature rating, and RoHS compliance provide clear, verifiable parameters for system integration and procurement.

This FPGA is suited to engineers and procurement teams working on dense digital designs, interface aggregation, or prototyping efforts where on-chip resources and a high pin count reduce external component count and simplify board-level routing.

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