EP2S90F1508I4N

IC FPGA 902 I/O 1508FBGA
Part Description

Stratix® II Field Programmable Gate Array (FPGA) IC 902 4520488 90960 1508-BBGA, FCBGA

Quantity 754 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1508-FBGA, FC (40x40)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1508-BBGA, FCBGANumber of I/O902Voltage1.15 V - 1.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs4548Number of Logic Elements/Cells90960
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits4520488

Overview of EP2S90F1508I4N – Stratix® II FPGA, 1508-BBGA (FCBGA)

The EP2S90F1508I4N is an Intel Stratix® II Field Programmable Gate Array supplied in a 1508-ball FCBGA package. It integrates a large programmable fabric with high I/O density and embedded memory to support complex digital logic and system integration.

With 90,960 logic elements, approximately 4.52 Mbits of embedded memory, and 902 I/O pins, this industrial-grade FPGA targets designs requiring substantial logic capacity, extensive interfacing, and robust thermal performance across –40 °C to 100 °C.

Key Features

  • Logic Capacity  Provides 90,960 logic elements to implement large-scale digital functions and custom hardware accelerators.
  • Embedded Memory  Approximately 4.52 Mbits of on-chip RAM for buffering, FIFOs, and local storage to support complex datapaths and state machines.
  • I/O Density  902 user I/O pins offer extensive external connectivity for parallel interfaces, memory buses, and multi-channel I/O systems.
  • Power Supply  Operates from a core voltage range of 1.15 V to 1.25 V, enabling predictable power sequencing and integration with common FPGA power architectures.
  • Package & Mounting  1508-ball BGA FCBGA package (supplier package: 1508-FBGA, FC 40×40) in a surface-mount form factor for compact, board-level integration.
  • Industrial Temperature Range  Rated for operation from –40 °C to 100 °C, suitable for industrial environments where extended temperature tolerance is required.
  • Compliance  RoHS-compliant construction for environmentally responsible designs.
  • Documentation & Architecture  Part of the Stratix II family with detailed device handbook material covering architecture, PLLs, I/O standards, memory blocks, and configuration/testing features.

Typical Applications

  • Industrial Control and Automation  Implements complex control logic and high-channel I/O aggregation while operating across industrial temperature ranges.
  • Memory Interface and Bridge Logic  On-chip memory and abundant I/O let the device act as an interface controller or custom memory bridge for external RAM subsystems.
  • Digital Signal Processing  Large logic capacity and embedded RAM support implementation of DSP pipelines and custom accelerators described in the Stratix II architecture.
  • High-Density I/O Systems  Use the 902 I/O pins for multiport connectivity, parallel buses, and mixed I/O standards supported by the Stratix II family.

Unique Advantages

  • High logic density: 90,960 logic elements enable consolidation of multiple functions into a single device, reducing board-level complexity.
  • Substantial embedded memory: Approximately 4.52 Mbits of on-chip RAM minimizes external memory dependencies for many buffering and storage needs.
  • Extensive external connectivity: 902 I/O pins provide flexibility for wide data buses, numerous peripherals, or parallel interfaces without multiplexing compromises.
  • Industrial ready: Rated for –40 °C to 100 °C to meet temperature demands in industrial deployments.
  • Compact BGA packaging: 1508-ball FCBGA (40×40) surface-mount package supports dense board layouts while delivering the required pin count.
  • Standards and compliance: RoHS-compliant construction supports regulatory and manufacturing requirements for many product lines.

Why Choose EP2S90F1508I4N?

The EP2S90F1508I4N combines a high logic element count, substantial embedded RAM, and nearly 1,000 I/O pins in a single industrial-grade Stratix II FPGA package. Its voltage and thermal ratings, along with the 1508-ball FCBGA footprint, make it appropriate for designs that demand integration of complex logic, extensive interfacing, and reliable operation across a broad temperature range.

This device suits engineering teams building systems that require on-chip memory, dense programmable logic, and high pin counts—providing a scalable platform consistent with Stratix II architecture and documentation for development and system-level integration.

If you would like pricing or availability, request a quote or submit a purchase inquiry and include the part number EP2S90F1508I4N for a fast response.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1968


    Headquarters: Santa Clara, California, USA


    Employees: 130,000+


    Revenue: $54.23 Billion


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018


    Featured Products
    Latest News
    keyboard_arrow_up