EP2S90F1508C5N

The EP2S90F1508C5N is a Stratix® II Field Programmable Gate Array (FPGA) IC that delivers high logic capacity and substantial on‑chip memory in a 1508‑ball FCBGA package. Built on the Stratix II device architecture, this device provides programmable logic, embedded memory, and advanced I/O capabilities suitable for designs requiring large-scale custom logic integration.

With 90,960 logic elements, approximately 4.52 Mbits of embedded RAM, and 902 I/O pins, the EP2S90F1508C5N targets applications that demand high integration density, extensive I/O connectivity, and flexible programmable resources while operating from a 1.15–1.25 V core supply.

Key Features

• High Logic Capacity  90,960 logic elements provide substantial programmable logic resources for complex combinational and sequential designs.
• Significant On‑Chip Memory  Approximately 4.52 Mbits of embedded RAM to support large buffers, packet queues, or local data storage.
• Extensive I/O  902 I/O pins enable wide external device connectivity and high‑pin‑count interfaces.
• Stratix II Architecture  Device family architecture documented in the Stratix II Device Handbook, including features such as logic array blocks, DSP blocks, PLLs, TriMatrix memory, and multi‑track interconnect described in the datasheet material.
• Advanced I/O and Configuration Support  Architecture-level support for high‑speed I/O standards, on‑chip termination, IEEE 1149.1 JTAG boundary‑scan, and configuration/testing resources as outlined in the device documentation.
• Package and Mounting  1508‑ball FCBGA package (supplier device package: 1508‑FBGA, FC 40×40) designed for surface‑mount assembly.
• Power and Temperature  Core voltage supply range from 1.15 V to 1.25 V and an operating temperature range of 0 °C to 85 °C (commercial grade).
• Regulatory Compliance  RoHS compliant.

Typical Applications

• High‑speed I/O systems  Leverage the device’s large I/O count and documented high‑speed I/O support for board‑level interfaces and multi‑lane connectivity.
• External memory interfaces  Use the embedded memory and architecture features to implement controllers and buffering for external memory subsystems.
• Digital signal processing  Apply the Stratix II architecture’s DSP block and logic resources for data‑parallel processing and custom signal paths.
• Custom logic integration  Consolidate multiple discrete functions into a single FPGA using the high logic element count and extensive interconnect resources.

Unique Advantages

• High integration density: 90,960 logic elements and ~4.52 Mbits of embedded RAM reduce the need for external glue logic and on‑board memory.
• Broad external connectivity: 902 I/Os allow implementation of wide buses, multiple interfaces, and flexible pin assignments for complex systems.
• Family‑level architecture: Stratix II device handbook details—such as PLLs, TriMatrix memory, DSP blocks, and multi‑track interconnect—provide a documented platform for architectural features leveraged in designs.
• Commercial temperature grade: Rated for 0 °C to 85 °C operation to match typical commercial electronic applications.
• Surface‑mount FCBGA packaging: 1508‑ball FCBGA (40×40) package supports high‑density board layouts and robust board integration.
• Standards and testability: Device family documentation includes JTAG boundary‑scan and configuration/testing features to support manufacturing test and in‑system configuration.

Why Choose EP2S90F1508C5N?

The EP2S90F1508C5N positions itself as a high‑capacity Stratix II FPGA option for designs that require extensive programmable logic, substantial embedded memory, and a large number of I/Os in a compact FCBGA package. Its documented architecture elements—covering memory, DSP resources, PLLs, and advanced I/O support—help engineers consolidate system functions and implement complex, high‑bandwidth logic on a single device.

This device is well suited to design teams and system integrators seeking a commercially graded FPGA with verified family‑level documentation and the resources to support robust, high‑density implementations. Its combination of logic capacity, memory, and I/O density supports scalable designs and long‑term maintainability within the Stratix II device family.

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