EP2S90F1508C3N

IC FPGA 902 I/O 1508FBGA
Part Description

Stratix® II Field Programmable Gate Array (FPGA) IC 902 4520488 90960 1508-BBGA, FCBGA

Quantity 109 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1508-FBGA, FC (40x40)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1508-BBGA, FCBGANumber of I/O902Voltage1.15 V - 1.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs4548Number of Logic Elements/Cells90960
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits4520488

Overview of EP2S90F1508C3N – Stratix® II FPGA — 90,960 Logic Elements, 1508‑FBGA

The EP2S90F1508C3N is a Stratix® II family field programmable gate array (FPGA) in a 1508‑FBGA surface‑mount package. It provides a high logic capacity with integrated on‑chip memory and a large I/O count for dense, reconfigurable system designs.

Designed for commercial‑grade applications, this device is suited to designs that require substantial logic resources, embedded RAM, and robust I/O capability while operating within a 1.15 V to 1.25 V core supply range and a 0 °C to 85 °C temperature window.

Key Features

  • Logic Capacity — 90,960 logic elements arranged across 4,548 logic array blocks (LABs) to implement complex programmable logic functions.
  • Embedded Memory — 4,520,488 total RAM bits (approximately 4.52 Mbits) of on‑chip memory for FIFOs, buffers, and local data storage.
  • High I/O Density — 902 I/O pins to support extensive peripheral interfacing and multi‑lane signaling.
  • Power and Thermal — Core voltage supply 1.15 V to 1.25 V; commercial operating temperature range 0 °C to 85 °C.
  • Package & Mounting — 1508‑BBGA (FCBGA) supplier package 1508‑FBGA, FC (40×40); surface‑mount mounting for standard PCB assembly.
  • Stratix II Family Architecture — Device handbook coverage includes advanced architecture elements such as adaptive logic modules, DSP blocks, multi‑track interconnect, PLLs and clock networks, and TriMatrix memory organization.
  • Configuration & Debugging — Family documentation references support for IEEE‑1149.1 JTAG boundary‑scan and embedded debug features such as SignalTap II logic analysis and multiple configuration schemes.
  • I/O and Interface Features — Family‑level capabilities include high‑speed differential I/O, double data rate I/O support, programmable drive strengths, on‑chip termination and multi‑VOLT I/O interface options as documented for Stratix II devices.
  • Regulatory — RoHS compliant.

Typical Applications

  • High‑Performance Signal Processing — Use the Stratix II device family’s DSP blocks and large logic fabric to implement filters, transforms, and other compute‑intensive data paths.
  • Memory Interface & Bridging — On‑chip RAM and documented external memory interfacing support make this device suitable for memory controller and bridging functions.
  • High‑Density I/O Systems — The 902 I/O pins support multi‑lane connectivity, high‑speed differential signaling and complex board‑level I/O requirements.
  • Prototyping & Embedded Logic Analysis — Built‑in JTAG boundary‑scan and SignalTap II family features facilitate board bring‑up and in‑system debugging.

Unique Advantages

  • Substantial Logic Resources: 90,960 logic elements and 4,548 LABs provide significant capacity for large FPGA designs without external logic.
  • Embedded Memory On‑Board: Approximately 4.52 Mbits of RAM reduces dependency on external memory for many buffering and storage tasks.
  • Extensive I/O Count: 902 I/Os enable complex multi‑interface designs and high signal routing density on a single device.
  • Comprehensive Family Documentation: Stratix II device handbook covers architecture, timing, PLLs, I/O standards, configuration and test features to support design and verification.
  • Commercial‑Grade Reliability: Specified operating range (0 °C to 85 °C) and RoHS compliance meet standard commercial product requirements.
  • Standard Package for Production: 1508‑FBGA surface‑mount package (40×40) supports established PCB assembly processes for volume manufacturing.

Why Choose EP2S90F1508C3N?

The EP2S90F1508C3N delivers a balanced combination of large logic capacity, substantial embedded RAM, and extensive I/O in a commercial‑grade Stratix II FPGA package. It is well suited for engineers developing complex signal processing, memory interfacing, and high‑I/O designs that require a mature device family with extensive architectural and configuration documentation.

Choose this device when you need on‑chip resources to reduce external components, flexible I/O to accommodate multiple interfaces, and Stratix II family features such as PLLs, DSP blocks, and embedded debugging capabilities to streamline development and verification.

Request a quote or submit an inquiry for EP2S90F1508C3N to obtain pricing and availability information.

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