EP2S90F1508C3
| Part Description |
Stratix® II Field Programmable Gate Array (FPGA) IC 902 4520488 90960 1508-BBGA, FCBGA |
|---|---|
| Quantity | 1,575 Available (as of May 26, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 1508-FBGA, FC (40x40) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1508-BBGA, FCBGA | Number of I/O | 902 | Voltage | 1.15 V - 1.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 4548 | Number of Logic Elements/Cells | 90960 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 4520488 |
Overview of EP2S90F1508C3 – Stratix® II FPGA, 90,960 logic elements, 1508-FBGA
The EP2S90F1508C3 is an Intel Stratix® II field programmable gate array (FPGA) supplied in a 1508-ball FCBGA package. It combines high logic capacity with substantial embedded memory and a large I/O count to support complex digital designs.
Designed for commercial applications, this device is targeted at designs that require significant programmable logic, multi-megabit on-chip memory, and advanced I/O and clocking resources for tasks such as signal processing, high‑speed interfaces, and system integration.
Key Features
- Programmable Logic Capacity — 90,960 logic elements provide substantial combinational and sequential resources for high-density logic implementation.
- Embedded Memory — Approximately 4.52 Mbits of on‑chip RAM (4,520,488 bits) to support buffering, frame storage, and memory-mapped logic functions.
- I/O Density — 902 I/O pins for wide parallel interfaces and flexible board-level connectivity.
- Clocking and Timing — Device handbook details include PLLs and global/hierarchical clocking features to support complex timing architectures and multiple clock domains.
- DSP and High-Speed I/O Support — Architecture includes dedicated digital signal processing blocks and high-speed differential I/O support for data-path and interface-intensive applications.
- Configuration & Test — Supports standard configuration and testing features such as JTAG boundary-scan and embedded logic analysis capabilities noted in the device documentation.
- Power and Voltage — Core voltage range specified at 1.15 V to 1.25 V to match system power rails and design requirements.
- Package & Mounting — Surface-mount 1508-BBGA (1508-FBGA, FC 40×40) package for high-density board integration.
- Operating Conditions — Commercial-grade temperature range from 0 °C to 85 °C and RoHS-compliant construction.
Typical Applications
- High-Speed Communications — Use the device’s abundant logic, DSP blocks, and high-speed I/O to implement protocol processing, line cards, or interface bridging.
- Signal Processing — Large logic capacity and embedded RAM make it suitable for filtering, transforms, and data aggregation in DSP-centric systems.
- Memory Interface & Buffering — On‑chip RAM and dedicated interface resources support external RAM interfacing and data buffering for throughput-critical designs.
- System Integration & Prototyping — High I/O count and flexible clocking enable integration of multiple peripherals and rapid prototyping of complex digital systems.
Unique Advantages
- High Logic Density: 90,960 logic elements reduce the need for multiple devices by consolidating complex functions into a single FPGA.
- Multi‑Mbit Embedded Memory: Approximately 4.52 Mbits of on‑chip RAM supports deep buffering and local storage without external memory for many use cases.
- Extensive I/O Resources: 902 I/O pins provide flexibility for parallel buses, multiple interfaces, and board-level partitioning.
- Advanced Clocking Options: Built-in PLL and hierarchical clocking features (as documented) simplify multi-domain timing and synchronous design implementation.
- Production-Ready Package: Surface-mount 1508-FBGA package enables compact, manufacturable PCB layouts for commercial products.
- Standards and Test Support: On-chip test and configuration features described in the device documentation facilitate board bring-up and in-system debugging.
Why Choose EP2S90F1508C3?
The EP2S90F1508C3 positions itself as a high-capacity, commercially graded Stratix® II FPGA suitable for designs that demand a combination of large programmable logic, substantial embedded memory, and broad I/O connectivity. Its documented architecture elements—DSP blocks, advanced clocking, and configuration/test support—make it well suited for communications, signal processing, and complex system integration tasks.
For engineering teams and procurement focused on consolidating functionality, accelerating development, and leveraging established FPGA architecture, this device provides the documented features and operating parameters needed to evaluate fit within commercial product roadmaps.
Request a quote or submit your inquiry to our sales team to get pricing, availability, and additional technical support for EP2S90F1508C3.

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