EP2S90F1020I4N

IC FPGA 758 I/O 1020FBGA
Part Description

Stratix® II Field Programmable Gate Array (FPGA) IC 758 4520488 90960 1020-BBGA

Quantity 851 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1020-FBGA (33x33)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1020-BBGANumber of I/O758Voltage1.15 V - 1.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs4548Number of Logic Elements/Cells90960
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits4520488

Overview of EP2S90F1020I4N – Stratix® II FPGA, 1020‑BBGA, Industrial

The EP2S90F1020I4N is a Stratix® II field programmable gate array (FPGA) in a 1020‑BBGA surface‑mount package, offered in an industrial temperature grade. It integrates a large programmable fabric with dedicated DSP resources, multi‑track interconnect, and extensive I/O to support complex, high‑integration digital designs.

With 90,960 logic elements, approximately 4.52 Mbits of embedded memory, and 758 I/O pins, this device is aimed at applications that require substantial on‑chip logic, memory bandwidth, and flexible I/O and clocking options.

Key Features

  • Core Logic 4,548 logic array blocks (LABs) delivering 90,960 logic elements for large, partitioned designs and custom logic implementations.
  • Embedded Memory Approximately 4.52 Mbits of on‑chip RAM presented as TriMatrix memory blocks for buffering, FIFOs, and on‑chip data storage.
  • DSP & Processing Blocks Dedicated digital signal processing block support for high‑throughput arithmetic and signal processing functions (as described in the Stratix II architecture).
  • I/O and Interface Options 758 I/O pins with support for high‑speed I/O standards, double data rate (DDR) I/O, multi‑volt I/O interfacing, programmable drive strength, on‑chip termination, programmable pull‑ups, and bus‑hold features.
  • Clocking & PLLs Enhanced and fast PLLs with global and hierarchical clocking networks to support complex clocking schemes and deterministic timing architectures.
  • Configuration & Debug Supports IEEE Std. 1149.1 JTAG boundary‑scan and SignalTap II embedded logic analyzer for in‑system debug, plus multiple configuration schemes referenced in the Stratix II device handbook.
  • Power & Operating Range Core supply range of 1.15 V to 1.25 V with industrial operating temperature range from −40 °C to 100 °C, suitable for temperature‑sensitive deployments.
  • Package & Mounting 1020‑BBGA (supplier package: 1020‑FBGA, 33 × 33 mm) surface‑mount package for high‑density board designs.
  • Compliance RoHS compliant.

Typical Applications

  • High‑speed Interface Controllers Use the device’s high‑speed I/O and DDR support for external memory interfaces and demanding serial/parallel link implementations.
  • Signal Processing and Compression Leverage dedicated DSP blocks and abundant logic elements for real‑time filtering, encoding, and other compute‑intensive signal tasks.
  • Custom Logic and System Integration Deploy as the central programmable element for complex control, protocol bridging, or glue logic where extensive on‑chip RAM and I/O are required.

Unique Advantages

  • High integration density: 90,960 logic elements and ~4.52 Mbits of embedded memory reduce the need for external ASICs and discrete SRAM in many designs.
  • Comprehensive I/O flexibility: 758 I/Os with support for advanced I/O standards, programmable termination, and multi‑volt interfacing simplifies system‑level signal interfacing.
  • Robust clocking options: Enhanced and fast PLLs plus hierarchical clocking support complex timing domains and multi‑channel synchronization.
  • In‑system visibility and configuration: JTAG boundary‑scan and SignalTap II embedded logic analyzer support accelerate bring‑up and debug without external instrumentation.
  • Industrial temperature capability: −40 °C to 100 °C rating supports deployment in temperature‑sensitive industrial environments.
  • Surface‑mount, high‑density packaging: 1020‑BBGA (33 × 33 mm) provides a compact footprint for high‑pin‑count system boards.

Why Choose EP2S90F1020I4N?

The EP2S90F1020I4N positions itself as a high‑capacity Stratix II FPGA option that balances abundant logic resources, sizable on‑chip memory, and extensive I/O capability with a robust set of architecture features documented in the Stratix II device handbook. Its clocking resources, DSP support, and on‑chip features address designs that require both compute density and flexible interfacing.

This device is suited to engineering teams building complex digital systems who need a programmable, scalable platform with in‑system debug and configuration options. The industrial grade temperature range and RoHS compliance provide predictable environmental behavior and regulatory alignment for long‑lifecycle deployments.

If you would like pricing, availability, or to request a formal quote for EP2S90F1020I4N, please submit an inquiry with your required quantity and delivery timeframe.

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