EP2S90F1020I5

The EP2S90F1020I5 is a high-density Stratix® II field programmable gate array (FPGA) supplied in a 1020‑BBGA surface-mount package. It delivers substantial programmable logic capacity with 90,960 logic elements, approximately 4.52 Mbits of embedded memory, and 758 user I/O pins for integration in complex systems.

Designed for industrial applications, this device supports operation across a wide voltage and temperature window (1.15 V to 1.25 V core supply; −40 °C to 100 °C), providing robust electrical and thermal headroom for industrial embedded, control, and I/O-intensive designs.

Key Features

• Logic Capacity  Approximately 90,960 logic elements to implement complex combinational and sequential logic.
• Embedded Memory  Approximately 4.52 Mbits of on-chip RAM (4,520,488 total RAM bits) for buffering, FIFOs, and on-chip data storage.
• User I/O  758 user I/O pins to interface with sensors, peripherals, memory, and system-level buses.
• Package & Mounting  1020‑BBGA package (supplier device package: 1020‑FBGA, 33×33) in a surface-mount form factor for compact board designs.
• Power Supply  Selectable operation within a core supply range of 1.15 V to 1.25 V to meet system power requirements.
• Operating Range & Grade  Industrial grade device rated for −40 °C to 100 °C operation, suitable for demanding environments.
• Compliance  RoHS‑compliant for reduced environmental impact and regulatory alignment.

Typical Applications

• Industrial Automation  Control logic, real‑time I/O aggregation, and protocol bridging in factory and process automation systems where industrial temperature ratings are required.
• Embedded Systems  Custom processing engines, glue logic, and peripheral aggregation for compact embedded platforms requiring substantial on-chip memory and I/O.
• Communications & Networking  I/O‑dense implementations for protocol handling, packet parsing, and interface bridging in networking equipment and infrastructure appliances.
• Signal Processing  On-chip memory and large logic capacity make this device suitable for custom DSP pipelines, buffering, and data preprocessing tasks.

Unique Advantages

• High Logic Density: Large logic element count enables consolidation of multiple functions into a single device, reducing board-level component count.
• Generous Embedded Memory: Approximately 4.52 Mbits of on-chip RAM supports large buffers and FIFOs without immediate external memory dependency.
• Broad I/O Count: 758 user I/Os provide flexibility to connect numerous peripherals, sensors, and external interfaces directly to the FPGA.
• Industrial Reliability: Industrial-grade specification and wide operating temperature range support deployment in harsh or temperature-variable environments.
• Compact Packaging: 1020‑BBGA (33×33) package enables high integration density in space-constrained designs while maintaining surface-mount assembly compatibility.
• Regulatory Alignment: RoHS compliance simplifies use in products requiring reduced-hazard materials.

Why Choose EP2S90F1020I5?

The EP2S90F1020I5 balances substantial programmable logic capacity, on-chip memory, and a high pin count in a single industrial-grade, surface-mount package. It is suited to designers who need to consolidate complex logic, buffering, and extensive I/O on a compact board footprint while maintaining operation across broad temperature and voltage ranges.

This device is a practical choice for engineering teams building industrial control, embedded processing, communications, or signal-processing solutions that require high logic density, significant embedded RAM, and robust industrial specifications.

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