EP2S90F1508C4N
| Part Description |
Stratix® II Field Programmable Gate Array (FPGA) IC 902 4520488 90960 1508-BBGA, FCBGA |
|---|---|
| Quantity | 600 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 1508-FBGA, FC (40x40) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1508-BBGA, FCBGA | Number of I/O | 902 | Voltage | 1.15 V - 1.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 4548 | Number of Logic Elements/Cells | 90960 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 4520488 |
Overview of EP2S90F1508C4N – Stratix® II FPGA, 1508-BBGA FCBGA
The EP2S90F1508C4N is a Stratix® II Field Programmable Gate Array (FPGA) in a 1508-BBGA (FCBGA) package. It delivers a high-density programmable fabric with 90,960 logic elements and 4,548 LABs, optimized for designs that require substantial on-chip logic and I/O capacity.
This commercial-grade device integrates approximately 4.52 Mbits of embedded memory and 902 user I/Os, and operates from a 1.15 V to 1.25 V core rail with an ambient operating range of 0 °C to 85 °C. It is RoHS compliant and supplied in a surface-mount 1508-FBGA (40×40) footprint.
Key Features
- Core logic 90,960 logic elements and 4,548 LABs provide a high-density programmable fabric for complex combinational and sequential logic implementation.
- Embedded memory Approximately 4.52 Mbits of on-chip RAM for large LUT-based storage and buffering directly within the FPGA fabric.
- I/O capacity 902 user I/O pins support designs that require broad external connectivity and multiple parallel interfaces.
- Clocking, DSP and timing features Stratix II architecture includes dedicated DSP block circuitry, enhanced and fast PLLs, and extensive clock network options for structured timing and high-performance signal processing (as described in the Stratix II device documentation).
- High-speed I/O capabilities The Stratix II family documentation provides high-speed I/O specifications, differential I/O options, and on-chip termination features to support demanding interface requirements.
- Configuration & debug Series documentation details configuration schemes and embedded logic analyzer support for JTAG-based configuration and in-system troubleshooting.
- Power and operating range Core supply from 1.15 V to 1.25 V and commercial operating temperature range of 0 °C to 85 °C for typical commercial deployment scenarios.
- Package and mounting 1508-BBGA (FCBGA) package, supplied as 1508-FBGA FC (40×40), surface-mount for board-level integration and high I/O density.
- RoHS compliance Device is RoHS compliant, supporting regulatory requirements for lead-free manufacturing processes.
Typical Applications
- Memory interface and buffering Designs that require external memory interfacing and large on-chip buffers can leverage the device’s embedded RAM and documented external memory interface guidance.
- High-density programmable logic Systems needing significant custom logic capacity—such as protocol processing, control logic, or glue logic—benefit from 90,960 logic elements and abundant LAB resources.
- Signal processing subsystems Applications that use dedicated DSP circuitry and PLL-based clocking for deterministic timing and processing are supported by the Stratix II architecture features documented for the family.
- High-pin-count I/O systems Multi-channel and high-throughput designs that require extensive external interfacing can use the device’s 902 I/Os and high-speed I/O capabilities.
Unique Advantages
- High logic density: 90,960 logic elements enable consolidation of complex functions into a single device, reducing inter-chip routing and system BOM.
- Substantial embedded memory: Approximately 4.52 Mbits of on-chip RAM supports large buffers, FIFOs, and LUT-based storage close to logic for lower latency.
- Extensive I/O resources: 902 I/Os provide the pin-bandwidth needed for multi-channel interfaces, parallel buses, and board-level integration without external I/O expanders.
- Rich family-level features: Stratix II device documentation details DSP blocks, PLLs, high-speed I/O, and configuration/debug capabilities that help accelerate system-level implementations.
- Commercial-grade readiness: Specified operating range of 0 °C to 85 °C and surface-mount 1508-FBGA footprint align with standard commercial manufacturing and assembly flows.
- Regulatory-friendly: RoHS compliance supports lead-free production processes and broader regulatory acceptance.
Why Choose EP2S90F1508C4N?
The EP2S90F1508C4N combines a high-count logic fabric with multi-megabit embedded memory and expansive I/O in a single 1508-BBGA package, making it suitable for commercial designs that require dense programmable logic, substantial on-chip storage, and broad external connectivity. Its Stratix II architecture elements—such as DSP blocks, PLLs, and documented high-speed I/O options—provide the architectural building blocks needed for complex signal processing and interface-centric designs.
This device is a strong fit for teams seeking to consolidate functionality, reduce board-level complexity, and leverage Stratix II family documentation for configuration, timing, and high-speed interface implementation. Its commercial-grade temperature range, surface-mount package, and RoHS compliance support typical production workflows and regulatory requirements.
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