EP2S90F1508C4N

IC FPGA 902 I/O 1508FBGA
Part Description

Stratix® II Field Programmable Gate Array (FPGA) IC 902 4520488 90960 1508-BBGA, FCBGA

Quantity 600 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1508-FBGA, FC (40x40)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1508-BBGA, FCBGANumber of I/O902Voltage1.15 V - 1.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs4548Number of Logic Elements/Cells90960
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits4520488

Overview of EP2S90F1508C4N – Stratix® II FPGA, 1508-BBGA FCBGA

The EP2S90F1508C4N is a Stratix® II Field Programmable Gate Array (FPGA) in a 1508-BBGA (FCBGA) package. It delivers a high-density programmable fabric with 90,960 logic elements and 4,548 LABs, optimized for designs that require substantial on-chip logic and I/O capacity.

This commercial-grade device integrates approximately 4.52 Mbits of embedded memory and 902 user I/Os, and operates from a 1.15 V to 1.25 V core rail with an ambient operating range of 0 °C to 85 °C. It is RoHS compliant and supplied in a surface-mount 1508-FBGA (40×40) footprint.

Key Features

  • Core logic 90,960 logic elements and 4,548 LABs provide a high-density programmable fabric for complex combinational and sequential logic implementation.
  • Embedded memory Approximately 4.52 Mbits of on-chip RAM for large LUT-based storage and buffering directly within the FPGA fabric.
  • I/O capacity 902 user I/O pins support designs that require broad external connectivity and multiple parallel interfaces.
  • Clocking, DSP and timing features Stratix II architecture includes dedicated DSP block circuitry, enhanced and fast PLLs, and extensive clock network options for structured timing and high-performance signal processing (as described in the Stratix II device documentation).
  • High-speed I/O capabilities The Stratix II family documentation provides high-speed I/O specifications, differential I/O options, and on-chip termination features to support demanding interface requirements.
  • Configuration & debug Series documentation details configuration schemes and embedded logic analyzer support for JTAG-based configuration and in-system troubleshooting.
  • Power and operating range Core supply from 1.15 V to 1.25 V and commercial operating temperature range of 0 °C to 85 °C for typical commercial deployment scenarios.
  • Package and mounting 1508-BBGA (FCBGA) package, supplied as 1508-FBGA FC (40×40), surface-mount for board-level integration and high I/O density.
  • RoHS compliance Device is RoHS compliant, supporting regulatory requirements for lead-free manufacturing processes.

Typical Applications

  • Memory interface and buffering Designs that require external memory interfacing and large on-chip buffers can leverage the device’s embedded RAM and documented external memory interface guidance.
  • High-density programmable logic Systems needing significant custom logic capacity—such as protocol processing, control logic, or glue logic—benefit from 90,960 logic elements and abundant LAB resources.
  • Signal processing subsystems Applications that use dedicated DSP circuitry and PLL-based clocking for deterministic timing and processing are supported by the Stratix II architecture features documented for the family.
  • High-pin-count I/O systems Multi-channel and high-throughput designs that require extensive external interfacing can use the device’s 902 I/Os and high-speed I/O capabilities.

Unique Advantages

  • High logic density: 90,960 logic elements enable consolidation of complex functions into a single device, reducing inter-chip routing and system BOM.
  • Substantial embedded memory: Approximately 4.52 Mbits of on-chip RAM supports large buffers, FIFOs, and LUT-based storage close to logic for lower latency.
  • Extensive I/O resources: 902 I/Os provide the pin-bandwidth needed for multi-channel interfaces, parallel buses, and board-level integration without external I/O expanders.
  • Rich family-level features: Stratix II device documentation details DSP blocks, PLLs, high-speed I/O, and configuration/debug capabilities that help accelerate system-level implementations.
  • Commercial-grade readiness: Specified operating range of 0 °C to 85 °C and surface-mount 1508-FBGA footprint align with standard commercial manufacturing and assembly flows.
  • Regulatory-friendly: RoHS compliance supports lead-free production processes and broader regulatory acceptance.

Why Choose EP2S90F1508C4N?

The EP2S90F1508C4N combines a high-count logic fabric with multi-megabit embedded memory and expansive I/O in a single 1508-BBGA package, making it suitable for commercial designs that require dense programmable logic, substantial on-chip storage, and broad external connectivity. Its Stratix II architecture elements—such as DSP blocks, PLLs, and documented high-speed I/O options—provide the architectural building blocks needed for complex signal processing and interface-centric designs.

This device is a strong fit for teams seeking to consolidate functionality, reduce board-level complexity, and leverage Stratix II family documentation for configuration, timing, and high-speed interface implementation. Its commercial-grade temperature range, surface-mount package, and RoHS compliance support typical production workflows and regulatory requirements.

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