EP2S90F1508I4
| Part Description |
Stratix® II Field Programmable Gate Array (FPGA) IC 902 4520488 90960 1508-BBGA, FCBGA |
|---|---|
| Quantity | 1,263 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 1508-FBGA, FC (40x40) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1508-BBGA, FCBGA | Number of I/O | 902 | Voltage | 1.15 V - 1.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 4548 | Number of Logic Elements/Cells | 90960 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 4520488 |
Overview of EP2S90F1508I4 – Stratix® II FPGA IC, 902 I/O, ~4.52 Mbits RAM, 90,960 Logic Elements (1508-BBGA)
The EP2S90F1508I4 is a Stratix® II field-programmable gate array designed for high-density, industrial-grade digital logic integration. It combines a large logic fabric with substantial embedded memory and a high pin count to support complex signal processing, external memory interfaces, and dense I/O subsystems.
Built for applications that require scalable logic capacity and robust operating ranges, the device delivers 90,960 logic elements, approximately 4.52 Mbits of embedded memory, and 902 I/O pins in a 1508-BBGA FCBGA surface-mount package.
Key Features
- Large Logic Capacity — 90,960 logic elements to implement complex custom logic, control, and processing functions.
- Embedded Memory — Approximately 4.52 Mbits of on-chip RAM for buffering, FIFOs, and data storage close to the logic fabric.
- High I/O Density — 902 I/O pins to support wide external interfaces and multiple high-speed peripheral connections.
- Flexible Clocking and PLLs — Stratix II family clock-network and PLL architecture supports flexible clock distribution and timing topologies.
- DSP & Signal Processing Blocks — On-device DSP resources for arithmetic-intensive functions and real-time processing (Stratix II architecture).
- Advanced I/O Support — High-speed I/O features, multi-volt I/O capability, and on-chip termination options to ease board-level signaling design.
- Configuration & Debug — JTAG boundary-scan and embedded logic analysis (SignalTap II) support for device configuration and in-system debug.
- Industrial Temperature Grade — Rated for operation from −40°C to 100°C for extended environment use.
- Power Supply Range — Core supply specified from 1.15 V to 1.25 V to match system power rails and regulators.
- Package & Mounting — 1508-BBGA / 1508-FBGA supplier package (40×40), surface-mount device for compact PCB integration.
Typical Applications
- High-performance signal processing — Use the device’s DSP resources and abundant logic elements for FIR/IIR filters, FFTs, and other real-time processing tasks.
- Memory interface controllers — Large logic capacity and high I/O count facilitate external RAM/flash interfacing and custom memory controllers.
- Telecommunications & Networking — Implement protocol processing, packet parsing, and hardware acceleration with the device’s clocking and I/O capabilities.
- Industrial control systems — Industrial temperature range and robust I/O options enable deployment in factory automation, motor control, and instrumentation applications.
Unique Advantages
- High integration density: 90,960 logic elements and substantial embedded memory reduce the need for external logic, simplifying board design.
- Extensive external connectivity: 902 I/O pins accommodate wide parallel buses, multiple serial links, and mixed-signal interfaces on the same device.
- Architectural features for performance: Stratix II clock networks, PLLs, and DSP blocks enable deterministic timing and compute-intensive operations.
- Industrial-ready operation: Rated −40°C to 100°C to support systems deployed in demanding temperature environments.
- Compact system footprint: 1508-BBGA (1508-FBGA, 40×40) surface-mount package balances high pin count with compact PCB area.
- In-system visibility and configuration: JTAG boundary-scan and embedded logic analysis options aid development, configuration, and field diagnostics.
Why Choose EP2S90F1508I4?
The EP2S90F1508I4 positions itself as a high-density Stratix II FPGA option for engineers who require substantial logic resources, large on-chip memory, and a high-count I/O package in an industrial-grade device. Its combination of logic capacity, embedded RAM, advanced I/O features, and Stratix II architectural elements makes it suitable for complex signal-processing, memory-interface, and control applications that demand deterministic timing and significant on-chip resources.
Designed for long-term platform builds, the device’s package, power supply window, and operating temperature range support robust deployment and integration into systems where reliability and scalability are key considerations.
If you need pricing, lead-time, or to request a formal quote for the EP2S90F1508I4, submit an inquiry to obtain availability and commercial details tailored to your project requirements.

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