EP2S90H484C4
| Part Description |
Stratix® II Field Programmable Gate Array (FPGA) IC 308 4520488 90960 484-BBGA, FCBGA |
|---|---|
| Quantity | 985 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 484-HBGA (27x27) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA, FCBGA | Number of I/O | 308 | Voltage | 1.15 V - 1.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 4548 | Number of Logic Elements/Cells | 90960 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 4520488 |
Overview of EP2S90H484C4 – Stratix® II Field Programmable Gate Array (FPGA), 90,960 Logic Elements, 308 I/O, 484-BBGA
The EP2S90H484C4 is a Stratix® II Field Programmable Gate Array (FPGA) offered in a 484-ball BGA package. It provides high logic density and on-chip memory capacity for complex programmable logic implementations where a large number of logic elements and substantial embedded RAM are required.
Designed as a commercial-grade, surface-mount device, this FPGA delivers a combination of logic resources, I/O count, and package density suitable for advanced digital designs within the specified commercial operating range.
Key Features
- Logic Capacity — 90,960 logic elements (cells) to support complex logic integration and large-scale programmable designs.
- Embedded Memory — Approximately 4.52 Mbits of on-chip RAM (4,520,488 total RAM bits) for buffering, state storage, and memory-intensive logic functions.
- I/O Resources — 308 user I/O pins, enabling broad external interfacing and high pin-count connectivity options.
- Package and Mounting — 484-ball BGA package (484-BBGA, FCBGA; supplier package: 484-HBGA, 27×27) in a surface-mount form factor for compact board integration.
- Power — Core voltage supply range of 1.15 V to 1.25 V to match system power rails and design constraints.
- Operating Range — Commercial grade operation from 0 °C to 85 °C, suitable for standard commercial-environment applications.
- Environmental Compliance — RoHS compliant, supporting lead-free manufacturing and regulatory requirements.
Typical Applications
- High-density logic designs — Use the large pool of logic elements and on-chip RAM to implement complex state machines, datapaths, and custom accelerators.
- High I/O interface solutions — 308 I/O pins accommodate multi-channel interfaces and dense peripheral connectivity on compact PCBs.
- Embedded memory-intensive functions — Approximately 4.52 Mbits of embedded RAM supports packet buffering, lookup tables, and local data storage within logic blocks.
Unique Advantages
- Substantial logic density: 90,960 logic elements enable consolidation of large designs into a single device, reducing system BOM complexity.
- Integrated on-chip RAM: Approximately 4.52 Mbits of embedded memory reduces dependence on external memory, improving latency and board-level routing.
- High I/O count: 308 I/O pins provide flexibility for multi-channel or multi-interface systems without additional I/O expanders.
- Compact BGA footprint: 484-ball BGA (27×27 supplier package) balances pin count and board space for dense, surface-mount designs.
- RoHS compliant: Supports lead-free assembly processes and regulatory compliance for commercial products.
Why Choose EP2S90H484C4?
The EP2S90H484C4 positions itself as a high-capacity Stratix II FPGA option for teams that need substantial programmable logic, meaningful on-chip memory, and a high number of I/O in a compact BGA package. Its commercial-grade operating range and RoHS compliance make it suitable for mainstream embedded and digital system designs where increased integration and reduced external component count are priorities.
This device is well suited to design teams focused on consolidating complex digital functions, optimizing board real estate, and leveraging integrated memory to simplify system architecture while operating within standard commercial temperature and power constraints.
If you would like pricing, availability, or a formal quote for EP2S90H484C4, submit a request and our team will respond with details and ordering options.

Date Founded: 1968
Headquarters: Santa Clara, California, USA
Employees: 130,000+
Revenue: $54.23 Billion
Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018