EP2SGX130GF1508C3

The EP2SGX130GF1508C3 is a Stratix® II GX FPGA IC from Intel, delivered in a 1508-BBGA (FCBGA) package for surface-mount applications. It combines a high-capacity logic array with substantial embedded memory and a large I/O count, targeting designs that require dense logic, on-chip RAM, and broad interfacing capability.

As a member of the Stratix II GX family, the device aligns with applications that demand scalable logic performance and advanced transceiver-enabled communications, while offering a commercial-grade operating range and RoHS compliance.

Key Features

• Logic Capacity  Provides 132,540 logic elements suitable for complex programmable logic implementations and large-scale FPGA designs.
• Embedded Memory  Approximately 6.75 Mbits of on-chip RAM to implement FIFOs, dual-port memories, and buffering without external memory for many functions.
• I/O Density  734 I/O pins to support high-pin-count interfaces and multi-channel external connectivity in demanding I/O architectures.
• Stratix II GX Family Transceiver Features  Family-level transceiver capabilities include high-speed serial channels with clock-data recovery, adaptive equalization, programmable pre-emphasis and VOD, and dynamic reconfiguration to support multiple serial protocols and data rates.
• Clocking and DSP Resources  Family features include multiple global and regional clock networks, enhanced PLLs for flexible clocking, and high-speed DSP blocks for multiplier and FIR implementations.
• Package & Mounting  1508‑BBGA (1508‑FBGA, FC, 40×40) surface-mount package appropriate for dense board layouts and automated assembly processes.
• Power Supply  Operates from a core supply in the 1.15 V to 1.25 V range for compatibility with modern low-voltage systems.
• Operating Range & Compliance  Commercial-grade operating temperature from 0 °C to 85 °C and RoHS-compliant manufacturing.

Typical Applications

• High-speed communications  Implement protocol bridging, line cards, and chip-to-chip serialization using the Stratix II GX family’s high-speed transceiver capabilities.
• Backplane and switching systems  Large logic capacity and abundant I/O make the device suitable for switch fabrics and backplane interface logic.
• Memory interface and buffering  Embedded RAM and DSP resources enable on-chip buffering, FIFO management, and data path processing for external memory subsystems.
• Signal processing  DSP blocks and substantial logic resources support FPGA-based signal processing functions such as filtering and accumulation.

Unique Advantages

• High logic density: 132,540 logic elements provide the room needed to implement complex state machines, datapaths, and control logic without partitioning across multiple devices.
• Significant on-chip memory: Approximately 6.75 Mbits of embedded RAM reduces dependence on external memory for many buffering and FIFO requirements.
• Extensive I/O capability: 734 I/Os enable integration of multiple parallel interfaces and high-pin-count system connections from a single FPGA package.
• Family-level high-speed serial support: Stratix II GX transceiver features (CDR, programmable VOD and pre-emphasis, adaptive equalization) support robust serial links and protocol flexibility.
• Flexible clocking and DSP support: On-device PLLs, global/regional clock networks, and DSP blocks facilitate complex timing architectures and high-performance math operations.
• Commercial-grade & RoHS-compliant: Designed for standard commercial-temperature deployments with environmental compliance for streamlined procurement.

Why Choose EP2SGX130GF1508C3?

The EP2SGX130GF1508C3 delivers a balance of high logic capacity, sizeable embedded memory, and very large I/O count in a compact 1508‑BBGA package. As part of the Stratix II GX family, it provides a platform that supports sophisticated clocking, DSP acceleration, and family-level transceiver technologies for high-speed serial communications.

This combination makes the device well suited for designers building advanced communications, backplane interface, and data-processing systems that require scalable logic resources, on-chip memory for buffering, and the flexibility to implement multiple high-pin-count interfaces within a single FPGA.

Request a quote or submit an inquiry to evaluate EP2SGX130GF1508C3 for your design and obtain pricing and availability information.