EP2SGX30CF780C3

IC FPGA 361 I/O 780FBGA
Part Description

Stratix® II GX Field Programmable Gate Array (FPGA) IC 361 1369728 33880 780-BBGA

Quantity 716 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package780-FBGA (29x29)GradeCommercialOperating Temperature0°C – 85°C
Package / Case780-BBGANumber of I/O361Voltage1.15 V - 1.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1694Number of Logic Elements/Cells33880
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits1369728

Overview of EP2SGX30CF780C3 – Stratix® II GX FPGA, 33,880 logic elements

The EP2SGX30CF780C3 is an Intel Stratix® II GX Field Programmable Gate Array (FPGA) in a 780-ball BGA package intended for commercial applications. It delivers a high-density logic array and substantial embedded memory, built on the Stratix II GX architecture described in the device datasheet.

Designed for high-performance digital designs, the device is suitable for applications that benefit from scalable logic resources, on-chip memory, and the Stratix II GX family’s high-speed serial capabilities as described in the datasheet.

Key Features

  • Logic Density  Approximately 33,880 logic elements to implement complex digital functions and custom logic.
  • Embedded Memory  Approximately 1.37 Mbits of on-chip RAM for FIFOs, buffers, and application memory needs.
  • I/O Resources  361 general I/O pins to support a wide variety of external interfaces and board-level connectivity.
  • Stratix II GX Architecture  Built on the Stratix II GX device family which includes high-speed serial transceiver technology and advanced architecture elements described in the datasheet.
  • Low-Voltage Core  Core voltage supply range of 1.15 V to 1.25 V to match system power rail requirements.
  • Package & Mounting  780-ball BGA (780-BBGA) with supplier device package specified as 780-FBGA (29×29); surface-mount package suitable for compact board layouts.
  • Operating Range  Commercial grade operation from 0 °C to 85 °C for typical commercial environments.
  • Standards & Compliance  RoHS compliant, supporting regulatory and environmental requirements for lead-free assembly.
  • Family-Level High-Speed Features  Stratix II GX devices include high-speed serial transceivers with data rates up to 6.375 Gbps and advanced transceiver features as described in the datasheet.

Typical Applications

  • High-speed communications equipment  Leverages the Stratix II GX family’s serial transceiver capabilities and on-chip memory for protocol bridging and packet processing.
  • Backplane and board-to-board interfaces  Suitable for high-speed backplane interface designs that require significant logic density and numerous I/O.
  • Chip-to-chip bridging  Provides programmable logic and memory resources to implement custom interface logic and real-time data handling between chips.
  • Custom accelerator and DSP functions  On-chip memory and the Stratix II GX architecture support implementation of DSP blocks and custom processing pipelines described in the device family documentation.

Unique Advantages

  • Substantial logic capacity:  Approximately 33,880 logic elements enable implementation of complex state machines, protocol stacks, and custom accelerators on a single device.
  • Significant embedded memory:  Approximately 1.37 Mbits of on-chip RAM reduces external memory needs for many buffering and FIFO requirements.
  • High I/O count:  361 I/O pins provide flexibility to interface with multiple peripherals and bus architectures without large external glue logic.
  • Stratix II GX family capabilities:  Family-level support for high-speed serial transceivers and advanced architecture features provides design flexibility for high-bandwidth links (as described in the datasheet).
  • Compact, surface-mount package:  780-ball BGA (29×29) package supports dense board layouts while maintaining the device’s thermal and electrical characteristics.
  • RoHS compliant and commercial grade:  Meets lead-free assembly requirements and is specified for 0 °C to 85 °C commercial operation.

Why Choose EP2SGX30CF780C3?

The EP2SGX30CF780C3 combines substantial logic resources, meaningful on-chip memory, and extensive I/O in a Stratix II GX device package. It is well suited to designers who need programmable capacity for protocol handling, data buffering, and custom processing within commercial temperature environments and with low-voltage core requirements.

Choosing this part gives access to the Stratix II GX device family features documented in the datasheet, enabling designs that require programmable high-speed link support, integrated memory resources, and a compact BGA footprint for space-constrained boards.

Request a quote or submit an inquiry to receive pricing and availability for EP2SGX30CF780C3 and to discuss how this FPGA can fit your design requirements.

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